JP6033593B2 - 基板搬送装置 - Google Patents
基板搬送装置 Download PDFInfo
- Publication number
- JP6033593B2 JP6033593B2 JP2012159165A JP2012159165A JP6033593B2 JP 6033593 B2 JP6033593 B2 JP 6033593B2 JP 2012159165 A JP2012159165 A JP 2012159165A JP 2012159165 A JP2012159165 A JP 2012159165A JP 6033593 B2 JP6033593 B2 JP 6033593B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- air
- diaphragm
- guide
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
Description
2 基板
12 ステージ
30 基板ガイド
31 基板ガイド本体
32 ガイド支持部
32a アーム部
34 基板当接部
50 浮上ユニット
55 エアパッド部
55a エア排出部
70 エア抜き流路
71 環状溝
72 貫通穴
Claims (4)
- 超音波振動させた振動板上に超音波振動浮上させた基板を基板ガイドで把持しつつ、基板ガイドを走行させることにより、基板を浮上させたまま搬送させる基板搬送装置であって、
前記基板ガイドは、基板に当接する基板当接部と、
この基板当接部を振動板から所定の高さ位置に浮上させる浮上ユニットと
を有しており、
前記浮上ユニットは、振動板に向かってエアを排出するエア排出部を有するエアバッド部と、エア排出部から排出されたエアを逃がすエア抜き流路とを有しており、
前記エア抜き流路は、少なくとも前記エア排出部と前記基板当接部に当接された基板との間に設けられ、エアパッド部と振動板とで形成される隙間に開口し、エアパッド部と振動板とで形成される隙間のエアを当該基板の高さ位置よりも高い位置に向かって逃がすように形成されていることを特徴とする基板搬送装置。 - 前記エア抜き流路は、その圧力損失が、前記エアパッド部と前記振動板とによって形成される隙間の圧力損失よりも小さくなるように形成されていることを特徴とする請求項1に記載の基板搬送装置。
- 前記エア抜き流路は、エア排出部を外側から囲む環状溝と、この環状溝から上方に貫通する貫通穴とを有していることを特徴とする請求項1又は2に記載の基板搬送装置。
- 前記振動板の下側には、ヒータユニットが設けられており、このヒータユニットにより基板上に形成された塗布膜を乾燥させることを特徴とする請求項1〜3のいずれかに記載の基板搬送装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012159165A JP6033593B2 (ja) | 2012-07-18 | 2012-07-18 | 基板搬送装置 |
TW102119741A TWI557835B (zh) | 2012-07-18 | 2013-06-04 | Substrate delivery device |
KR1020130082827A KR20140011472A (ko) | 2012-07-18 | 2013-07-15 | 기판 반송 장치 |
CN201310297548.2A CN103579062B (zh) | 2012-07-18 | 2013-07-16 | 基板输送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012159165A JP6033593B2 (ja) | 2012-07-18 | 2012-07-18 | 基板搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014022532A JP2014022532A (ja) | 2014-02-03 |
JP6033593B2 true JP6033593B2 (ja) | 2016-11-30 |
Family
ID=50050552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012159165A Expired - Fee Related JP6033593B2 (ja) | 2012-07-18 | 2012-07-18 | 基板搬送装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6033593B2 (ja) |
KR (1) | KR20140011472A (ja) |
CN (1) | CN103579062B (ja) |
TW (1) | TWI557835B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105151780B (zh) * | 2015-08-28 | 2018-11-23 | 武汉华星光电技术有限公司 | 一种超声波传送装置 |
JP6629876B2 (ja) * | 2015-10-27 | 2020-01-15 | 平田機工株式会社 | 移送ユニット、移載装置及び移載方法 |
KR101865274B1 (ko) * | 2016-08-31 | 2018-06-07 | 씨디에스(주) | 경사구조를 이용한 기판 부상 이송장치 |
CN106784411B (zh) * | 2017-03-09 | 2018-11-23 | 京东方科技集团股份有限公司 | 一种薄膜流平设备 |
KR101936427B1 (ko) * | 2017-06-19 | 2019-01-08 | 세메스 주식회사 | 이송 가이드 어셈블리 및 이를 포함하는 기판 이송 장치 |
KR101958111B1 (ko) * | 2017-09-29 | 2019-03-14 | 씨디에스(주) | 경사구조를 이용한 기판 부상 이송장치 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0380962A (ja) * | 1989-08-25 | 1991-04-05 | Hitachi Ltd | 塗布装置 |
JPH09132309A (ja) * | 1995-11-09 | 1997-05-20 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JP4608954B2 (ja) * | 2004-06-09 | 2011-01-12 | 株式会社Ihi | 搬送装置 |
JP2006282345A (ja) * | 2005-04-01 | 2006-10-19 | Hiroshi Akashi | 非接触搬送装置 |
JP4992906B2 (ja) * | 2006-10-03 | 2012-08-08 | 株式会社Ihi | 基板搬送システム |
JP2008212804A (ja) * | 2007-03-02 | 2008-09-18 | Tokyo Ohka Kogyo Co Ltd | 基板の搬送塗布装置 |
JP2008260591A (ja) * | 2007-04-10 | 2008-10-30 | Nippon Sekkei Kogyo:Kk | 薄板状材料搬送装置及び方法 |
WO2009063562A1 (ja) * | 2007-11-15 | 2009-05-22 | Hirata Corporation | 基板搬送装置 |
JP5099435B2 (ja) * | 2008-03-05 | 2012-12-19 | 独立行政法人国立高等専門学校機構 | 非接触搬送装置 |
JP5122350B2 (ja) * | 2008-04-09 | 2013-01-16 | ピー・エス・シー株式会社 | 板材用気体圧支持機構 |
JP5344690B2 (ja) * | 2009-03-11 | 2013-11-20 | 東レエンジニアリング株式会社 | 減圧乾燥装置 |
JP2010238986A (ja) * | 2009-03-31 | 2010-10-21 | Nikon Corp | 露光装置及びデバイスの製造方法 |
JP5081261B2 (ja) * | 2010-02-24 | 2012-11-28 | 東京エレクトロン株式会社 | 塗布装置 |
JP2011213435A (ja) * | 2010-03-31 | 2011-10-27 | Toray Eng Co Ltd | 搬送装置及び塗布システム |
TW201214609A (en) * | 2010-09-27 | 2012-04-01 | Toray Eng Co Ltd | Substrate conveying apparatus |
JP2012091122A (ja) * | 2010-10-27 | 2012-05-17 | Toray Eng Co Ltd | 塗布システム |
-
2012
- 2012-07-18 JP JP2012159165A patent/JP6033593B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-04 TW TW102119741A patent/TWI557835B/zh not_active IP Right Cessation
- 2013-07-15 KR KR1020130082827A patent/KR20140011472A/ko not_active Application Discontinuation
- 2013-07-16 CN CN201310297548.2A patent/CN103579062B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN103579062B (zh) | 2017-07-28 |
KR20140011472A (ko) | 2014-01-28 |
TWI557835B (zh) | 2016-11-11 |
JP2014022532A (ja) | 2014-02-03 |
CN103579062A (zh) | 2014-02-12 |
TW201405698A (zh) | 2014-02-01 |
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