WO2008041326A1 - système de transfert de substrats - Google Patents

système de transfert de substrats Download PDF

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Publication number
WO2008041326A1
WO2008041326A1 PCT/JP2006/319792 JP2006319792W WO2008041326A1 WO 2008041326 A1 WO2008041326 A1 WO 2008041326A1 JP 2006319792 W JP2006319792 W JP 2006319792W WO 2008041326 A1 WO2008041326 A1 WO 2008041326A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
sorting
cassette
substrates
sorting system
Prior art date
Application number
PCT/JP2006/319792
Other languages
English (en)
Japanese (ja)
Inventor
Kensuke Hirata
Susumu Murayama
Kuniaki To
Kai Tanaka
Wataru Ueda
Original Assignee
Ihi Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ihi Corporation filed Critical Ihi Corporation
Priority to JP2008537383A priority Critical patent/JP4992906B2/ja
Priority to KR20097008932A priority patent/KR101183042B1/ko
Priority to PCT/JP2006/319792 priority patent/WO2008041326A1/fr
Priority to CN200680056004.5A priority patent/CN101511709B/zh
Priority to TW095142274A priority patent/TW200817259A/zh
Publication of WO2008041326A1 publication Critical patent/WO2008041326A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Definitions

  • the present invention relates to a substrate sorting system, and more particularly to a method for sorting substrates by storing a substrate from a sorting source cassette to a buffer station and then storing it in a sorting destination cassette.
  • FIG. 18 is a plan view showing a schematic configuration of a conventional substrate sorting system 200.
  • FIG. 19 is a front view of the substrate sorting system 200, and is a view showing an arrow XIX in FIG.
  • the substrate sorting system 200 includes a base 206 on which a sorting source cassette 202 and a plurality of sorting destination cassettes 204 can be placed, a robot 208 that can carry substrates in a single sheet, and a sorting destination cassette 204. And a stocker 210 that can be placed.
  • the sorting source cassette 202 and the sorting destination cassette 204 are configured in the same manner, and each cassette can store the same number of substrates.
  • the sorting cassette 204 can be appropriately moved.
  • the sorting source cassette 202 When a plurality of different types of substrates are randomly stored and the sorting source cassette 202 is installed (placed) on the base 206, information on each substrate stored in the sorting source cassette 202 (for example, The information on the type of substrate (information displayed on each substrate with a barcode, etc.) is read with a barcode reader, etc., and the robot 208 carries out the substrates one by one from the sorting cassette 202, and sorts the unloaded substrates. It is to be loaded into the first cassette 204.
  • each sorting destination cassette 204 stores a substrate for each type.
  • each board that is randomly stored in the sorting source cassette 202 is sorted and stored by type when stored in the sorting destination cassette 204. Has been done.
  • the robot 208 is used to sort the substrate when the sorting cassette 202 is also transported to the sorting cassette 204, so that the substrate 206 and the stocker 210 are separated. In this case, there is a problem that it becomes difficult to efficiently sort the substrates because the number of operations (work) for replacing the sorting destination cassette 204 increases.
  • the sorting source cassette 202 many types (for example, 10 types) of substrates are stored in the sorting source cassette 202, and three sorting destination cassettes 204 are placed on the base 206 as shown in FIG. If this is not possible, only three types of substrates can be loaded into each sorting destination cassette 204, and seven types of substrates remain in the sorting source cassette 202. Further, with only the three types of substrates, the three sorting destination cassettes 204 placed on the base 206 are not filled with the substrates.
  • the sorting cassette 204 is separately placed on the stocker 210, and the sorting cassette 204 is appropriately replaced between the base 206 and the stocker 210, the 10 types of substrates are sorted into the sorting cassette. Power that can be sorted and stored in 204 Since the sorting cassette 204 needs to be replaced between the base 206 and the stocker 210, the efficiency of sorting the substrates is poor.
  • a substrate sorting system (not shown) having a buffer station can be considered.
  • the substrate sorting system includes a sorting source cassette, a sorting destination cassette, a base, a robot, and a stocker, which are configured in the same manner as the substrate sorting system 200, a nof It has a station.
  • the buffer station is provided with, for example, nother cassettes in a plurality of rows. Between the buffer cassettes, robots configured similarly to the robots are provided.
  • the cassette for notifier is configured in the same way as the sorting source cassette and sorting cassette, and the same sheet. A number of substrates can be stored and are placed on a base similar to the base.
  • the substrate sorting system does not require replacement of the sorting cassette between the stocker and the base, and the substrates can be sorted efficiently.
  • the substrate sorting system 200 has a problem that it is difficult to efficiently sort the substrates.
  • the substrate sorting system (not shown), a large number of substrates are temporarily stored.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate sorting system capable of efficiently sorting substrates and avoiding an increase in size.
  • the invention based on the first aspect of the present invention is a substrate sorting system for sorting a plurality of substrates stored in a sorting source cassette into a sorting destination cassette, and the substrate can be stored in an arbitrary position.
