KR900005895B1 - 세라믹 회로기판 제조방법 - Google Patents

세라믹 회로기판 제조방법 Download PDF

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Publication number
KR900005895B1
KR900005895B1 KR1019870014389A KR870014389A KR900005895B1 KR 900005895 B1 KR900005895 B1 KR 900005895B1 KR 1019870014389 A KR1019870014389 A KR 1019870014389A KR 870014389 A KR870014389 A KR 870014389A KR 900005895 B1 KR900005895 B1 KR 900005895B1
Authority
KR
South Korea
Prior art keywords
titanate
ceramic
paste composition
copper
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870014389A
Other languages
English (en)
Korean (ko)
Other versions
KR880008724A (ko
Inventor
히또시 스즈끼
히로미쓰 요꼬야마
미네하루 쓰가다
히로미 오가와
노부오 가메하라
고이찌 니와
Original Assignee
후지쓰 가부시끼가이샤
야마모도 다꾸마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰 가부시끼가이샤, 야마모도 다꾸마 filed Critical 후지쓰 가부시끼가이샤
Publication of KR880008724A publication Critical patent/KR880008724A/ko
Application granted granted Critical
Publication of KR900005895B1 publication Critical patent/KR900005895B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1019870014389A 1986-12-17 1987-12-17 세라믹 회로기판 제조방법 Expired KR900005895B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP29888986 1986-12-17
JP86-298889 1986-12-17
JP61-298889 1986-12-17

Publications (2)

Publication Number Publication Date
KR880008724A KR880008724A (ko) 1988-08-31
KR900005895B1 true KR900005895B1 (ko) 1990-08-13

Family

ID=17865474

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870014389A Expired KR900005895B1 (ko) 1986-12-17 1987-12-17 세라믹 회로기판 제조방법

Country Status (7)

Country Link
US (1) US5015314A (enExample)
EP (1) EP0272129B1 (enExample)
JP (1) JPS63271995A (enExample)
KR (1) KR900005895B1 (enExample)
AU (1) AU584533B2 (enExample)
CA (1) CA1273853C (enExample)
DE (1) DE3789369T2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02152105A (ja) * 1988-12-01 1990-06-12 Fujitsu Ltd 導電材料およびその製造方法
US4953273A (en) * 1989-05-25 1990-09-04 American Technical Ceramics Corporation Process for applying conductive terminations to ceramic components
WO1991004650A1 (fr) * 1989-09-19 1991-04-04 Fujitsu Limited Composition ceramique de formation d'interconnexions
JP2584911B2 (ja) * 1991-06-18 1997-02-26 富士通株式会社 ガラス−セラミック多層回路基板の製造方法
US5925443A (en) * 1991-09-10 1999-07-20 International Business Machines Corporation Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
US5372749A (en) * 1992-02-19 1994-12-13 Beijing Technology Of Printing Research Institute Chinese Method for surface treating conductive copper powder with a treating agent and coupler
DE4227085A1 (de) * 1992-08-17 1994-02-24 Bosch Gmbh Robert Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger Schichten
JP3015621B2 (ja) * 1993-05-10 2000-03-06 松下電器産業株式会社 導体ペ−スト組成物
JPH07142822A (ja) * 1993-09-20 1995-06-02 Fujitsu Ltd 回路基板及びその製造方法
US5662755A (en) * 1993-10-15 1997-09-02 Matsushita Electric Industrial Co., Ltd. Method of making multi-layered ceramic substrates
DE69530651T2 (de) * 1994-10-31 2004-03-25 Tdk Corp. Herstellungsverfahren von keramischen elektronischen Komponenten und Vorrichtung zur Herstellung
US6376054B1 (en) * 1999-02-10 2002-04-23 International Business Machines Corporation Surface metallization structure for multiple chip test and burn-in
KR100497824B1 (ko) * 2002-07-19 2005-07-01 상 추엔 웨이팅 머신 컴패니 리미티드 단련된 유리회로보드의 제조방법
JP6369560B2 (ja) * 2015-04-17 2018-08-08 株式会社村田製作所 セラミック配線基板およびセラミック配線基板の製造方法
JP2019041022A (ja) * 2017-08-25 2019-03-14 日本特殊陶業株式会社 配線基板の製造方法及び導電ペースト
CN110248465B (zh) * 2019-06-20 2024-03-19 上海铠琪科技有限公司 一种厚膜和覆铜一体陶瓷电路板及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2981367A (en) * 1967-11-14 1969-05-22 Joseph Lucas (Industries) Limited Methods of preparing articles comprising ceramic bodies with electrical circuits thereon
JPS6058268B2 (ja) * 1981-10-29 1985-12-19 藤倉化成株式会社 導電性銅ペ−スト組成物
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
US4503090A (en) * 1983-02-23 1985-03-05 At&T Bell Laboratories Thick film resistor circuits
JPS59155988A (ja) * 1983-02-25 1984-09-05 住友金属鉱山株式会社 厚膜導電ペ−ストの製造方法
US4594181A (en) * 1984-09-17 1986-06-10 E. I. Du Pont De Nemours And Company Metal oxide-coated copper powder
US4599277A (en) * 1984-10-09 1986-07-08 International Business Machines Corp. Control of the sintering of powdered metals
JPS61155243A (ja) * 1984-12-28 1986-07-14 富士通株式会社 グリ−ンシ−ト組成物
US4772346A (en) * 1986-02-14 1988-09-20 International Business Machines Corporation Method of bonding inorganic particulate material

Also Published As

Publication number Publication date
CA1273853A (en) 1990-09-11
EP0272129A3 (en) 1990-01-31
EP0272129B1 (en) 1994-03-16
KR880008724A (ko) 1988-08-31
DE3789369D1 (de) 1994-04-21
US5015314A (en) 1991-05-14
JPS63271995A (ja) 1988-11-09
AU584533B2 (en) 1989-05-25
AU8254887A (en) 1988-06-23
DE3789369T2 (de) 1994-06-23
JPH0563110B2 (enExample) 1993-09-09
EP0272129A2 (en) 1988-06-22
CA1273853C (en) 1990-09-11

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