KR890011109A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

Info

Publication number
KR890011109A
KR890011109A KR1019880016970A KR880016970A KR890011109A KR 890011109 A KR890011109 A KR 890011109A KR 1019880016970 A KR1019880016970 A KR 1019880016970A KR 880016970 A KR880016970 A KR 880016970A KR 890011109 A KR890011109 A KR 890011109A
Authority
KR
South Korea
Prior art keywords
band
anode
semiconductor device
high resistivity
lattice defect
Prior art date
Application number
KR1019880016970A
Other languages
English (en)
Other versions
KR910009035B1 (ko
Inventor
가즈시 도미이
도시로오 아베
다꾸야 고모다
Original Assignee
미요시 도시오
마쓰시다 덴꼬오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62322336A external-priority patent/JP2617497B2/ja
Priority claimed from JP63100603A external-priority patent/JPH0671078B2/ja
Application filed by 미요시 도시오, 마쓰시다 덴꼬오 가부시끼가이샤 filed Critical 미요시 도시오
Publication of KR890011109A publication Critical patent/KR890011109A/ko
Application granted granted Critical
Publication of KR910009035B1 publication Critical patent/KR910009035B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/74Thyristor-type devices, e.g. having four-zone regenerative action
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/083Anode or cathode regions of thyristors or gated bipolar-mode devices
    • H01L29/0834Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/30Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
    • H01L29/32Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being within the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Thyristors (AREA)

Abstract

내용 없음

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 스태틱 유도형 다이리스터로서 본 발명의 일실시예 반도체 장치의 단면도.
제2a도는 제1도 반도체 장치의 격자결함분포와 불순물분포를 보여주는 도.
제2b도는 격자결함대가 애노드대 외각에 위치된 경우에 비교 반도체 장치의 격자결함분포와 불순물분포를 보여주는 도.

Claims (6)

  1. 장치의 일측에 형성되며 고불순물 농도대를 갖는 애노드대, 장치의 반대편에 형성되며 고불순물 농도대를 갖는 캐소드대, 애노드대와 캐소드대 사이를 형성되며 전류로로서 동작을 하는 저불순물 농도대를 갖는 높은 고유저항대, 및 캐리어 수명을 짧게 하는 상대적으로 저농도의 애노드대내에 있는 격자결함대로 구성되는 것을 특징으로 하는 반도체 장치.
  2. 제1항에 있어서, 격자결함대는 상기 애노드대 내에 높은 고유저항대에 근접하여 형성되는 것이 특징인 반도체 장치.
  3. 제1항에 있어서, 더욱이 애노드대와 근접하여 위치된 높은 고유저항대내에 형성되며, 높은 고유저항대와 동일한 도전형으로 구성되고 높은 고유저항대 보다 상대적으로 더 높은 동노를 갖는 버퍼대를 더 포함하는 것이 특징인 반도체 장치.
  4. 제2항에 있어서, 격자결함대는 양자조사에 의해 애노드대에 형성되며, 결함분포의 피크가 애노드대내측에 위치하는 것이 특징인 반도체 장치.
  5. 제4항에 있어서, 양자조사 유속량은 1x1012cm-2와 3x1012cm-2사이인 것이 특징인 반도체 장치.
  6. 제1항에 있어서, 격자결함대 밀도는 도전 및 턴오프 전력손실의 합이 최소인 결함밀도의 1.5 내지 2.0배인 것이 특징인 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880016970A 1987-12-18 1988-12-19 반도체 장치 KR910009035B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP62322336A JP2617497B2 (ja) 1987-12-18 1987-12-18 半導体装置
JP62-322336 1987-12-18
JP63100603A JPH0671078B2 (ja) 1988-04-23 1988-04-23 半導体装置
JP63-100603 1988-04-23

Publications (2)

Publication Number Publication Date
KR890011109A true KR890011109A (ko) 1989-08-12
KR910009035B1 KR910009035B1 (ko) 1991-10-28

Family

ID=26441599

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880016970A KR910009035B1 (ko) 1987-12-18 1988-12-19 반도체 장치

Country Status (6)