  • a substrate sorting system having a buffer station and a loader device capable of transporting substrates in a single sheet between the sorting source cassette, the sorting destination cassette, and the buffer station.
  • An invention based on the second aspect of the present invention provides a substrate sorting system according to the first aspect.
  • the system based on the ID input means for inputting the ID of the board stored in the sorting source cassette and the ID inputted by the ID input means, the board sorted in the sorting destination cassette is moved.
  • a substrate sorting system having control means for controlling the loader device.
  • the invention according to the third aspect of the present invention is a substrate sorting system according to the first aspect or the second aspect, wherein a plurality of sorting destination cassettes are provided. is there.
  • the invention according to the fourth aspect of the present invention is the substrate sorting system according to any one of the first aspect to the third aspect, wherein the buffer station can store the substrate at a high density. It is a certain board sorting system.
  • FIG. 1 is a plan view showing a schematic configuration of a substrate sorting system according to a first embodiment of the present invention.
  • FIG. 2 is a side view showing a schematic configuration of the substrate sorting system, and is a view taken along arrow II in FIG.
  • FIG. 3 is a schematic perspective view of a koffa station.
  • FIG. 4 is a perspective view showing a high-density cassette constituting the notch station.
  • FIG. 5 is a view taken in the direction of arrow V in FIG.
  • FIG. 6 is a view on arrow VI in FIG.
  • FIG. 7 is a plan view showing a schematic configuration of the substrate sorting system, and corresponds to FIG.
  • FIG. 8 is a side view showing a schematic configuration of the substrate sorting system, which is a view taken along the line VIII in FIG. 7, and corresponds to FIG.
  • FIG. 9 is a diagram for explaining the operation of the substrate sorting system.
  • FIG. 10 is a diagram for explaining the operation of the substrate sorting system.
  • FIG. 11 is a diagram for explaining the operation of the substrate sorting system.
  • FIG. 12 is a diagram for explaining the operation of the substrate sorting system.
  • FIG. 13 is a diagram for explaining the operation of the substrate sorting system.
  • FIG. 14 is a side view showing a schematic configuration of the substrate sorting system according to the second embodiment of the present invention, and corresponds to FIG. 2.
  • FIG. 15 is a plan view showing a schematic configuration of a substrate sorting system according to a third embodiment of the present invention, and corresponds to FIG. 1.
  • FIG. 16 is a plan view showing a schematic configuration of a substrate sorting system according to a fifth embodiment of the present invention, and corresponds to FIG. 1.
  • FIG. 17 is a side view showing a schematic configuration of a substrate sorting system according to a fifth embodiment of the present invention, and is a view showing an arrow XVII in FIG.
  • FIG. 18 is a plan view showing a schematic configuration of a conventional substrate sorting system.
  • FIG. 19 is a front view of the substrate sorting system, and is a view showing an arrow XIX in FIG.
  • FIG. 1 is a plan view showing a schematic configuration of a substrate sorting system 1 according to the first embodiment of the present invention
  • FIG. 2 is a side view showing a schematic configuration of the substrate sorting system 1 in FIG. FIG.
  • one direction in the horizontal direction is the X-axis direction
  • another direction in the horizontal direction that is perpendicular to the X-axis direction is the Y-axis direction.
  • the vertical direction is the Z-axis direction.
  • the substrate sorting system 1 is a device for sorting a plurality of substrates W stored in the sorting source cassette 3 into the sorting destination cassette 5.
  • the sorting cassette 3 can be stored in multiple stages by stacking the substrates W horizontally and slightly spaced apart from each other, and the sorting cassette 5 can also be placed in the sorting cassette 5 with the substrates W horizontally arranged at approximately equal intervals. By stacking slightly apart, it can be stored in multiple stages!
  • a glass substrate for example, a rectangular and plate-like glass substrate used for a plasma display panel, a liquid crystal display panel, or the like
  • a glass substrate for example, a rectangular and plate-like glass substrate used for a plasma display panel, a liquid crystal display panel, or the like
  • the substrate sorting system 1 includes a buffer station 7 on which a high-density cassette 9 is placed and a substrate W can be stored in an arbitrary position of the high-density force set 9; Between the sorting station 13 that can place the sorting cassette 3 and the sorting station 15 that can place the sorting cassette 5 and between the sorting cassette 3, the sorting cassette 5 and the high-density force set 9 And a loader device 11 capable of transporting the substrate W by a single wafer.
  • the high-density cassette 9 can be stored in multiple stages by stacking the substrates W horizontally and slightly spaced apart from each other at approximately equal intervals.
  • the mouth bot hand on which the substrate W can be placed only by the robot hand can be stored at a high density with a substrate interval so that it cannot enter between the substrates W. I am able to do that.
  • the sorting source station 13 is provided with a sorting source cassette auxiliary unit 17 for transferring the substrates W stored in the sorting source cassette 5 to the loader device 11 in a single sheet, and the sorting destination station 15
  • a sorter cassette auxiliary unit 19 is provided for carrying the substrate W in the sorter cassette 5 that is transported by the loader device 11.
  • the koffa station 7 will be described in detail with an example.
  • FIG. 3 is a schematic perspective view of the buffer station 7
  • FIG. 4 is a perspective view showing a high-density cassette 9 constituting the buffer station 7
  • FIG. 5 is a view taken along the arrow V in FIG. Fig. 6 is a view taken along arrow VI in Fig. 5.
  • the noffer station 7 includes one or a plurality of (for example, two) high-density cassettes 9.
  • the high-density cassette 9 has a rectangular parallelepiped appearance, and includes side members 25 at both ends in the Y-axis direction.
  • the side members 25 are elongated in the Z-axis direction, and are provided with a plurality of intervals in the X-axis direction on one end side in the Y-axis direction.
  • the side members 25 are arranged on the other end side in the Y-axis direction.
  • a plurality of devices are provided at intervals in the direction.
  • a substrate W is placed in the high-density cassette 9 between the side member 25 provided on one end side in the Y-axis direction and the side member 25 provided on the other end side in the Y-axis direction.
  • a linear member (for example, a wire) 27 for stretching and storing is stretched.
  • a plurality of wires 27 are provided by extending in the Y-axis direction with a predetermined interval in the X-axis direction, whereby one substrate is obtained. It constitutes a group of wires that can support (place) W.
  • a plurality of the wire group forces are provided at predetermined small intervals in the 3 ⁇ 4 axis direction. Therefore, the high-density cassette 9 can be stored in multiple stages with the substrates W horizontal.
  • the high-density cassette 9 configured in this way may be referred to as a wire cassette.
  • an opening 26 through which the substrate W can freely enter and exit is provided on one side surface in the X-axis direction of the high-density cassette 9 (the surface on the side where the loader device 11 is provided).
  • the notfer station 7 stores the substrate W received from the loader device 11 in a single sheet at an arbitrary position of the high-density cassette 9, or an arbitrary substrate W stored in the high-density cassette 9.
  • a buffer station side auxiliary section 23 is provided for taking out from the high density cassette 9 and transferring it to the loader device 11.
  • the noffer station side auxiliary unit 23 arranges the auxiliary unit 29 on one side in the Y-axis direction of the high-density cassette 9 and arranges the auxiliary unit 29 in the same manner as the auxiliary unit 29 in the high-density cassette 9. Arranged on the other side in the Y-axis direction, that is, constituted by a pair of auxiliary units 29. Further, the pair of auxiliary units 29 are provided for each high-density cassette 9. Therefore, since the buffer station 7 shown in FIG. 1 includes two high-density cassettes 9, it includes two pairs of auxiliary units (four auxiliary units) 29.
  • the auxiliary unit 29 includes a base member 31 that is V and is fixed to the floor surface on which the substrate transfer system 1 is installed.
  • a Y-axis carriage 35 formed in a plate shape and extending in the horizontal direction is movable in the Y-axis direction on the upper surface of the base member 31 (a flat upper surface extending in the horizontal direction!).
  • a rail (not shown) is provided integrally with the base member 31 and a bearing (not shown) is provided via a linear guide bearing (not shown) provided integrally with the Y-axis carriage 35.
  • the Y-axis carriage 35 is supported by the base member 31.
  • the Y-axis carriage 35 can be moved and positioned in the Y-axis direction by means of an actuator such as a servo motor and a ball screw.
  • a plurality of notches 37 are provided at predetermined intervals in the X-axis direction on the tip end side (high-density cassette 9 side) of the Y-axis carriage 35.
  • the notch 37 is provided on the tip side of the Y-axis carriage 35, and a cylindrical small-diameter roller 41 for placing and transporting the substrate W is rotated in each part 39. It is provided freely.
  • Each of the rollers 41 is provided at the same height so that the rotation center axis extends in the Y-axis direction, and is supported by the Y-axis carriage 35 by a bearing (not shown) and is not shown.
  • a power transmission member such as a gear, each of them is rotated synchronously by an actuator (not shown) such as a motor!
  • each portion 39 of the Y-axis carriage 35 is provided with buffer station side air float means 43 for supporting the weight of the substrate W transported by these rollers 41. It has been.
  • the air float means 43 on the noffer station side includes, for example, a thin plate-like support member 45 formed of a ceramic material having air permeability, and is supplied by compressed air supply means (not shown).
  • the compressed air jetted from the support member 45 can support the weight of the substrate W in a non-contact state with the substrate W.
  • the support member 45 is provided further on the tip side (high density cassette 9 side) than the roller 41. Further, the upper surface of the support member 45 is located slightly below the upper end of the roller 41, and the height of the lower surface of the support member 45 and the height of the lower end of the roller 41 are almost equal to each other. I'm doing it.
