KR20180058854A - 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법 - Google Patents

물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법 Download PDF

Info

Publication number
KR20180058854A
KR20180058854A KR1020187014458A KR20187014458A KR20180058854A KR 20180058854 A KR20180058854 A KR 20180058854A KR 1020187014458 A KR1020187014458 A KR 1020187014458A KR 20187014458 A KR20187014458 A KR 20187014458A KR 20180058854 A KR20180058854 A KR 20180058854A
Authority
KR
South Korea
Prior art keywords
substrate
holding
unit
section
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020187014458A
Other languages
English (en)
Korean (ko)
Inventor
야스오 아오키
도모히데 하마다
히로시 시라스
마나부 도구치
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20180058854A publication Critical patent/KR20180058854A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/22Exposing sequentially with the same light pattern different positions of the same surface
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70758Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816Bearings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49998Work holding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020187014458A 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법 Ceased KR20180058854A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US23549909P 2009-08-20 2009-08-20
US61/235,499 2009-08-20
US12/855,283 2010-08-12
US12/855,283 US20110042874A1 (en) 2009-08-20 2010-08-12 Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
PCT/JP2010/064134 WO2011021711A1 (en) 2009-08-20 2010-08-17 Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020127005322A Division KR101862001B1 (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020197033934A Division KR102184248B1 (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법

Publications (1)

Publication Number Publication Date
KR20180058854A true KR20180058854A (ko) 2018-06-01

Family

ID=43604681

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020187014458A Ceased KR20180058854A (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
KR1020197033934A Active KR102184248B1 (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
KR1020127005322A Active KR101862001B1 (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020197033934A Active KR102184248B1 (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
KR1020127005322A Active KR101862001B1 (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법

Country Status (6)

Country Link
US (1) US20110042874A1 (cg-RX-API-DMAC7.html)
JP (5) JP5776923B2 (cg-RX-API-DMAC7.html)
KR (3) KR20180058854A (cg-RX-API-DMAC7.html)
CN (4) CN105954982B (cg-RX-API-DMAC7.html)
TW (4) TWI686896B (cg-RX-API-DMAC7.html)
WO (1) WO2011021711A1 (cg-RX-API-DMAC7.html)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102022841B1 (ko) * 2009-08-20 2019-09-19 가부시키가이샤 니콘 물체 처리 장치, 노광 장치와 노광 방법, 및 디바이스 제조 방법
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US8598538B2 (en) 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
CN109324485A (zh) * 2011-08-30 2019-02-12 株式会社尼康 曝光方法、制造方法和基板处理方法
JP5464186B2 (ja) * 2011-09-07 2014-04-09 信越化学工業株式会社 フォトマスクブランク、フォトマスク及びその製造方法
KR101879162B1 (ko) * 2012-04-03 2018-07-16 가부시키가이샤 니콘 기판 처리 장치
JP5863149B2 (ja) * 2012-04-04 2016-02-16 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
NL2010679A (en) 2012-05-23 2013-11-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
TWI464795B (zh) * 2012-07-13 2014-12-11 Apone Technology Ltd 局部表面處理的遮罩方法
CN103572342B (zh) * 2012-07-23 2016-04-20 崇鼎科技有限公司 局部表面处理的屏蔽方法
DE102012219332B4 (de) * 2012-10-23 2014-11-13 Mdi Schott Advanced Processing Gmbh Vorrichtung und Verfahren zum Lagern und Fixieren einer Glasscheibe
US11311967B2 (en) * 2014-08-19 2022-04-26 Lumileds Llc Sapphire collector for reducing mechanical damage during die level laser lift-off
US10752449B2 (en) * 2015-03-30 2020-08-25 Nikon Corporation Object carrier device, exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, object carrying method, and exposure method
CN113204177A (zh) * 2015-03-31 2021-08-03 株式会社尼康 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法
JP6807334B2 (ja) * 2015-05-13 2021-01-06 ルミレッズ ホールディング ベーフェー ダイレベルのリフトオフの最中におけるメカニカルダメージを低減するためのサファイアコレクタ
KR102828061B1 (ko) * 2015-09-30 2025-07-01 가부시키가이샤 니콘 이동체 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법, 그리고 계측 방법
KR102676391B1 (ko) * 2015-09-30 2024-06-18 가부시키가이샤 니콘 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
US10520834B2 (en) 2015-09-30 2019-12-31 Nikon Corporation Movable body apparatus, exposure apparatus, manufacturing method of flat-panel display and device manufacturing method, and movement method of object
CN108139679B (zh) * 2015-09-30 2021-06-22 株式会社尼康 曝光装置、平面显示器的制造方法、组件制造方法、及曝光方法
CN106814551B (zh) * 2015-11-30 2019-04-12 上海微电子装备(集团)股份有限公司 一种基板交接装置及交接方法
US11860552B2 (en) 2016-07-01 2024-01-02 Asml Netherlands B.V. Stage system, lithographic apparatus, method for positioning and device manufacturing method
CN110114725B (zh) * 2016-09-30 2021-09-17 株式会社尼康 搬运装置、曝光装置、平板显示器的制造方法、以及元件制造方法
CN113238461B (zh) * 2016-09-30 2024-01-12 株式会社尼康 曝光装置、平板显示器的制造方法、元件制造方法、及曝光方法
JP6805018B2 (ja) * 2017-02-10 2020-12-23 東京エレクトロン株式会社 塗布装置、および塗布方法
KR102630304B1 (ko) * 2017-03-31 2024-01-26 가부시키가이샤 니콘 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 및, 디바이스 제조 방법
JP6573131B2 (ja) * 2017-04-19 2019-09-11 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6983578B2 (ja) * 2017-08-25 2021-12-17 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
JP7114277B2 (ja) 2018-03-07 2022-08-08 キヤノン株式会社 パターン形成装置及び物品の製造方法
JP2019045875A (ja) * 2018-12-07 2019-03-22 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
JP7285648B2 (ja) * 2019-01-31 2023-06-02 株式会社Screenホールディングス 搬送装置、露光装置および搬送方法
JP7435613B2 (ja) * 2019-09-03 2024-02-21 株式会社ニコン 移動体装置及び加工システム
JP2021067925A (ja) * 2019-10-21 2021-04-30 キヤノン株式会社 支持装置、投影光学系、露光装置、支持装置の調整方法および物品製造方法
JP2021035682A (ja) * 2020-12-03 2021-03-04 東京エレクトロン株式会社 塗布装置、および塗布方法
CN112739028B (zh) * 2020-12-29 2025-02-07 中山新诺科技股份有限公司 一种用于双面数字化曝光的基材平整装置
JP7681437B2 (ja) * 2021-06-07 2025-05-22 株式会社ジャパンディスプレイ 表示装置の製造方法
CN113247627B (zh) * 2021-06-28 2021-11-12 新沂市铭达玻璃有限公司 一种基于玻璃输送的自动化装置
CN114509923B (zh) * 2022-01-28 2023-11-24 复旦大学 一种深紫外物镜设计中的调焦调平装置及其应用
CN115236941B (zh) * 2022-02-25 2025-06-24 深圳市先地图像科技有限公司 一种在柔性感光胶片上激光成像的装置及方法
US20230321843A1 (en) * 2022-04-11 2023-10-12 Asmpt Singapore Pte. Ltd. Pick-up chuck with gas bearing structure
US20230375945A1 (en) * 2022-05-19 2023-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Workpiece support

