KR890011109A - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR890011109A KR890011109A KR1019880016970A KR880016970A KR890011109A KR 890011109 A KR890011109 A KR 890011109A KR 1019880016970 A KR1019880016970 A KR 1019880016970A KR 880016970 A KR880016970 A KR 880016970A KR 890011109 A KR890011109 A KR 890011109A
- Authority
- KR
- South Korea
- Prior art keywords
- band
- anode
- semiconductor device
- high resistivity
- lattice defect
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 230000007547 defect Effects 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 4
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
- H01L29/0834—Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/30—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
- H01L29/32—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being within the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Thyristors (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 스태틱 유도형 다이리스터로서 본 발명의 일실시예 반도체 장치의 단면도.
제2a도는 제1도 반도체 장치의 격자결함분포와 불순물분포를 보여주는 도.
제2b도는 격자결함대가 애노드대 외각에 위치된 경우에 비교 반도체 장치의 격자결함분포와 불순물분포를 보여주는 도.
Claims (6)
- 장치의 일측에 형성되며 고불순물 농도대를 갖는 애노드대, 장치의 반대편에 형성되며 고불순물 농도대를 갖는 캐소드대, 애노드대와 캐소드대 사이를 형성되며 전류로로서 동작을 하는 저불순물 농도대를 갖는 높은 고유저항대, 및 캐리어 수명을 짧게 하는 상대적으로 저농도의 애노드대내에 있는 격자결함대로 구성되는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 격자결함대는 상기 애노드대 내에 높은 고유저항대에 근접하여 형성되는 것이 특징인 반도체 장치.
- 제1항에 있어서, 더욱이 애노드대와 근접하여 위치된 높은 고유저항대내에 형성되며, 높은 고유저항대와 동일한 도전형으로 구성되고 높은 고유저항대 보다 상대적으로 더 높은 동노를 갖는 버퍼대를 더 포함하는 것이 특징인 반도체 장치.
- 제2항에 있어서, 격자결함대는 양자조사에 의해 애노드대에 형성되며, 결함분포의 피크가 애노드대내측에 위치하는 것이 특징인 반도체 장치.
- 제4항에 있어서, 양자조사 유속량은 1x1012cm-2와 3x1012cm-2사이인 것이 특징인 반도체 장치.
- 제1항에 있어서, 격자결함대 밀도는 도전 및 턴오프 전력손실의 합이 최소인 결함밀도의 1.5 내지 2.0배인 것이 특징인 반도체 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62322336A JP2617497B2 (ja) | 1987-12-18 | 1987-12-18 | 半導体装置 |
JP62-322336 | 1987-12-18 | ||
JP63100603A JPH0671078B2 (ja) | 1988-04-23 | 1988-04-23 | 半導体装置 |
JP63-100603 | 1988-04-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890011109A true KR890011109A (ko) | 1989-08-12 |
KR910009035B1 KR910009035B1 (ko) | 1991-10-28 |
Family
ID=26441599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880016970A KR910009035B1 (ko) | 1987-12-18 | 1988-12-19 | 반도체 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5075751A (ko) |
KR (1) | KR910009035B1 (ko) |
AU (1) | AU595735B2 (ko) |
DE (1) | DE3842468C3 (ko) |
FR (1) | FR2625043B1 (ko) |
GB (1) | GB2213988B (ko) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5182626A (en) * | 1989-09-20 | 1993-01-26 | Mitsubishi Denki Kabushiki Kaisha | Insulated gate bipolar transistor and method of manufacturing the same |
JPH03171777A (ja) * | 1989-11-30 | 1991-07-25 | Toshiba Corp | 半導体装置 |
US5554883A (en) * | 1990-04-28 | 1996-09-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and manufacturing method therefor |
US5289031A (en) * | 1990-08-21 | 1994-02-22 | Kabushiki Kaisha Toshiba | Semiconductor device capable of blocking contaminants |
JPH0575110A (ja) * | 1991-09-13 | 1993-03-26 | Fuji Electric Co Ltd | 半導体装置 |
