KR20230154957A - 폴리실세스퀴옥산 조성물, 및, 경화물 - Google Patents

폴리실세스퀴옥산 조성물, 및, 경화물 Download PDF

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Publication number
KR20230154957A
KR20230154957A KR1020237034089A KR20237034089A KR20230154957A KR 20230154957 A KR20230154957 A KR 20230154957A KR 1020237034089 A KR1020237034089 A KR 1020237034089A KR 20237034089 A KR20237034089 A KR 20237034089A KR 20230154957 A KR20230154957 A KR 20230154957A
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KR
South Korea
Prior art keywords
group
polysilsesquioxane
compound
alkyl group
carbon atoms
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Pending
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KR1020237034089A
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English (en)
Korean (ko)
Inventor
준이치 나카무라
노부히로 마에다
Original Assignee
가부시키가이샤 닛폰 쇼쿠바이
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Publication of KR20230154957A publication Critical patent/KR20230154957A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/378—Thiols containing heterocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C08K5/5333—Esters of phosphonic acids

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020237034089A 2021-03-25 2022-03-22 폴리실세스퀴옥산 조성물, 및, 경화물 Pending KR20230154957A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-052091 2021-03-25
JP2021052091 2021-03-25
PCT/JP2022/013113 WO2022202800A1 (ja) 2021-03-25 2022-03-22 ポリシルセスキオキサン組成物、及び、硬化物

Publications (1)

Publication Number Publication Date
KR20230154957A true KR20230154957A (ko) 2023-11-09

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KR1020237034089A Pending KR20230154957A (ko) 2021-03-25 2022-03-22 폴리실세스퀴옥산 조성물, 및, 경화물

Country Status (5)

Country Link
US (1) US20240270908A1 (https=)
JP (1) JP7642063B2 (https=)
KR (1) KR20230154957A (https=)
CN (1) CN117043276A (https=)
WO (1) WO2022202800A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014208838A (ja) 2007-04-10 2014-11-06 ハネウェル・インターナショナル・インコーポレーテッド オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用
JP2018516998A (ja) 2015-04-13 2018-06-28 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2646289B2 (ja) * 1990-06-01 1997-08-27 富士写真フイルム株式会社 レジスト組成物
JP3628098B2 (ja) * 1996-03-29 2005-03-09 ダウ コーニング アジア株式会社 放射線硬化性組成物およびこれを用いた硬化物パターンの製造方法
JPH11300273A (ja) * 1998-04-21 1999-11-02 Tokiwa Electric Co Ltd 光触媒被覆の形成方法
JP2001226634A (ja) * 2000-02-16 2001-08-21 Showa Denko Kk コーティング組成物
US6842577B2 (en) * 2002-12-02 2005-01-11 Shipley Company L.L.C. Photoimageable waveguide composition and waveguide formed therefrom
JP4834972B2 (ja) * 2004-09-17 2011-12-14 東レ株式会社 コーティング用組成物およびそれを用いた表示装置
JP2006096806A (ja) * 2004-09-28 2006-04-13 Fuji Photo Film Co Ltd セルロースアシレートフィルム並びにそれを用いた光学フィルム、画像表示装置
JP2006328231A (ja) * 2005-05-26 2006-12-07 Nagase Chemtex Corp 光素子用封止樹脂組成物
KR101296551B1 (ko) * 2007-02-09 2013-08-13 가부시키가이샤 닛폰 쇼쿠바이 실란 화합물, 그 제조 방법 및 실란 화합물을 포함하는 수지 조성물
JP5075680B2 (ja) * 2007-03-28 2012-11-21 リンテック株式会社 光素子用封止材および光素子封止体
KR101512529B1 (ko) * 2007-11-19 2015-04-15 도아고세이가부시키가이샤 폴리실록산 및 그의 제조 방법 및 경화물의 제조 방법
JP5333723B2 (ja) * 2008-07-23 2013-11-06 住友ゴム工業株式会社 ゴム組成物
JP2010044870A (ja) * 2008-08-08 2010-02-25 Nippon Shokubai Co Ltd フラットパネルディスプレイ用封着層形成材料、フラットパネルディスプレイ用封着層、及び、フラットパネルディスプレイ
JP4973877B2 (ja) * 2008-09-17 2012-07-11 信越化学工業株式会社 金属表面処理剤、表面処理鋼材及びその処理方法、並びに塗装鋼材及びその製造方法
JP5215931B2 (ja) * 2009-05-07 2013-06-19 株式会社日本触媒 重合性イミド組成物
JP5443940B2 (ja) * 2009-10-21 2014-03-19 東亞合成株式会社 硬化型コーティング剤組成物
JP2011241380A (ja) * 2010-04-22 2011-12-01 Nippon Shokubai Co Ltd 硬化成型体用樹脂組成物及び硬化成型体
CN103476870A (zh) * 2011-03-31 2013-12-25 道康宁公司 包含磷酸酯催化剂的组合物以及该组合物的制备和使用方法
US20140039089A1 (en) * 2011-03-31 2014-02-06 Dow Corning Corporation Compositions Containing Phosphonate Catalysts And Methods For The Preparation And Use Of The Compositions
EP2781553A4 (en) * 2011-11-15 2015-07-08 Nippon Catalytic Chem Ind SILICONE COMPOSITION, HARDENABLE RESIN COMPOSITION AND SEALING MATERIAL
JP2013163786A (ja) * 2012-02-13 2013-08-22 Asahi Kasei E-Materials Corp 感光性シリコーン樹脂組成物
JP2015230339A (ja) * 2014-06-03 2015-12-21 株式会社日本触媒 感光性樹脂組成物及びその用途
JP2016069475A (ja) * 2014-09-29 2016-05-09 株式会社日本触媒 硬化性樹脂組成物
JP6524786B2 (ja) * 2015-04-27 2019-06-05 Jsr株式会社 ポジ型感放射線性樹脂組成物、赤外線遮蔽膜、その形成方法、及び固体撮像素子、照度センサー
JP2018119023A (ja) * 2017-01-23 2018-08-02 国立大学法人大阪大学 導電性組成物及び半導体装置
JP7194496B2 (ja) * 2017-12-06 2022-12-22 株式会社日本触媒 分散体及び樹脂組成物
JP2019137841A (ja) * 2018-02-09 2019-08-22 株式会社日本触媒 硬化性樹脂組成物、それを用いた封止材及び半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014208838A (ja) 2007-04-10 2014-11-06 ハネウェル・インターナショナル・インコーポレーテッド オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用
JP2018516998A (ja) 2015-04-13 2018-06-28 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング

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TW202248297A (zh) 2022-12-16
WO2022202800A1 (ja) 2022-09-29
US20240270908A1 (en) 2024-08-15
JPWO2022202800A1 (https=) 2022-09-29
JP7642063B2 (ja) 2025-03-07
CN117043276A (zh) 2023-11-10

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