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008129762A1 (ja) 2007-03-05 2008-10-30 Nikon Corporation 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4642908B1 (cg-RX-API-DMAC7.html) * 1968-09-19 1971-12-18
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3689949B2 (ja) * 1995-12-19 2005-08-31 株式会社ニコン 投影露光装置、及び該投影露光装置を用いたパターン形成方法
EP0866375A3 (en) * 1997-03-17 2000-05-24 Nikon Corporation Article positioning apparatus and exposing apparatus having the same
JP2000078830A (ja) * 1998-09-01 2000-03-14 Nikon Corp リニアモータ及びステージ装置並びに露光装置
JP2000243693A (ja) * 1999-02-23 2000-09-08 Nikon Corp ステージ装置及び露光装置
JP2001215718A (ja) * 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
EP1160628B1 (en) * 2000-06-02 2007-07-18 ASML Netherlands B.V. Lithographic projection apparatus with a supporting assembly
TW527526B (en) * 2000-08-24 2003-04-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6888620B2 (en) * 2001-11-29 2005-05-03 Nikon Corporation System and method for holding a device with minimal deformation
US20030098965A1 (en) * 2001-11-29 2003-05-29 Mike Binnard System and method for supporting a device holder with separate components
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
JP2004079630A (ja) * 2002-08-12 2004-03-11 Nikon Corp 支持装置とその製造方法およびステージ装置並びに露光装置
JP2004238133A (ja) * 2003-02-05 2004-08-26 Sharp Corp 薄板把持装置、薄板搬送装置および薄板検査装置
US7077019B2 (en) * 2003-08-08 2006-07-18 Photon Dynamics, Inc. High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
JP4373175B2 (ja) * 2003-10-17 2009-11-25 オリンパス株式会社 基板搬送装置
CN101124133A (zh) * 2004-04-14 2008-02-13 科福罗科学解决方案有限公司 用于调整距离的非接触支撑平台
JPWO2006009254A1 (ja) * 2004-07-23 2008-05-01 株式会社ニコン 支持装置、ステージ装置、露光装置、及びデバイスの製造方法
US7440081B2 (en) * 2004-11-05 2008-10-21 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate table
WO2006080285A1 (ja) * 2005-01-25 2006-08-03 Nikon Corporation 露光装置及び露光方法並びにマイクロデバイスの製造方法
JP2006265020A (ja) * 2005-03-23 2006-10-05 Nippon Sheet Glass Co Ltd ガラス板搬送支持装置
MX2007003252A (es) * 2005-03-29 2007-10-11 Nippon Kogaku Kk Aparato expositor, metodo de produccion del mismo y metodo de produccion del micro-dispositivo.
KR100949502B1 (ko) * 2005-06-20 2010-03-24 엘지디스플레이 주식회사 액정표시장치 제조 공정용 기판 반송장치
JP4553376B2 (ja) * 2005-07-19 2010-09-29 東京エレクトロン株式会社 浮上式基板搬送処理装置及び浮上式基板搬送処理方法
US7543867B2 (en) * 2005-09-30 2009-06-09 Photon Dynamics, Inc. Vacuum gripping system for positioning large thin substrates on a support table
WO2007074798A1 (ja) * 2005-12-27 2007-07-05 Sharp Kabushiki Kaisha 基板処理装置への基板搬送方法
EP3171220A1 (en) * 2006-01-19 2017-05-24 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JP4702083B2 (ja) * 2006-02-10 2011-06-15 ウシオ電機株式会社 XYθ移動ステージ
EP2541325B1 (en) * 2006-02-21 2018-02-21 Nikon Corporation Exposure apparatus and exposure method
CN101980084B (zh) * 2006-02-21 2013-01-23 株式会社尼康 曝光装置、曝光方法及组件制造方法
US20070236854A1 (en) * 2006-04-11 2007-10-11 Lee Martin E Anti-Gravity Device for Supporting Weight and Reducing Transmissibility
JP2008063020A (ja) * 2006-09-04 2008-03-21 Olympus Corp 基板搬送装置およびそれを用いた基板検査システム
WO2008078688A1 (ja) * 2006-12-27 2008-07-03 Nikon Corporation ステージ装置、露光装置、及びデバイスの製造方法
JP2008192678A (ja) * 2007-02-01 2008-08-21 Toppan Printing Co Ltd 基板処理装置
JP4652351B2 (ja) * 2007-02-02 2011-03-16 大日本印刷株式会社 基板支持装置、基板支持方法
JP4743716B2 (ja) * 2007-03-06 2011-08-10 東京エレクトロン株式会社 基板処理装置
US7607647B2 (en) 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
JP5279207B2 (ja) * 2007-06-11 2013-09-04 Nskテクノロジー株式会社 露光装置用基板搬送機構
JP2009085865A (ja) * 2007-10-02 2009-04-23 Olympus Corp 基板検査装置
JP2009128830A (ja) * 2007-11-27 2009-06-11 Sharp Corp 基板処理装置及び基板処理装置の制御方法
US8115906B2 (en) * 2007-12-14 2012-02-14 Nikon Corporation Movable body system, pattern formation apparatus, exposure apparatus and measurement device, and device manufacturing method
JP2009147240A (ja) * 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
JP2009256029A (ja) * 2008-04-15 2009-11-05 Toray Eng Co Ltd 板状部材の搬送装置および板状部材の搬送方法
KR20100018950A (ko) 2008-08-08 2010-02-18 하명찬 타이어 가황기용 단열판
JP5254073B2 (ja) * 2008-08-21 2013-08-07 Nskテクノロジー株式会社 スキャン露光装置およびスキャン露光装置の基板搬送方法
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
JP2010132460A (ja) * 2010-01-13 2010-06-17 Toray Eng Co Ltd 板状部材の搬送装置および板状部材の搬送方法
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008129762A1 (ja) 2007-03-05 2008-10-30 Nikon Corporation 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法
US20100018950A1 (en) 2007-03-05 2010-01-28 Nikon Corporation Movable body apparatus, pattern forming apparatus and pattern forming method, device manufacturing method, manufacturing method of movable body apparatus, and movable body drive method