US5654210A (en) * | 1994-09-13 | 1997-08-05 | Lsi Logic Corporation | Process for making group IV semiconductor substrate treated with one or more group IV elements to form one or more barrier regions capable of inhibiting migration of dopant materials in substrate |
US5858864A (en) * | 1994-09-13 | 1999-01-12 | Lsi Logic Corporation | Process for making group IV semiconductor substrate treated with one or more group IV elements to form barrier region capable of inhibiting migration of dopant materials in substrate |
US5883403A (en) * | 1995-10-03 | 1999-03-16 | Hitachi, Ltd. | Power semiconductor device |
TW353833B (en) * | 1995-12-22 | 1999-03-01 | Motorola Inc | Wireless communication device having a reconfigurable matching circuit |
US6774407B2 (en) * | 1996-11-13 | 2004-08-10 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device with a suppressed increase in turned-on resistance and an improved turn-off response |
JPH10270451A (ja) * | 1997-03-25 | 1998-10-09 | Rohm Co Ltd | 半導体装置およびその製造方法 |
WO1999007020A1 (de) | 1997-07-30 | 1999-02-11 | Siemens Aktiengesellschaft | Gate-gesteuerter thyristor |
DE19732912C2 (de) * | 1997-07-30 | 2000-05-04 | Siemens Ag | Kaskoden-MOS-Thyristor |
AU5847599A (en) * | 1998-07-29 | 2000-02-21 | Infineon Technologies, Ag | Power semiconductor having a reduced reverse current |
EP1484789A1 (en) * | 1998-08-05 | 2004-12-08 | MEMC Electronic Materials, Inc. | Non-uniform minority carrier lifetime distributions in high performance silicon power devices |
DE69933681T2 (de) * | 1998-08-05 | 2007-08-23 | Memc Electronic Materials, Inc. | Ungleichmässige verteilung von minoritätsträger-lebensdauern in silizium-hochleistungsbauelementen |
US6828690B1 (en) * | 1998-08-05 | 2004-12-07 | Memc Electronic Materials, Inc. | Non-uniform minority carrier lifetime distributions in high performance silicon power devices |
AU2001250027A1 (en) * | 2000-03-06 | 2001-09-17 | Jervis B. Webb Company | Apparatus for transport and delivery of articles |
FR2808922B1 (fr) * | 2000-05-11 | 2003-09-12 | Centre Nat Rech Scient | Capteur de tension d'anode d'un composant de puissance vertical et utilisation en protection de courts-circuits |
DE102005026408B3 (de) * | 2005-06-08 | 2007-02-01 | Infineon Technologies Ag | Verfahren zur Herstellung einer Stoppzone in einem Halbleiterkörper und Halbleiterbauelement mit einer Stoppzone |
DE102006001252B4 (de) | 2006-01-10 | 2012-01-26 | Infineon Technologies Ag | Bipolares Leistungshalbleiterbauelement mit einem p-Emitter und höher dotierten Zonen in dem p-Emitter und Herstellungsverfahren |
EP2058846B1 (de) * | 2006-01-20 | 2011-08-31 | Infineon Technologies Austria AG | Verfahren zur Herstellung einer n-dotierten Zone in einem Halbleiterwafer und Halbleiterbauelement |
JP2009283818A (ja) * | 2008-05-26 | 2009-12-03 | Sanken Electric Co Ltd | 半導体装置およびその製造方法 |
WO2012056536A1 (ja) | 2010-10-27 | 2012-05-03 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP5505498B2 (ja) * | 2011-06-08 | 2014-05-28 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
JP2016029685A (ja) * | 2014-07-25 | 2016-03-03 | 株式会社東芝 | 半導体装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4056408A (en) * | 1976-03-17 | 1977-11-01 | Westinghouse Electric Corporation | Reducing the switching time of semiconductor devices by nuclear irradiation |
