KR920007786B1 - 전계효과형 트랜지스터의 제조방법 - Google Patents
전계효과형 트랜지스터의 제조방법 Download PDFInfo
- Publication number
- KR920007786B1 KR920007786B1 KR1019840008292A KR840008292A KR920007786B1 KR 920007786 B1 KR920007786 B1 KR 920007786B1 KR 1019840008292 A KR1019840008292 A KR 1019840008292A KR 840008292 A KR840008292 A KR 840008292A KR 920007786 B1 KR920007786 B1 KR 920007786B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- annealing
- plasma
- manufacturing
- silicon nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6731—Top-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/694—Inorganic materials composed of nitrides
- H10P14/6943—Inorganic materials composed of nitrides containing silicon
- H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/94—Hydrogenation or deuterisation, e.g. using atomic hydrogen from a plasma
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
Landscapes
- Formation Of Insulating Films (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP83-248972 | 1983-12-24 | ||
| JP58248972A JPS60136259A (ja) | 1983-12-24 | 1983-12-24 | 電界効果型トランジスタの製造方法 |
| JP58-248972 | 1983-12-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR850005163A KR850005163A (ko) | 1985-08-21 |
| KR920007786B1 true KR920007786B1 (ko) | 1992-09-17 |
Family
ID=17186123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019840008292A Expired KR920007786B1 (ko) | 1983-12-24 | 1984-12-24 | 전계효과형 트랜지스터의 제조방법 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS60136259A (https=) |
| KR (1) | KR920007786B1 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6284562A (ja) * | 1985-10-08 | 1987-04-18 | Seiko Epson Corp | 半導体装置とその製造方法 |
| JPS62204575A (ja) * | 1986-03-05 | 1987-09-09 | Matsushita Electric Ind Co Ltd | 薄膜半導体装置およびその製造方法 |
| JP2865284B2 (ja) * | 1986-03-10 | 1999-03-08 | 松下電器産業株式会社 | 薄膜半導体デバイス |
| JPH0750737B2 (ja) * | 1987-03-02 | 1995-05-31 | 日本電気株式会社 | 半導体装置の製造方法 |
| JP2802618B2 (ja) * | 1987-03-26 | 1998-09-24 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
| JP2764395B2 (ja) * | 1987-04-20 | 1998-06-11 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
| JPS6432678A (en) * | 1987-07-28 | 1989-02-02 | Ricoh Kk | Thin-film transistor |
| JP2589327B2 (ja) * | 1987-11-14 | 1997-03-12 | 株式会社リコー | 薄膜トランジスタの製造方法 |
| JP2712433B2 (ja) * | 1988-12-07 | 1998-02-10 | 富士ゼロックス株式会社 | 逆スタガード型薄膜トランジスタの製造方法 |
| JP2894391B2 (ja) * | 1991-09-20 | 1999-05-24 | 三菱電機株式会社 | 薄膜トランジスタおよびその製造方法 |
| JPH05218430A (ja) * | 1992-02-07 | 1993-08-27 | G T C:Kk | 多結晶シリコン薄膜トランジスタおよびその製造方法 |
| US5440168A (en) * | 1993-02-22 | 1995-08-08 | Ryoden Semiconductor System Engineering Corporation | Thin-film transistor with suppressed off-current and Vth |
| US5719065A (en) | 1993-10-01 | 1998-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device with removable spacers |
| JP2899960B2 (ja) * | 1996-12-09 | 1999-06-02 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
| JP2899959B2 (ja) * | 1996-12-09 | 1999-06-02 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
| JP5057605B2 (ja) * | 1999-03-17 | 2012-10-24 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3989761B2 (ja) | 2002-04-09 | 2007-10-10 | 株式会社半導体エネルギー研究所 | 半導体表示装置 |
| US7038239B2 (en) | 2002-04-09 | 2006-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| US7256421B2 (en) | 2002-05-17 | 2007-08-14 | Semiconductor Energy Laboratory, Co., Ltd. | Display device having a structure for preventing the deterioration of a light emitting device |
| US7629236B2 (en) | 2004-08-26 | 2009-12-08 | Alliance For Sustainable Energy, Llc | Method for passivating crystal silicon surfaces |
| JP2007242895A (ja) | 2006-03-08 | 2007-09-20 | Mitsubishi Electric Corp | 薄膜トランジスタ装置及びその製造方法 |
| JP5172178B2 (ja) | 2007-03-15 | 2013-03-27 | 三菱電機株式会社 | 薄膜トランジスタ、それを用いた表示装置、及びそれらの製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5550663A (en) * | 1978-10-07 | 1980-04-12 | Shunpei Yamazaki | Semiconductor device and method of fabricating the same |
| JPS57169248A (en) * | 1981-04-13 | 1982-10-18 | Oki Electric Ind Co Ltd | Manufacture of semiconductor integrated circuit device |
| JPS5884466A (ja) * | 1981-11-13 | 1983-05-20 | Canon Inc | 半導体素子 |
| JPS59136926A (ja) * | 1983-01-25 | 1984-08-06 | Seiko Epson Corp | 半導体装置の製法 |
| JPH0338755A (ja) * | 1989-07-05 | 1991-02-19 | Nec Corp | ファイル転送システム |
-
1983
- 1983-12-24 JP JP58248972A patent/JPS60136259A/ja active Granted
-
1984
- 1984-12-24 KR KR1019840008292A patent/KR920007786B1/ko not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0457098B2 (https=) | 1992-09-10 |
| KR850005163A (ko) | 1985-08-21 |
| JPS60136259A (ja) | 1985-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR920007786B1 (ko) | 전계효과형 트랜지스터의 제조방법 | |
| US5162892A (en) | Semiconductor device with polycrystalline silicon active region and hydrogenated passivation layer | |
| KR100191091B1 (ko) | 박막 반도체 장치와 그 제조방법 | |
| US4161743A (en) | Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat | |
| US5766344A (en) | Method for forming a semiconductor | |
| US6028326A (en) | Thin film transistor including a catalytic element for promoting crystallization of a semiconductor film | |
| US6815717B2 (en) | Thin-film transistor and method of manufacturing the same | |
| JPS60245173A (ja) | 絶縁ゲイト型半導体装置 | |
| KR20050004758A (ko) | 박막 트랜지스터 및 그 제조 방법 | |
| CN108987279A (zh) | 薄膜晶体管的制造方法 | |
| JPH0422120A (ja) | 薄膜半導体装置の製造方法 | |
| JPH02228042A (ja) | 薄膜半導体装置の製造方法 | |
| EP0152624A2 (en) | Method of manufacturing a semiconductor device having a polycristalline silicon-active region. | |
| GB2167899A (en) | Method of manufacturing thin film transistors | |
| JPS6276772A (ja) | 電界効果型トランジスタの製造方法 | |
| JP2508601B2 (ja) | 電界効果型薄膜トランジスタ | |
| JP2740275B2 (ja) | 薄膜トランジスタ | |
| JPH06275650A (ja) | 電界効果トランジスタの製造方法 | |
| JP3426063B2 (ja) | 液晶表示装置及びその製造方法 | |
| JP2811763B2 (ja) | 絶縁ゲート型電界効果トランジスタの製造方法 | |
| JP3173757B2 (ja) | 半導体装置の作製方法 | |
| JPH0656856B2 (ja) | 半導体装置の製造方法 | |
| JP3426163B2 (ja) | 液晶表示装置 | |
| JPH0661489A (ja) | 薄膜トランジスタの製造方法 | |
| JP3426164B2 (ja) | 液晶表示装置の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19841224 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19890510 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19841224 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19920314 Patent event code: PE09021S01D |
|
| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
Comment text: Decision on Publication of Application Patent event code: PG16051S01I Patent event date: 19920819 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19921217 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19921223 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 19921223 End annual number: 3 Start annual number: 1 |
|
| PR1001 | Payment of annual fee |
Payment date: 19940923 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 19950925 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 19961023 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 19970828 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 19980918 Start annual number: 8 End annual number: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 19990915 Start annual number: 9 End annual number: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20001017 Start annual number: 10 End annual number: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20020821 Start annual number: 11 End annual number: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20030814 Start annual number: 12 End annual number: 12 |
|
| FPAY | Annual fee payment |
Payment date: 20040819 Year of fee payment: 13 |
|
| PR1001 | Payment of annual fee |
Payment date: 20040819 Start annual number: 13 End annual number: 13 |
|
| EXPY | Expiration of term | ||
| PC1801 | Expiration of term |