Country Link
US (1) US5075751A (ko)
KR (1) KR910009035B1 (ko)
AU (1) AU595735B2 (ko)
DE (1) DE3842468C3 (ko)
FR (1) FR2625043B1 (ko)
GB (1) GB2213988B (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182626A (en) * 1989-09-20 1993-01-26 Mitsubishi Denki Kabushiki Kaisha Insulated gate bipolar transistor and method of manufacturing the same
JPH03171777A (ja) * 1989-11-30 1991-07-25 Toshiba Corp 半導体装置
US5554883A (en) * 1990-04-28 1996-09-10 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and manufacturing method therefor
US5289031A (en) * 1990-08-21 1994-02-22 Kabushiki Kaisha Toshiba Semiconductor device capable of blocking contaminants
JPH0575110A (ja) * 1991-09-13 1993-03-26 Fuji Electric Co Ltd 半導体装置
US5654210A (en) * 1994-09-13 1997-08-05 Lsi Logic Corporation Process for making group IV semiconductor substrate treated with one or more group IV elements to form one or more barrier regions capable of inhibiting migration of dopant materials in substrate
US5858864A (en) * 1994-09-13 1999-01-12 Lsi Logic Corporation Process for making group IV semiconductor substrate treated with one or more group IV elements to form barrier region capable of inhibiting migration of dopant materials in substrate
US5883403A (en) * 1995-10-03 1999-03-16 Hitachi, Ltd. Power semiconductor device
TW353833B (en) * 1995-12-22 1999-03-01 Motorola Inc Wireless communication device having a reconfigurable matching circuit
US6774407B2 (en) * 1996-11-13 2004-08-10 Toyota Jidosha Kabushiki Kaisha Semiconductor device with a suppressed increase in turned-on resistance and an improved turn-off response
JPH10270451A (ja) * 1997-03-25 1998-10-09 Rohm Co Ltd 半導体装置およびその製造方法
WO1999007020A1 (de) 1997-07-30 1999-02-11 Siemens Aktiengesellschaft Gate-gesteuerter thyristor
DE19732912C2 (de) * 1997-07-30 2000-05-04 Siemens Ag Kaskoden-MOS-Thyristor
AU5847599A (en) * 1998-07-29 2000-02-21 Infineon Technologies, Ag Power semiconductor having a reduced reverse current
EP1484789A1 (en) * 1998-08-05 2004-12-08 MEMC Electronic Materials, Inc. Non-uniform minority carrier lifetime distributions in high performance silicon power devices
DE69933681T2 (de) * 1998-08-05 2007-08-23 Memc Electronic Materials, Inc. Ungleichmässige verteilung von minoritätsträger-lebensdauern in silizium-hochleistungsbauelementen
US6828690B1 (en) * 1998-08-05 2004-12-07 Memc Electronic Materials, Inc. Non-uniform minority carrier lifetime distributions in high performance silicon power devices
AU2001250027A1 (en) * 2000-03-06 2001-09-17 Jervis B. Webb Company Apparatus for transport and delivery of articles
FR2808922B1 (fr) * 2000-05-11 2003-09-12 Centre Nat Rech Scient Capteur de tension d'anode d'un composant de puissance vertical et utilisation en protection de courts-circuits
DE102005026408B3 (de) * 2005-06-08 2007-02-01 Infineon Technologies Ag Verfahren zur Herstellung einer Stoppzone in einem Halbleiterkörper und Halbleiterbauelement mit einer Stoppzone
DE102006001252B4 (de) 2006-01-10 2012-01-26 Infineon Technologies Ag Bipolares Leistungshalbleiterbauelement mit einem p-Emitter und höher dotierten Zonen in dem p-Emitter und Herstellungsverfahren
EP2058846B1 (de) * 2006-01-20 2011-08-31 Infineon Technologies Austria AG Verfahren zur Herstellung einer n-dotierten Zone in einem Halbleiterwafer und Halbleiterbauelement
JP2009283818A (ja) * 2008-05-26 2009-12-03 Sanken Electric Co Ltd 半導体装置およびその製造方法
WO2012056536A1 (ja) 2010-10-27 2012-05-03 富士電機株式会社 半導体装置および半導体装置の製造方法
JP5505498B2 (ja) * 2011-06-08 2014-05-28 トヨタ自動車株式会社 半導体装置とその製造方法
JP2016029685A (ja) * 2014-07-25 2016-03-03 株式会社東芝 半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4056408A (en) * 1976-03-17 1977-11-01 Westinghouse Electric Corporation Reducing the switching time of semiconductor devices by nuclear irradiation
DE2627855A1 (de) * 1976-06-22 1977-12-29 Siemens Ag Halbleiterbauelement mit wenigstens zwei, einen pn-uebergang bildenden zonen unterschiedlichen leitungstyps sowie verfahren zu dessen herstellung
US4224083A (en) * 1978-07-31 1980-09-23 Westinghouse Electric Corp. Dynamic isolation of conductivity modulation states in integrated circuits
US4278475A (en) * 1979-01-04 1981-07-14 Westinghouse Electric Corp. Forming of contoured irradiated regions in materials such as semiconductor bodies by nuclear radiation
JPS55128870A (en) * 1979-03-26 1980-10-06 Semiconductor Res Found Electrostatic induction thyristor and semiconductor device
US4291329A (en) * 1979-08-31 1981-09-22 Westinghouse Electric Corp. Thyristor with continuous recombination center shunt across planar emitter-base junction
DE3068968D1 (en) * 1979-11-16 1984-09-20 Gen Electric Asymmetrical field controlled thyristor
US4311534A (en) * 1980-06-27 1982-01-19 Westinghouse Electric Corp. Reducing the reverse recovery charge of thyristors by nuclear irradiation
DE3117202A1 (de) * 1981-04-30 1982-11-18 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum einstellen der lebensdauer der minoritaetsladungstraeger in halbleiterschaltern mit protonenstrahlen
JPS60207376A (ja) * 1984-03-31 1985-10-18 Toyota Central Res & Dev Lab Inc 高速静電誘導サイリスタおよびその製造方法
JPS62235782A (ja) * 1986-04-07 1987-10-15 Toyota Central Res & Dev Lab Inc 半導体装置
JPS6276556A (ja) * 1985-09-28 1987-04-08 Toyota Central Res & Dev Lab Inc 高速静電誘導サイリスタ
JP2604580B2 (ja) * 1986-10-01 1997-04-30 三菱電機株式会社 アノード短絡形ゲートターンオフサイリスタ
JPS63205958A (ja) * 1987-02-21 1988-08-25 Matsushita Electric Works Ltd 静電誘導サイリスタ
JPH0671078B2 (ja) * 1988-04-23 1994-09-07 松下電工株式会社 半導体装置
JPH0236570A (ja) * 1988-07-26 1990-02-06 Matsushita Electric Works Ltd 半導体装置