DE2627855A1 (de) * | 1976-06-22 | 1977-12-29 | Siemens Ag | Halbleiterbauelement mit wenigstens zwei, einen pn-uebergang bildenden zonen unterschiedlichen leitungstyps sowie verfahren zu dessen herstellung |
US4224083A (en) * | 1978-07-31 | 1980-09-23 | Westinghouse Electric Corp. | Dynamic isolation of conductivity modulation states in integrated circuits |
US4278475A (en) * | 1979-01-04 | 1981-07-14 | Westinghouse Electric Corp. | Forming of contoured irradiated regions in materials such as semiconductor bodies by nuclear radiation |
JPS55128870A (en) * | 1979-03-26 | 1980-10-06 | Semiconductor Res Found | Electrostatic induction thyristor and semiconductor device |
US4291329A (en) * | 1979-08-31 | 1981-09-22 | Westinghouse Electric Corp. | Thyristor with continuous recombination center shunt across planar emitter-base junction |
DE3068968D1 (en) * | 1979-11-16 | 1984-09-20 | Gen Electric | Asymmetrical field controlled thyristor |
US4311534A (en) * | 1980-06-27 | 1982-01-19 | Westinghouse Electric Corp. | Reducing the reverse recovery charge of thyristors by nuclear irradiation |
DE3117202A1 (de) * | 1981-04-30 | 1982-11-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zum einstellen der lebensdauer der minoritaetsladungstraeger in halbleiterschaltern mit protonenstrahlen |
JPS60207376A (ja) * | 1984-03-31 | 1985-10-18 | Toyota Central Res & Dev Lab Inc | 高速静電誘導サイリスタおよびその製造方法 |
JPS62235782A (ja) * | 1986-04-07 | 1987-10-15 | Toyota Central Res & Dev Lab Inc | 半導体装置 |
JPS6276556A (ja) * | 1985-09-28 | 1987-04-08 | Toyota Central Res & Dev Lab Inc | 高速静電誘導サイリスタ |
JP2604580B2 (ja) * | 1986-10-01 | 1997-04-30 | 三菱電機株式会社 | アノード短絡形ゲートターンオフサイリスタ |
JPS63205958A (ja) * | 1987-02-21 | 1988-08-25 | Matsushita Electric Works Ltd | 静電誘導サイリスタ |
JPH0671078B2 (ja) * | 1988-04-23 | 1994-09-07 | 松下電工株式会社 | 半導体装置 |
JPH0236570A (ja) * | 1988-07-26 | 1990-02-06 | Matsushita Electric Works Ltd | 半導体装置 |
-
1988
- 1988-12-08 GB GB8828659A patent/GB2213988B/en not_active Expired - Lifetime
- 1988-12-09 AU AU26764/88A patent/AU595735B2/en not_active Ceased
- 1988-12-15 FR FR8816560A patent/FR2625043B1/fr not_active Expired - Fee Related
- 1988-12-16 DE DE3842468A patent/DE3842468C3/de not_active Expired - Fee Related
- 1988-12-19 KR KR1019880016970A patent/KR910009035B1/ko not_active IP Right Cessation
-
1990
- 1990-09-17 US US07/584,485 patent/US5075751A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU2676488A (en) | 1989-08-03 |
FR2625043A1 (fr) | 1989-06-23 |
GB2213988B (en) | 1992-02-05 |
DE3842468C2 (ko) | 1993-04-08 |
DE3842468C3 (de) | 1998-03-26 |
AU595735B2 (en) | 1990-04-05 |
GB8828659D0 (en) | 1989-01-11 |
KR910009035B1 (ko) | 1991-10-28 |
DE3842468A1 (de) | 1989-06-29 |
FR2625043B1 (fr) | 1994-02-18 |
GB2213988A (en) | 1989-08-23 |
US5075751A (en) | 1991-12-24 |
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A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
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FPAY | Annual fee payment |
Payment date: 19991011 Year of fee payment: 9 |
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