Also Published As

Publication number Publication date
TW201839901A (zh) 2018-11-01
JP6628154B2 (ja) 2020-01-08
WO2011021711A1 (en) 2011-02-24
KR20190131146A (ko) 2019-11-25
TWI582893B (zh) 2017-05-11
TW201727819A (zh) 2017-08-01
KR102184248B1 (ko) 2020-11-30
JP2020043369A (ja) 2020-03-19
CN105957827B (zh) 2019-11-26
KR20120053020A (ko) 2012-05-24
CN105954982A (zh) 2016-09-21
JP5776923B2 (ja) 2015-09-09
JP2011044713A (ja) 2011-03-03
CN105957827A (zh) 2016-09-21
JP2017142523A (ja) 2017-08-17
JP2015232718A (ja) 2015-12-24
US20110042874A1 (en) 2011-02-24
CN102483578B (zh) 2016-05-25
TWI632640B (zh) 2018-08-11
CN105954976B (zh) 2019-11-26
JP2017142522A (ja) 2017-08-17
CN105954982B (zh) 2018-06-01
TW201126641A (en) 2011-08-01
KR101862001B1 (ko) 2018-05-29
TW202021037A (zh) 2020-06-01
CN105954976A (zh) 2016-09-21
JP6508576B2 (ja) 2019-05-08
CN102483578A (zh) 2012-05-30
TWI686896B (zh) 2020-03-01

Similar Documents

Publication Publication Date Title
KR101862001B1 (ko) 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
JP6587160B2 (ja) 移動体装置、物体処理装置、露光装置、露光方法、フラットパネルディスプレイの製造方法及びデバイス製造方法
CN102483580B (zh) 物体处理装置、曝光装置及曝光方法、以及元件制造方法
HK1166142B (en) Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
HK1166141A (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
HK1229440A1 (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
HK1229441A1 (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
HK1229531A1 (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
HK1229441B (zh) 物体处理装置、曝光装置及曝光方法、以及元件制造方法
HK1166140B (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20180521

Application number text: 1020127005322

Filing date: 20120228

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20180807

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20190820

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20180807

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20191118

Application number text: 1020127005322

Filing date: 20120228