JP2021041472A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2021041472A JP2021041472A JP2019163637A JP2019163637A JP2021041472A JP 2021041472 A JP2021041472 A JP 2021041472A JP 2019163637 A JP2019163637 A JP 2019163637A JP 2019163637 A JP2019163637 A JP 2019163637A JP 2021041472 A JP2021041472 A JP 2021041472A
- Authority
- JP
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- Prior art keywords
- wafer
- scratch
- back surface
- polishing
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Abstract
Description
11a 表面
11b 裏面
13 分割予定ライン(ストリート)
15 デバイス
17 保護部材
19 ダメージ層(ゲッタリング層)
19a 傷(研磨痕)
2 加工装置(研削装置、研磨装置)
4 基台
4a 開口
4b,4c カセット載置台
6 搬送ユニット(搬送機構)
8,10 カセット
12 位置合わせ機構(アライメント機構)
14 搬送ユニット(搬送機構、ローディングアーム)
16 ターンテーブル
18 チャックテーブル(保持テーブル)
18a 保持面
20 支持構造
22 Z軸移動機構
24 Z軸ガイドレール
26 Z軸移動プレート
28 Z軸ボールネジ
30 Z軸パルスモータ
32a,32b 研削ユニット
34 ハウジング
36 スピンドル
38a,38b 研削ホイール
40 支持構造
42 XZ軸移動機構
44 第1ガイドレール
46 第1移動プレート
48 第1ボールネジ
50 第1パルスモータ
52 第2ガイドレール
54 第2移動プレート
56 第2ボールネジ
58 第2パルスモータ
60 研磨ユニット
62 ハウジング
64 スピンドル
66 研磨パッド
68 搬送ユニット(搬送機構、アンローディングアーム)
70 洗浄ユニット(洗浄機構)
72 傷判定ユニット
74 筐体
74a 開口
76 制御ユニット(制御部)
78 報知ユニット(報知部)
80 基台
82 研削砥石
84 基台
86 研磨層
90 チャックテーブル(保持テーブル)
90a 保持面
92 カメラ(撮像ユニット)
94 照明
96 判定部(判定ユニット)
98 画像処理部
100 記憶部
Claims (4)
- 表面側にデバイスが形成されたウェーハの裏面側を研磨する加工装置であって、
該ウェーハを保持して回転するチャックテーブルと、
該チャックテーブルによって保持された該ウェーハの裏面側に砥粒を含む研磨パッドを回転させながら押圧することにより、該ウェーハの裏面側を研磨しつつ該ウェーハの裏面側に傷を形成する研磨ユニットと、
該研磨ユニットによって研磨された該ウェーハの裏面側における該傷の有無を判定する傷判定ユニットと、
該傷判定ユニットによって該傷が存在しないと判定された領域が該ウェーハに含まれる場合に、該ウェーハに該傷が存在しない領域が含まれることを報知する報知ユニットと、を備えることを特徴とする加工装置。 - 該傷判定ユニットは、該ウェーハを撮像して該ウェーハの裏面側の画像を取得するカメラを備え、
該傷判定ユニットは、該傷が存在する領域での光の乱反射によって該画像に生じる、該傷が存在する領域と該傷が存在しない領域との濃淡の差に基づき、該傷の有無を判定することを特徴とする請求項1記載の加工装置。 - 該傷判定ユニットは、該ウェーハの裏面側の全体に対して、該傷の有無の判定を行うことを特徴とする請求項1又は2記載の加工装置。
- 該チャックテーブルによって保持された該ウェーハの裏面側を研削して該ウェーハを所定の厚さに薄化する研削ユニットを更に備えることを特徴とする請求項1乃至3のいずれかに記載の加工装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019163637A JP2021041472A (ja) | 2019-09-09 | 2019-09-09 | 加工装置 |
KR1020200108585A KR20210030198A (ko) | 2019-09-09 | 2020-08-27 | 가공 장치 |
US17/010,343 US11673229B2 (en) | 2019-09-09 | 2020-09-02 | Processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019163637A JP2021041472A (ja) | 2019-09-09 | 2019-09-09 | 加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2021041472A true JP2021041472A (ja) | 2021-03-18 |
Family
ID=74850655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019163637A Pending JP2021041472A (ja) | 2019-09-09 | 2019-09-09 | 加工装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11673229B2 (ja) |
JP (1) | JP2021041472A (ja) |
KR (1) | KR20210030198A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4060885A1 (en) | 2021-03-15 | 2022-09-21 | Yokogawa Electric Corporation | Booster circuit |
WO2023047683A1 (ja) * | 2021-09-24 | 2023-03-30 | 株式会社Screenホールディングス | 研磨方法および基板処理装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3955674B2 (ja) * | 1998-03-19 | 2007-08-08 | 株式会社東芝 | 半導体ウェーハの製造方法及び半導体装置の製造方法 |
JP4871617B2 (ja) | 2006-03-09 | 2012-02-08 | 株式会社ディスコ | ウエーハの加工方法 |
JP5975654B2 (ja) * | 2011-01-27 | 2016-08-23 | Hoya株式会社 | 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法 |
US20140256068A1 (en) * | 2013-03-08 | 2014-09-11 | Jeffrey L. Franklin | Adjustable laser patterning process to form through-holes in a passivation layer for solar cell fabrication |
JP6637379B2 (ja) * | 2016-05-19 | 2020-01-29 | 株式会社ディスコ | ウエーハの評価方法 |
JP6752638B2 (ja) * | 2016-06-27 | 2020-09-09 | 株式会社ディスコ | 内部クラック検出方法、および内部クラック検出装置 |
JP6732382B2 (ja) * | 2016-10-12 | 2020-07-29 | 株式会社ディスコ | 加工装置及び被加工物の加工方法 |
KR20200029527A (ko) * | 2017-07-12 | 2020-03-18 | 도쿄엘렉트론가부시키가이샤 | 연삭 장치, 연삭 방법 및 컴퓨터 기억 매체 |
JP7194025B2 (ja) * | 2019-01-08 | 2022-12-21 | 三星電子株式会社 | ウェハ検査装置 |
-
2019
- 2019-09-09 JP JP2019163637A patent/JP2021041472A/ja active Pending
-
2020
- 2020-08-27 KR KR1020200108585A patent/KR20210030198A/ko active Search and Examination
- 2020-09-02 US US17/010,343 patent/US11673229B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4060885A1 (en) | 2021-03-15 | 2022-09-21 | Yokogawa Electric Corporation | Booster circuit |
WO2023047683A1 (ja) * | 2021-09-24 | 2023-03-30 | 株式会社Screenホールディングス | 研磨方法および基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
US20210069859A1 (en) | 2021-03-11 |
US11673229B2 (en) | 2023-06-13 |
KR20210030198A (ko) | 2021-03-17 |
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