  • the support member 45 may be made of a breathable sintered metal or the like instead of the breathable ceramics. Further, a member such as a metal that is not air permeable and is filled with a material is used, and a plurality of holes are provided in the member such as a metal, and the hole force compressed air is ejected to support the substrate W. Even so, ⁇ ⁇ .
  • ultrasonic float means for levitation of the substrate W using ultrasonic waves may be employed.
  • the ultrasonic float means vibrates the substrate support member with an ultrasonic vibrator.
  • the weight of the substrate W is supported by a thin air film formed between the substrate W and the substrate support member.
  • the ultrasonic float means includes an ultrasonic wave generating element (for example, a piezo element).
  • a horn for amplifying vibration generated by the ultrasonic wave generating element is provided above the ultrasonic wave generating element.
  • the substrate support member is connected via the connecting member. Located at the top of the horn!
  • the vibration generated by the ultrasonic wave generating element is transmitted to the substrate support member, and the substrate support member vibrates mainly in the thickness direction of the substrate W, whereby the substrate W and the substrate support described above are supported.
  • Radiation pressure using air as a medium Radiation pressure due to air dense waves
  • This radiation pressure generates a thin air film between the substrate W and the substrate support member,
  • the weight of the substrate w can be supported by the substrate support member.
  • the nother station 7 is provided with a cassette movement positioning device 33 on which the high density cassette 9 is placed and the placed high density force set 9 can be moved and positioned in the Z-axis direction.
  • This cassette movement positioning device 33 is configured to include a portion where the high-density cassette 9 is directly placed and a portion where the high-density cassette 9 is not directly placed.
  • the portion to be mounted is directly mounted via a linear guide bearing or the like, and is supported so as to be movable in the Z-axis direction with respect to the portion. Further, the position of the direct placement can be freely determined in the Z-axis direction by an actuator such as a servo motor and a ball screw.
  • the roller 41 and the support member 45 enter the high-density cassette 9
  • the side member 25 of the high-density cassette 9 enters the notch 37 between the roller 41 and the support member 45.
  • the auxiliary utens 29 provided on both sides of the high-density cassette 9 in the Y-axis direction operate in synchronization with each other.
  • the high-density cassette 9 since the height of the roller 41 and the support member 45 (dimension in the Z-axis direction) is kept low, the high-density cassette 9
  • the roller 41 and the support member 45 may enter between any two substrates W even if each substrate w is stored at a narrow interval in the vertical direction (a narrow interval between the robot hand and the robot hand). I can do it.
  • sorting source cassette 3 the sorting destination cassette 5, the loader device 11, the sorting source cassette side auxiliary unit 17, and the sorting destination cassette side auxiliary unit 19 will be described in detail with examples.
  • the sorting source cassette 3 is placed, and the placed sorting source cassette 3 can be moved and positioned in the Z-axis direction (the force set moving positioning device 33). 14 is provided.
  • the cassette movement positioning device 14 is configured in substantially the same manner as in FIG.
  • the sorting station 15 is also provided with a similar cassette movement positioning device 16.
  • the substrate sorting system 1 will be further described.
  • FIG. 7 is a plan view showing a schematic configuration of the substrate sorting system 1 and corresponds to FIG.
  • FIG. 8 is a side view showing a schematic configuration of the substrate sorting system 1, is a view taken along the line VIII in FIG. 7, and corresponds to FIG.
  • the sorting source cassette 3 is configured in substantially the same manner as the high-density cassette 9, for example, and has substantially the same outer shape.
  • the sorting destination cassette 5 is configured in the same manner as the sorting source cassette 3.
  • the sorting source cassette 3 and the sorting destination cassette 5 are arranged on one side of the loader device 11 in the X-axis direction.
  • a high-density cassette 9 is arranged on the other side in the X-axis direction.
  • the sorting source cassette side auxiliary unit 17 is configured by sorting source air float means 47 configured in the same manner as the buffer station side air float means 43.
  • the sorting source air float means 47 includes, for example, a plurality of support members 49 provided at intervals in the X-axis direction. Each support member 49 can eject air from the upper surface of each support member 49. [0068] Then, under the control of the control device, the sorting source cassette 3 is appropriately moved and positioned in the Z-axis direction by the cassette moving positioning device 14, and air is ejected from the support member 49, whereby the sorting source cassette 3 The weight of the substrate W stored at the bottom of 3 can be supported.
  • the sorting destination cassette side auxiliary section 19 is also configured in the same manner as the sorting source cassette side auxiliary section 17 and operates in substantially the same manner.
  • the loader device 11 includes a sorter cassette for carrying the substrate W between the loader device 11, the sorter cassette 3 and the sorter cassette 5; 51 is provided.
  • the loader device 11 is provided with a high-density cassette-side substrate transfer means 53 for transferring the substrate W between the loader device 11 and the high-density cassette 9.
  • the loader device 11 includes a base member 57 at the bottom.