Also Published As

Publication number Publication date
AU2676488A (en) 1989-08-03
FR2625043A1 (fr) 1989-06-23
GB2213988B (en) 1992-02-05
DE3842468C2 (ko) 1993-04-08
DE3842468C3 (de) 1998-03-26
AU595735B2 (en) 1990-04-05
GB8828659D0 (en) 1989-01-11
KR910009035B1 (ko) 1991-10-28
DE3842468A1 (de) 1989-06-29
FR2625043B1 (fr) 1994-02-18
GB2213988A (en) 1989-08-23
US5075751A (en) 1991-12-24

Similar Documents

Publication Publication Date Title
KR890011109A (ko) 반도체 장치
JPH09501270A (ja) 炭化ケイ素サイリスタ
Shekar et al. Characteristics of the emitter-switched thyristor
Nandakumar et al. A new MOS-gated power thyristor structure with turn-off achieved by controlling the base resistance
JPS6445173A (en) Conductive modulation type mosfet
SE7502640L (ko)
Nakamura et al. Experimental study on current gain of BSIT
JPH08102545A (ja) 半導体素子のライフタイム制御方法
KR900005623A (ko) 제어 가능 파워 반도체 소자
JP4001249B2 (ja) 高ブロッキング電圧用ゲート・ターンオフ・サイリスタ
US5360983A (en) Insulated gate bipolar transistor having a specific buffer layer resistance
Nakamura et al. Very high speed static induction thyristor
Hefner et al. The effect of neutrons on the characteristics of the insulated gate bipolar transistor (IGBT)
JPS57138175A (en) Controlled rectifier for semiconductor
JP2674641B2 (ja) ゲートターンオフサイリスタ
DE3853852D1 (de) Thyristoren.
JPS5784175A (en) Semiconductor device
KR920015453A (ko) 스위칭 반도체장치의 제조방법
JPS57173974A (en) Semiconductor device
Baliga et al. Gate turn-off capability of depletion-mode thyristors
JPS57181162A (en) Gate turn off thyristor
GB2011712A (en) Thyristor capable of being switched off without blocking recovery delay time, and method of operating such thyristor
CN114400252A (zh) 一种基于冷金属的负微分电阻mosfet管
Hachad et al. Latchup criteria in insulated gate pnpn structures
Ayazyan High-power gate turn-off thyristors

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19991011

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee