KR920001768A - 헤테로인터페이스를 가진 전계효과 트랜지스터 - Google Patents
헤테로인터페이스를 가진 전계효과 트랜지스터 Download PDFInfo
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- KR920001768A KR920001768A KR1019910008789A KR910008789A KR920001768A KR 920001768 A KR920001768 A KR 920001768A KR 1019910008789 A KR1019910008789 A KR 1019910008789A KR 910008789 A KR910008789 A KR 910008789A KR 920001768 A KR920001768 A KR 920001768A
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- 239000004065 semiconductor Substances 0.000 claims 30
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 원리에 따른 p-채널 전계효과 트랜지스터의 정면 단면도
제2도및 제3도는 제1도에 도시된 전계효과 트랜지스터의 특정 실시예에 대한 에너지 밴드 다이어그램.
Claims (10)
- 제 2 및 제 3 반도체 영역(18)사이에 측방향으로 배치된 제 1 반도체 영역을 가진 전계효과 트랜지스터로서, 상기 제 1 반도체 영역은, 제 1 전도성 타입, 제 1 에너지 밴드갭, 제 1 도핑 농도를 가진 제 1 반도체 층(15)을 구비하며, 상기 제 2 및 제 3 반도체 영역(18)상에 도통 채널을 형성하는 제 2 반도체층(12)을 구비하며, 여기서 상기 제 2 및 제 3반도체 영역(18)은 각각 상기 제 1전도성 타입과 반대인 제 2 전도성 타입을 가지며, 상기 제2 반도체층(12)은 상기 제 2 전도성 타입 및 제 2 에너지 밴드 갭을 가지며, 상기 제 2 전도성 타입은상기 제 1 전도성 타입과 반대이며, 상기 제 1 에너지 밴드 갭은 상기 제 2에너지 밴드 갭보다 크고, 상기 제 1 및 제 2반도체층(15,12)은 제 1 헤테로 접합 인터페이스를 가져서 상기 도통 채널이 상기 제 1 헤테로접합 인터페이스 아래에 형성되며, 상기 제 1 반도체 층(15)내에 상기 제1 헤테로접합 인터페이스 근처에 형성된 전하 시트(14)를 구비하며, 상기 전하 시트는 상기 제 1 전도성 타입 및 상기 제 1 도핑 농도보다 상당히 큰 제 2도핑 농도를 가지며, 상기 제 1 전도성 타입 및 상기 제 1 에너지 밴드 갭과 사실상 동일한 제 3 에너지 밴드갭을 가진 제 3 반도체층(11)을 구비하며, 상기 제 2 및 제 3반도체 층은 인터페이스를 갖는 전계효과 트랜지스터.
- 제 2 및 제 3반도체 영역(18)사이에 측방향으로 배치된 제 1반도체 영역을 가진 전계효과 트랜지스터로서, 상기 제 1반도체 영역은, 제 1전도성 타입, 제 1에너지 밴드갭, 제 1도핑 농도를 가진 제 1 반도체 층(15)을 구비하며, 제 2전도성 타입 및 제 2에너지 밴드갭을 가진 제 2반도체 층(12)을 구비하며, 여기서 상기 제 2전도성타입은 상기 제 1 전도성 타입과 반대이고, 상기 제 1 에너지 밴드갭은 상기 제 2 에너지 밴드갭 보다 크며, 상기 제 2 에너지 밴드갭 보다 작은 제 3에너지 밴드갭을 가진 상기 제 2 반도체층(12)내에 형성된 양자우물(13)을 구비하며, 여기서 상기 양자 우물(13)은 상기 제 1 및 제 2 반도체 층(15,12)사이에 제 1 및 제 2헤테로접합 인터페이스를 각각 가지며, 상기 제 2 반도체 층(12)은 상기 양자우물(13)과 결합하여 상기 제 2 및 제 3 반도체 영역(18)사이에 도통 채널을 형성시켜서 상기 도통 채널이 상기 제1헤테로 접합 인터페이스 아래에 형성되며 상기 제 2 및 제 3 반도체 영역(18) 각각은 상기 제 2전도성 타입을 가지며, 상기 제 1 반도체층(15)내에 상기 제 1 헤테로접합 인터페이스 근처에 형성된 전하 시트(14)를 구비하며, 상기 전하 시트는 상기 제 1 전도성 타입 및 상기 제1도핑 농도보다 상당히 큰 제 2 도핑 농도를 가지며, 상기 제 1 전도성 타입 및 제 4에너지 밴드갭을 가진 제 3반도체 층(11)을 구비하며, 상기 제 4에너지 밴드 갭은 상기 제 1에너지 밴드갭과 사실상 동일하며, 상기 제 2 및 제 3반도체 층은 인터페이스를 갖는 전계효과 트랜지스터.
- 제 1항 또는 2항에 있어서, 상기 전하 시트 (14)는 상기 제 1헤테로접합 인터페이스로부터 100A이내에 있는 전계효과 트랜지스터.
- 제 3항에 있어서, 상기 전하 시트(14)는 대략 1017/㎤ 내지 1019/㎤ 범위내의 도핑 농도를 갖는 전계효과 트랜지스터.
- 제 4항에 있어서, 상기 제 2반도체 층(12)은 p-형 전도성 타입인 전계효과 트랜지스터.
- 제 5항에 있어서, 상기 전하 시트(14)는 대략 5×1018/㎤의 도너 도핑 농도를 갖는 전계효과 트랜지스터.
- 제6항에 있어서, 상기 제 1, 제 2 및 제 3반도체 영역(18)에 각각 접촉되는 제 1(21), 제 2(40) 및 제 3 (19)전기적 접촉부를 더 구비하는 전계효과 트랜지스터.
- 제 4항에 있어서, 상기 제 3 반도체 층(11)에 접촉되는 제 4 전기적 접촉부 (20)를 더 구비하는 전계효과 트랜지스터.
- 제8항에 있어서, 상기 제1, 제2 및 제3층(15,12,11)및 상기 양자우물(13)은 Ⅲ-Ⅴ족 반도체 또는 Ⅱ-Ⅳ족 반도체에서 선택되는 전계효과 트랜지스터.
- 제9항에 있어서, 상기 양자우물(13)은 InGaAs이며, 상기 제 1, 제 2, 제 3 반도체 층(15,12,11)은 AlGaAs인 전계효과 트랜지스터.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/533,636 US5111255A (en) | 1990-06-05 | 1990-06-05 | Buried channel heterojunction field effect transistor |
US533,636 | 1990-06-05 |
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Publication Number | Publication Date |
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KR920001768A true KR920001768A (ko) | 1992-01-30 |
KR100204688B1 KR100204688B1 (ko) | 1999-07-01 |
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Application Number | Title | Priority Date | Filing Date |
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KR1019910008789A KR100204688B1 (ko) | 1990-06-05 | 1991-05-29 | 헤테로 인터페이스를 가진 전계효과 트랜지스터 |
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Country | Link |
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US (1) | US5111255A (ko) |
EP (1) | EP0460793B1 (ko) |
JP (1) | JP2500063B2 (ko) |
KR (1) | KR100204688B1 (ko) |
CA (1) | CA2039415C (ko) |
DE (1) | DE69102351T2 (ko) |
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US5223723A (en) * | 1990-10-19 | 1993-06-29 | At&T Bell Laboratories | Light emitting device |
JPH04291304A (ja) * | 1991-03-20 | 1992-10-15 | Fujitsu Ltd | 光導波路および光信号の制御方法 |
US5298441A (en) * | 1991-06-03 | 1994-03-29 | Motorola, Inc. | Method of making high transconductance heterostructure field effect transistor |
US5329137A (en) * | 1991-07-17 | 1994-07-12 | The United States Of America As Represented By The Secretary Of The Air Force | Integrated total internal reflection optical switch utilizing charge storage in a quantum well |
JP2722885B2 (ja) * | 1991-09-05 | 1998-03-09 | 三菱電機株式会社 | 電界効果トランジスタ |
FR2690286A1 (fr) * | 1992-04-17 | 1993-10-22 | Commissariat Energie Atomique | Cavité laser à hétérostructure semi-conductrice dissymétrique et laser équipé de cette cavité. |
US5323030A (en) * | 1993-09-24 | 1994-06-21 | The United States Of America As Represented By The Secretary Of The Army | Field effect real space transistor |
GB2306773B (en) * | 1995-10-20 | 1999-01-27 | Toshiba Cambridge Res Center | Optical modulator |
GB2316533B (en) * | 1996-08-16 | 1999-05-26 | Toshiba Cambridge Res Center | Semiconductor device |
GB2362506A (en) | 2000-05-19 | 2001-11-21 | Secr Defence | Field effect transistor with an InSb quantum well and minority carrier extraction |
FR2818012B1 (fr) * | 2000-12-12 | 2003-02-21 | St Microelectronics Sa | Dispositif semi-conducteur integre de memoire |
US6479844B2 (en) * | 2001-03-02 | 2002-11-12 | University Of Connecticut | Modulation doped thyristor and complementary transistor combination for a monolithic optoelectronic integrated circuit |
US6534822B1 (en) * | 2001-07-17 | 2003-03-18 | Advanced Micro Devices, Inc. | Silicon on insulator field effect transistor with a double Schottky gate structure |
US6825506B2 (en) * | 2002-11-27 | 2004-11-30 | Intel Corporation | Field effect transistor and method of fabrication |
US7385230B1 (en) | 2005-02-08 | 2008-06-10 | The University Of Connecticut | Modulation doped thyristor and complementary transistor combination for a monolithic optoelectronic integrated circuit |
US20130032860A1 (en) * | 2011-08-01 | 2013-02-07 | Fabio Alessio Marino | HFET with low access resistance |
US9029956B2 (en) | 2011-10-26 | 2015-05-12 | Global Foundries, Inc. | SRAM cell with individual electrical device threshold control |
US9048136B2 (en) | 2011-10-26 | 2015-06-02 | GlobalFoundries, Inc. | SRAM cell with individual electrical device threshold control |
US9263522B2 (en) * | 2013-12-09 | 2016-02-16 | Qualcomm Incorporated | Transistor with a diffusion barrier |
WO2017047059A1 (en) * | 2015-09-14 | 2017-03-23 | Sumitomo Electric Industries, Ltd. | Semiconductor laser |
KR102446671B1 (ko) * | 2016-01-08 | 2022-09-23 | 삼성전자주식회사 | 비대칭 활성 영역을 포함하는 반도체 소자 및 그의 형성 방법 |
US10082918B2 (en) * | 2016-11-08 | 2018-09-25 | International Business Machines Corporation | In-cell capacitive touch and fingerprint detector |
US11749965B2 (en) * | 2020-07-14 | 2023-09-05 | National Taiwan University | Transistor for emitting laser with a fixed frequency |
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DE3279663D1 (en) * | 1981-06-17 | 1989-06-01 | Hitachi Ltd | Heterojunction semiconductor device |
US4860068A (en) * | 1982-08-13 | 1989-08-22 | American Telephone And Telegraph Company, At&T Bell Laboratories | Semiconductor devices and methods of making such devices |
JPS5963770A (ja) * | 1982-10-05 | 1984-04-11 | Agency Of Ind Science & Technol | 半導体装置 |
JPS59111371A (ja) * | 1982-12-16 | 1984-06-27 | Nippon Telegr & Teleph Corp <Ntt> | 電界効果トランジスタ |
US4590502A (en) * | 1983-03-07 | 1986-05-20 | University Of Illinois | Camel gate field effect transistor device |
JPS6012775A (ja) * | 1983-07-02 | 1985-01-23 | Agency Of Ind Science & Technol | 電界効果トランジスタ |
JPS6035577A (ja) * | 1983-08-08 | 1985-02-23 | Agency Of Ind Science & Technol | 電界効果型トランジスタ |
US4558337A (en) * | 1984-05-30 | 1985-12-10 | Texas Instruments Inc. | Multiple high electron mobility transistor structures without inverted heterojunctions |
US4800415A (en) * | 1984-09-21 | 1989-01-24 | American Telephone And Telegraph Company, At&T Bell Laboratories | Bipolar inversion channel device |
US4686550A (en) * | 1984-12-04 | 1987-08-11 | American Telephone And Telegraph Company, At&T Bell Laboratories | Heterojunction semiconductor devices having a doping interface dipole |
GB2172742B (en) * | 1985-03-21 | 1988-08-24 | Stc Plc | Photoconductor |
US4806997A (en) * | 1985-06-14 | 1989-02-21 | AT&T Laboratories American Telephone and Telegraph Company | Double heterostructure optoelectronic switch |
GB2189345A (en) * | 1986-04-16 | 1987-10-21 | Philips Electronic Associated | High mobility p channel semi conductor devices |
JPH07120782B2 (ja) * | 1987-06-22 | 1995-12-20 | 日本電気株式会社 | 半導体装置 |
FR2619250B1 (fr) * | 1987-08-05 | 1990-05-11 | Thomson Hybrides Microondes | Transistor hyperfrequence a double heterojonction |
EP0312237A3 (en) * | 1987-10-13 | 1989-10-25 | AT&T Corp. | Interface charge enhancement in delta-doped heterostructure |
JPH0682691B2 (ja) * | 1987-11-12 | 1994-10-19 | 松下電器産業株式会社 | 電界効果型トランジスタ |
-
1990
- 1990-06-05 US US07/533,636 patent/US5111255A/en not_active Expired - Lifetime
-
1991
- 1991-03-28 DE DE69102351T patent/DE69102351T2/de not_active Expired - Fee Related
- 1991-03-28 EP EP19910302816 patent/EP0460793B1/en not_active Expired - Lifetime
- 1991-03-28 CA CA 2039415 patent/CA2039415C/en not_active Expired - Fee Related
- 1991-05-29 KR KR1019910008789A patent/KR100204688B1/ko not_active IP Right Cessation
- 1991-06-04 JP JP15948691A patent/JP2500063B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA2039415A1 (en) | 1991-12-06 |
US5111255A (en) | 1992-05-05 |
DE69102351D1 (de) | 1994-07-14 |
EP0460793B1 (en) | 1994-06-08 |
KR100204688B1 (ko) | 1999-07-01 |
DE69102351T2 (de) | 1995-04-06 |
JP2500063B2 (ja) | 1996-05-29 |
EP0460793A1 (en) | 1991-12-11 |
CA2039415C (en) | 1996-07-16 |
JPH04230042A (ja) | 1992-08-19 |
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