  • the base member 57 is supported by a linear guide bearing 59, and can be moved and positioned in the Y-axis direction by an actuator such as a servo motor and a ball screw.
  • a side member 61 is erected on the upper surface of the base member 57 (a flat upper surface extending in the horizontal direction).
  • the side members 61 are provided on both ends of the base member 57 in the Y-axis direction.
  • the sorting source cassette side substrate transfer means 51 includes a transfer node support member 63 provided between the side members 61.
  • An “L” -shaped hand member 67 is provided on the upper portion of the transfer hand support member 63.
  • the node member 67 is movably supported by the transfer node and node support member 63 via a linear guide bearing (not shown) or the like.
  • the hand member 67 can be moved and positioned in the X-axis direction by an actuator such as a servo motor and a ball screw.
  • a suction cup 71 which is an example of a holding means capable of sucking and holding the lower surface of the substrate W, is provided in a body. Instead of holding by the suction cup 71, the end of the substrate W may be held, for example, sandwiched between them.
  • loader air float means 69 is provided above the transfer node support member 63.
  • the loader air float means 69 is integrated with the transfer node support member 63.
  • the plurality of support members 70 are provided. The upper surface of each support member 70 is located slightly below the upper surface of the suction cup 71.
  • each support member 70 is configured such that the upper surface force of each support member 49 can also eject air.
  • the transfer node and end support member 63 are appropriately positioned in the height direction, and the hand member 67 overhangs from the transfer node and end support member 63, and the sorting source cassette 3 or the sorting destination cassette 5 If it extends to the side (right side of FIG. 8), the suction cup 71 can hold the lower surface of the end of the substrate W of the sorting source cassette 3.
  • the high-density cassette side substrate transfer means 53 includes a competitor base member 73.
  • the conveyor base member 73 is supported by the side members 61 via the linear guide bearings 65 between the side members 61. Further, the compressor base member 73 can be moved and positioned in the Z-axis direction by an actuator such as a servo motor and a ball screw.
  • a plurality of roller support members 75 are integrally provided on the upper surface of the competitor base member 73 (a flat upper surface extending in the horizontal direction! /). These roller support members 75 are provided, for example, at intervals in the Y-axis direction. Further, a plurality of rollers 77 constituting a competitor for placing the substrate W are provided at the upper end portion of each roller support member 75.
  • each roller 77 extends in the Y-axis direction, and each roller 77 rotates synchronously via a power transmission member such as an actuator gear such as a motor, or The clutch is separated from the motor so that each can rotate freely.
  • each roller support member 75, and each roller 77 include a transfer handle. Move between the position where the upper end of each roller 77 is slightly higher than the upper end of the suction cup 71. It has become possible to do. In addition, in a state where the upper end of each roller 77 is positioned above the upper end of the suction cup 71, each roller support member 75 and each roller 77 penetrate through the transfer hand support member 63. Through the hole!
  • each roller 77 and the upper end of each roller 41 of the notch station side auxiliary portion 23 at a position where the upper end of each roller 77 is slightly higher than the upper end of the suction cup 71 are: It is the same height.
  • each roller 77 and each roller 41 are appropriately rotated.
  • the reverse operation may be performed.
  • an ID input means for inputting the ID of the substrate W stored in the sorting source cassette 3 and the ID input by the ID input means are used.
  • the control device (not shown) moves the substrates W sorted into the sorting cassette 5.
  • RFID Radio Frequency
  • the information on the substrate W stored in the tag (not shown) (information on each substrate stored in the sorting cassette 3; information on the type of the substrate W, the quality of the substrate W, etc.)
  • the control device reads and inputs the information via an antenna (not shown), and the inputted information of each substrate W is stored in a storage means (not shown).
  • the information on the substrate W is stored in the RFID tag in advance in a pre-process or the like that is stored in the sorting source cassette 3 and processed into each substrate W.
  • different types of substrates W are randomly stored in the sorting source cassette 3, for example.
  • the substrate W stored in the sorting source cassette 3 is moved to the buffer station 7, the substrate W is stored (loaded) at an arbitrary position of the high-density cassette 9. If there is no more substrate W stored in the sorting source cassette 3, the substrate W And replace it with the next sorting source cassette 3 as appropriate.
  • the predetermined number of accumulated substrates W are collected into the sorting destination cassette. Move to 5. At this time, the arbitrary position force substrate W of the koffa station 7 is carried out. Therefore, only the same type of substrates W accumulated in the predetermined number can be moved to the sorting cassette 5, and the sorting of the substrates W can be performed.
  • the sorting destination cassette 5 is replaced with the next cassette to prepare for the next sorting of the same type of substrates W.
  • the control device obtains information on the substrate W by using a barcode attached to the sorting source cassette 3 or a barcode attached to each substrate W. May be. Furthermore, it is also possible to connect the control device to a network and obtain information on the board W via the network.
  • a plurality of sorting destination cassettes 5 can be installed in the sorting destination station 15 of the substrate sorting system 1. Then, after storing the sorted substrates W in one sorting destination cassette 5 of each of the sorting destination cassettes 5 installed, the other sorting destination cassette in each of the sorting destination cassettes 5 is completed. It is configured to be able to continue sorting into 5.
  • the other sorting destination cassettes 5 among the set sorting destination cassettes 5 are standby cassettes.
  • the substrate sorting system 1 is provided with a stocker 79 on which the sorting destination cassette 5 can be placed.
  • a crane not shown
  • a sorting cassette moving robot or the like between the sorting station 15 and the stocker 79, the sorting cassette 5 can be moved appropriately.
  • FIGS. 9 to 14 are diagrams for explaining the operation of the substrate sorting system 1.
  • the substrate sorting system 1 is operated under the control of the control device. Before the substrate sorting system 1 starts operating, for example, various types of substrates W
  • the stored sorting cassette 3 is installed in the sorting station 13, and the empty sorting cassette 5 that does not contain the substrate W is installed in the sorting station 15, and the high-density cassette 9 It is assumed that the board W is empty without containing it.
  • the hand member 67 is positioned on the high density cassette 9 side (left side in FIG. 9).
  • the sorting cassette 3 has a height where the upper end of the suction cup 71 is located lower than the bottom surface of the substrate W stored in the lowermost side of the sorting cassette 3 (the upper surface of the support member 49 is also separated from the sorting cassette 3).
  • the bottom surface of the substrate W stored in the lowermost part of the substrate is also located at a lower height away).
  • the roller 77 is located below the transfer hand support member 63.
  • the hand member 67 is moved to the sorting source cassette 3 side (the right side in FIG. 9), and the lower surface of the substrate W stored in the lowermost side of the sorting source cassette 3 is the suction cup 71.
  • the sorting cassette Move 3 downward as appropriate.
  • the suction cup 71 holds the lower end portion (the lower end portion on the loader device 11 side) of the substrate W stored in the lowermost side of the sorting source cassette 3, and the upper surface force of the support member 49 is blown out. Then, the substrate W stored in the lowermost side of the sorting source cassette 3 is slightly raised (see FIG. 10).
  • the hand member 67 is moved to the high-density force set 9 side (left side in FIG. 10) while the upper surface force of the support member 70 blows out air, and the substrate W is carried out from the sorting source cassette 3.
  • the substrate W after unloading is located almost directly above the transfer support member 63 (see FIGS. 11 and 12).
  • each roller 77 is raised so that the height of the upper end of each roller 77 is substantially equal to the height of the lower surface of the substrate W (the height of the upper end of each roller 77 is the height of the upper surface of the support member 70). (Slightly above), the rollers 77 support the lower surfaces of both side portions of the substrate W, and release the holding of the substrate W by the suction cup 71 (see FIG. 12).
  • the hand member 67 and the like are not shown in order to prevent the drawing from being seen.
  • the high-density cassette 9 is positioned at an appropriate height, the roller 41 and the support member 45 are inserted into the high-density cassette 9, and the roller 77 and the roller 41 are driven to rotate. Then, the substrate W is carried into the high-density cassette 9 (see FIG. 13).
  • the high-density cassette 7 is slightly raised, and the loaded substrate W is placed on the wire 27 of the high-density cassette 9. After this, the state returns to almost the same state as shown in FIG.
  • the accumulated predetermined number of substrates W are moved to the sorting destination cassette 5. This movement is performed in substantially the opposite manner to the movement of transferring the substrate from the sorting source cassette 3 to the high-density cassette 9 as described above.
  • the substrate W is also unloaded from any position force of the koffa station 7. Therefore, only the same type of substrates W accumulated in the predetermined number can be moved to the sorting cassette 5 and sorting of the substrates W can be performed.
  • the sorting destination cassette 5 is replaced with the next cassette to prepare for sorting of the next same type of substrates W.
  • the substrate sorting system 1 when a predetermined number of specific varieties are accumulated in the notifier station 7, only this predetermined number of substrates W need to be transferred to the sorting destination cassette 5, so that the sorting cassette 5 It is not necessary to exchange the sorting cassette 5 between the machine and the stocker 79, and the sorting of the substrates W can be performed efficiently. Further, since a large number of substrates W can be stored in the noffer station 7, it is possible to avoid an increase in the size of the noffer station and to reduce the size of the substrate sorting system 1.
  • the installation area of the substrate sorting system 1 can be reduced. If the installation area of the substrate sorting system 1 can be reduced, the size of the clean room itself, which is an expensive facility, can be reduced when the substrate sorting system 1 is used in a clean room.
  • the substrate sorting system 1 can be configured to move the substrate W sorted into the sorting cassette 5 based on the input ID, so that the substrate sorting system 1 can be further automated. Assortment of substrates W can be performed more efficiently and accurately. Can be performed.
  • the loader device 11 can be operated even when the substrate transfer destination sorting cassette 5 is changed. Efficient sorting of substrates W without having to interrupt
  • FIG. 14 is a side view showing a schematic configuration of the substrate sorting system 101 according to the second embodiment of the present invention, and corresponds to FIG.
  • the substrate sorting system 101 according to the second embodiment is configured to transfer the substrate W between the sorting source cassette 3 and the loader device 11 and between the sorting destination cassette 5 and the loader device 11 with a roller.
  • the other points are configured in the same manner as the substrate sorting system 1 and have almost the same effects.
  • the transfer hand support member 63, the hand member 67, the suction cup 71, and the like are omitted, and the auxiliary portions 17 and 19 each include a roller 102 that is rotationally driven by an actuator. It is configured. Note that the height of the upper end of each roller 102, the height of the upper end of each roller 77, and the height of the upper end of each roller 41 coincide with each other. Then, by driving each of the rollers 77 and 102 as appropriate, the substrate W is transported between the sorting source cassette 3 and the loader device 11 and between the sorting destination cassette 5 and the loader device 11. ing.
  • FIG. 15 is a plan view showing a schematic configuration of the substrate sorting system 110 according to the third embodiment of the present invention, and corresponds to FIG.
  • the substrate sorting system 110 is configured to transfer the substrate W between the loader device 11 and the high-density cassette 9 in the same manner as the hand member 67 and the suction cup 71. This is because the hand member 67a and the suction cup 71a provided on the support member 63 are used. Unlike the substrate sorting system 1 according to the first embodiment, the other points are substantially the same as those of the substrate sorting system 1 and have substantially the same effects.
  • the substrate sorting system (not shown) according to the fourth embodiment is opposite to the substrate sorting system 1 according to the first embodiment, between the sorting source cassette 3 and the loader device 11, and the sorting destination cassette.
  • the substrate W is transported between the loader device 11 and the loader device 11 by a compressor using a roller that is rotated by an actuator, and the substrate W is transported between the high-density cassette 9 and the loader device 11 at a node.
  • member 67a and suction cup 71a Using member 67a and suction cup 71a
  • FIG. 16 is a plan view showing a schematic configuration of a substrate sorting system 130 according to the fifth embodiment of the present invention, and corresponds to FIG.
  • FIG. 17 is a side view showing a schematic configuration of the substrate sorting system 130 according to the fifth embodiment of the present invention, and is a view showing an arrow XVII in FIG.
  • the substrate sorting system 130 according to the fifth embodiment is arranged between the sorting source cassette 3 and the main body portion 17 of the loader device 11, and between the sorting destination cassette 5 and the main body portion 17 of the loader device 11. Unlike the substrate sorting system 1 according to the first embodiment, the substrate W is transported using the substrate transfer node 132, and the other points are almost the same as the substrate sorting system 1. Consists of the same effects.
  • a comb that can be moved and positioned in the X-axis direction by an actuator with respect to the transfer node support member 63a configured in substantially the same manner as the transfer node support member 63.
  • a substrate transfer node 132 is provided. Then, the substrate transfer hand 132 is inserted into the sorting source cassette 3 and the sorting destination cassette 5 so that the substrate W can be placed and transported. Note that a roller 136 for supporting the weight of the substrate W is provided on the upper surface of the transfer node support member 63a on the high density cassette 9 side. The substrate W is supported at 136, and the substrate W can be transported smoothly! /.
  • a normal cassette that supports the substrate W at both ends in the Y-axis direction, which is different from the wire cassette, is adopted.
  • the substrate sorting system (not shown) according to the sixth embodiment is configured in the same manner as the hand member 67 and the suction cup 71 for transporting the substrate W between the main body portion 17 of the loader device 11 and the high-density cassette 9.
  • the transfer member and the hand member 67a and the suction cup 71a (see FIG. 15) provided on the support member 63 are different from the substrate sorting system 130 according to the fifth embodiment.
  • the point is configured in substantially the same manner as the substrate sorting system 130 and has substantially the same effect.
  • rollers 41 are deleted as in the substrate sorting system 110 according to the third embodiment.
  • the sorting source cassette 3, the sorting destination cassette 5, and the high-density cassette 9 are moved up and down to carry in and out the substrate W.
  • the sorting source cassette 3 the sorting cassette 5 and the high-density cassette 9 may be fixed in the height direction, and the substrate W may be loaded and unloaded by moving the transfer hand support member 63 and the like in the vertical direction.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

L'invention propose un système (1) d'assortiment de substrats destiné à assortir en cassettes d'assortiments (5) une pluralité de substrats (W) logés dans une cassette source (3) d'assortiments. Le système (1) d'assortiment de substrats comprend un poste tampon (7) capable de loger les substrats (W) dans des positions arbitraires et un dispositif de chargement (11) qui transfère les substrats (W) en feuilles entre les différentes cassettes (3, 5) et le poste tampon (7).
PCT/JP2006/319792 2006-10-03 2006-10-03 système de transfert de substrats WO2008041326A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008537383A JP4992906B2 (ja) 2006-10-03 2006-10-03 基板搬送システム
KR20097008932A KR101183042B1 (ko) 2006-10-03 2006-10-03 기판 반송 시스템
PCT/JP2006/319792 WO2008041326A1 (fr) 2006-10-03 2006-10-03 système de transfert de substrats
CN200680056004.5A CN101511709B (zh) 2006-10-03 2006-10-03 基板输送系统
TW095142274A TW200817259A (en) 2006-10-03 2006-11-15 Substrate transfer system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/319792 WO2008041326A1 (fr) 2006-10-03 2006-10-03 système de transfert de substrats

Publications (1)

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WO2008041326A1 true WO2008041326A1 (fr) 2008-04-10

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JP (1) JP4992906B2 (fr)
KR (1) KR101183042B1 (fr)
CN (1) CN101511709B (fr)
TW (1) TW200817259A (fr)
WO (1) WO2008041326A1 (fr)

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JP2010067925A (ja) * 2008-09-12 2010-03-25 Daifuku Co Ltd 基板搬送設備
JP2010067706A (ja) * 2008-09-09 2010-03-25 Shin Etsu Polymer Co Ltd 収納容器、ウェーハ移載システム及びウェーハ移載方法
JP2010208843A (ja) * 2009-03-12 2010-09-24 Ihi Corp 基板仕分け装置及び基板仕分け方法
JP2020065077A (ja) * 2013-03-14 2020-04-23 ブルックス オートメーション インコーポレイテッド ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法
JP2021522140A (ja) * 2018-05-04 2021-08-30 ヘグラ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コー． カーゲーＨｅｇｌａ Ｇｍｂｈ ＆ Ｃｏ． Ｋｇ プレート状のオブジェクト（好ましくはガラスパネルカット片）を仕分けるための仕分け方法および装置、このタイプの仕分け装置を用いてガラスパネルカット片を製造するための方法および装置

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JP6033593B2 (ja) * 2012-07-18 2016-11-30 東レエンジニアリング株式会社 基板搬送装置
JP6607744B2 (ja) * 2015-09-04 2019-11-20 リンテック株式会社 供給装置および供給方法
CN108144863B (zh) * 2016-12-02 2022-05-10 比雅斯股份公司 家具行业的面板生产线中精益生产的优化制造方法和系统
CN109382331B (zh) * 2017-08-11 2021-08-06 上海微电子装备（集团）股份有限公司 一种基于tray盘的物料分拣装置以及分拣方法
CN108792620B (zh) * 2018-06-19 2020-06-30 信义环保特种玻璃（江门）有限公司 自动堆垛系统和方法
JP7191472B2 (ja) * 2019-01-25 2022-12-19 株式会社ディスコ 加工装置の使用方法

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JPS62252148A (ja) * 1986-04-24 1987-11-02 Nec Corp ウエハの並べ換え装置
JP3185595B2 (ja) * 1995-04-03 2001-07-11 株式会社ダイフク 基板仕分け装置を備えた荷保管設備
JP2004075203A (ja) * 2002-08-09 2004-03-11 Dainippon Printing Co Ltd バッファ装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067706A (ja) * 2008-09-09 2010-03-25 Shin Etsu Polymer Co Ltd 収納容器、ウェーハ移載システム及びウェーハ移載方法
JP2010067925A (ja) * 2008-09-12 2010-03-25 Daifuku Co Ltd 基板搬送設備
JP2010208843A (ja) * 2009-03-12 2010-09-24 Ihi Corp 基板仕分け装置及び基板仕分け方法
JP2020065077A (ja) * 2013-03-14 2020-04-23 ブルックス オートメーション インコーポレイテッド ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法
JP7053689B2 (ja) 2013-03-14 2022-04-12 ブルックス オートメーション インコーポレイテッド ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法
JP2021522140A (ja) * 2018-05-04 2021-08-30 ヘグラ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コー． カーゲーＨｅｇｌａ Ｇｍｂｈ ＆ Ｃｏ． Ｋｇ プレート状のオブジェクト（好ましくはガラスパネルカット片）を仕分けるための仕分け方法および装置、このタイプの仕分け装置を用いてガラスパネルカット片を製造するための方法および装置
JP7361100B2 (ja) 2018-05-04 2023-10-13 ヘグラ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コー． カーゲー プレート状のオブジェクト（好ましくはガラスパネルカット片）を仕分けるための仕分け方法および装置、このタイプの仕分け装置を用いてガラスパネルカット片を製造するための方法および装置

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KR101183042B1 (ko) 2012-09-20
TWI325402B (fr) 2010-06-01
JP4992906B2 (ja) 2012-08-08
JPWO2008041326A1 (ja) 2010-02-04
TW200817259A (en) 2008-04-16
CN101511709B (zh) 2013-03-20
KR20090077814A (ko) 2009-07-15
CN101511709A (zh) 2009-08-19

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