KR20200092870A - 가공 장치의 사용 방법 - Google Patents

가공 장치의 사용 방법 Download PDF

Info

Publication number
KR20200092870A
KR20200092870A KR1020200001307A KR20200001307A KR20200092870A KR 20200092870 A KR20200092870 A KR 20200092870A KR 1020200001307 A KR1020200001307 A KR 1020200001307A KR 20200001307 A KR20200001307 A KR 20200001307A KR 20200092870 A KR20200092870 A KR 20200092870A
Authority
KR
South Korea
Prior art keywords
cassette
workpiece
type
grinding
workpieces
Prior art date
Application number
KR1020200001307A
Other languages
English (en)
Korean (ko)
Inventor
슈조 미타니
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20200092870A publication Critical patent/KR20200092870A/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020200001307A 2019-01-25 2020-01-06 가공 장치의 사용 방법 KR20200092870A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-011687 2019-01-25
JP2019011687A JP7191472B2 (ja) 2019-01-25 2019-01-25 加工装置の使用方法

Publications (1)

Publication Number Publication Date
KR20200092870A true KR20200092870A (ko) 2020-08-04

Family

ID=71788547

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200001307A KR20200092870A (ko) 2019-01-25 2020-01-06 가공 장치의 사용 방법

Country Status (4)

Country Link
JP (1) JP7191472B2 (ja)
KR (1) KR20200092870A (ja)
CN (1) CN111482858B (ja)
TW (1) TWI827788B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112518573B (zh) * 2020-11-06 2022-06-07 西安奕斯伟硅片技术有限公司 研磨装置、研磨机及研磨方法
CN112589594B (zh) * 2020-11-19 2022-02-08 广东长盈精密技术有限公司 打磨装置
CN116868314A (zh) * 2021-03-24 2023-10-10 东和株式会社 加工装置及加工品的制造方法
JP2023059151A (ja) 2021-10-14 2023-04-26 株式会社東京精密 ワーク加工装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013255952A (ja) 2012-06-11 2013-12-26 Disco Corp 研削装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831508B2 (ja) * 1987-03-05 1996-03-27 東芝機械株式会社 被処理材およびホルダの交換装置
JP2000006015A (ja) 1998-06-26 2000-01-11 Nippei Toyama Corp 研削盤
US7112812B2 (en) * 2001-12-28 2006-09-26 Applied Materials, Inc. Optical measurement apparatus
KR100472959B1 (ko) 2002-07-16 2005-03-10 삼성전자주식회사 언로딩구조가 개선된 반도체 웨이퍼의 표면평탄화설비
JP4625704B2 (ja) * 2005-02-08 2011-02-02 株式会社ディスコ 研削装置
JP4772530B2 (ja) * 2005-07-15 2011-09-14 日本電産サンキョー株式会社 基板搬出搬入方法及び基板搬出搬入システム
JP4767641B2 (ja) * 2005-09-27 2011-09-07 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
WO2008041326A1 (fr) * 2006-10-03 2008-04-10 Ihi Corporation système de transfert de substrats
JP5115501B2 (ja) * 2009-03-12 2013-01-09 株式会社Ｉｈｉ 基板仕分け装置及び基板仕分け方法
JP5431049B2 (ja) * 2009-07-16 2014-03-05 株式会社荏原製作所 基板搬送用ロボットのカセットに対する制御方法
JP5575689B2 (ja) * 2011-04-01 2014-08-20 株式会社 ハリーズ 薄板状物加工装置及び薄板状部材の製造方法
JP6189047B2 (ja) * 2013-02-18 2017-08-30 株式会社ディスコ カセット
JP2015119079A (ja) 2013-12-19 2015-06-25 株式会社ディスコ 加工装置
JP2015138856A (ja) 2014-01-22 2015-07-30 株式会社ディスコ 切削装置
JP6360762B2 (ja) * 2014-09-26 2018-07-18 株式会社ディスコ 加工装置
JP6571379B2 (ja) * 2015-04-28 2019-09-04 株式会社ディスコ 切削装置
JP6877207B2 (ja) 2017-03-28 2021-05-26 株式会社ディスコ ウエーハ加工システム
JP2018207022A (ja) * 2017-06-08 2018-12-27 株式会社ディスコ 加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013255952A (ja) 2012-06-11 2013-12-26 Disco Corp 研削装置

Also Published As

Publication number Publication date
JP2020116712A (ja) 2020-08-06
CN111482858B (zh) 2023-09-12
TWI827788B (zh) 2024-01-01
CN111482858A (zh) 2020-08-04
TW202027906A (zh) 2020-08-01
JP7191472B2 (ja) 2022-12-19

Similar Documents

Publication Publication Date Title
KR20200092870A (ko) 가공 장치의 사용 방법
JP6336772B2 (ja) 研削研磨装置
JP6157229B2 (ja) 研削装置及び研削方法
JP2007173487A (ja) ウエーハの加工方法および装置
JP2011135026A (ja) ワークユニットの保持方法および保持機構
JP2008155292A (ja) 基板の加工方法および加工装置
JP7002874B2 (ja) 基板処理システム
JP6754272B2 (ja) 研削装置
JP5410940B2 (ja) 研削装置
JP2009061568A (ja) 板状物加工用トレイおよび加工装置
JP7382840B2 (ja) 研削装置
TWI813837B (zh) 觸碰面板
JP2021041472A (ja) 加工装置
JP5926042B2 (ja) 板状基板の割れ検知方法
JP2018117003A (ja) ウェーハ加工装置
TW202133240A (zh) 加工裝置
TW202031411A (zh) 加工裝置
JP2021126744A (ja) 加工装置
JP2020151795A (ja) 加工装置
JP6969944B2 (ja) 板状物の切削方法及び切削措置
JP4477974B2 (ja) 研磨装置
JP2017092412A (ja) 円板状ワークの研削方法
JP4850666B2 (ja) ウエーハの加工装置
JP2014042959A (ja) 研削装置
JP5973284B2 (ja) 研削装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal