KR20160011242A - 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜 - Google Patents

고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜 Download PDF

Info

Publication number
KR20160011242A
KR20160011242A KR1020167001382A KR20167001382A KR20160011242A KR 20160011242 A KR20160011242 A KR 20160011242A KR 1020167001382 A KR1020167001382 A KR 1020167001382A KR 20167001382 A KR20167001382 A KR 20167001382A KR 20160011242 A KR20160011242 A KR 20160011242A
Authority
KR
South Korea
Prior art keywords
weight
alloy
copper
nickel
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020167001382A
Other languages
English (en)
Korean (ko)
Inventor
란지트 팬더
라비 바트칼
바와 싱
모르가나 데 아빌라 리바스
프리타 초우두리
안닐 쿠마르
수타파 무케르지
시울리 사르카르
Original Assignee
알파 메탈즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=49382536&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20160011242(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 알파 메탈즈, 인코포레이티드 filed Critical 알파 메탈즈, 인코포레이티드
Publication of KR20160011242A publication Critical patent/KR20160011242A/ko
Abandoned legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/002Soldering by means of induction heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/005Soldering by means of radiant energy
    • B23K1/0056Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/012Soldering with the use of hot gas
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/19Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203Fluxing, i.e. applying flux onto surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227Rods, wires
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233Sheets, foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3463Solder compositions in relation to features of the printed circuit board or the mounting process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/12Copper or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Contacts (AREA)
  • Conductive Materials (AREA)
  • Soft Magnetic Materials (AREA)
KR1020167001382A 2012-10-09 2013-10-09 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜 Abandoned KR20160011242A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261711277P 2012-10-09 2012-10-09
US61/711,277 2012-10-09
PCT/GB2013/052624 WO2014057261A1 (en) 2012-10-09 2013-10-09 Lead-free and antimony-free tin solder reliable at high temperatures

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020147011276A Division KR101738007B1 (ko) 2012-10-09 2013-10-09 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜

Publications (1)

Publication Number Publication Date
KR20160011242A true KR20160011242A (ko) 2016-01-29

Family

ID=49382536

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020167001382A Abandoned KR20160011242A (ko) 2012-10-09 2013-10-09 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜
KR1020177012946A Active KR101974477B1 (ko) 2012-10-09 2013-10-09 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜
KR1020147011276A Active KR101738007B1 (ko) 2012-10-09 2013-10-09 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020177012946A Active KR101974477B1 (ko) 2012-10-09 2013-10-09 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜
KR1020147011276A Active KR101738007B1 (ko) 2012-10-09 2013-10-09 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜

Country Status (11)

Country Link
US (4) US20150266137A1 (cg-RX-API-DMAC7.html)
EP (1) EP2773484B1 (cg-RX-API-DMAC7.html)
JP (1) JP6395713B2 (cg-RX-API-DMAC7.html)
KR (3) KR20160011242A (cg-RX-API-DMAC7.html)
CN (2) CN110900036B (cg-RX-API-DMAC7.html)
ES (1) ES2628028T3 (cg-RX-API-DMAC7.html)
MY (1) MY179941A (cg-RX-API-DMAC7.html)
PH (1) PH12014500905A1 (cg-RX-API-DMAC7.html)
SG (2) SG11201401482UA (cg-RX-API-DMAC7.html)
TW (2) TWI655052B (cg-RX-API-DMAC7.html)
WO (1) WO2014057261A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210141327A (ko) * 2020-05-14 2021-11-23 엠케이전자 주식회사 무연 솔더 합금, 솔더볼, 솔더 페이스트, 및 반도체 부품

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110900036B (zh) * 2012-10-09 2022-10-28 阿尔法组装解决方案公司 高温可靠的无铅并且无锑的锡焊料
US20140290931A1 (en) * 2013-04-01 2014-10-02 University Of Maryland, College Park High Temperature Solder For Downhole Components
US10180035B2 (en) 2013-04-01 2019-01-15 Schlumberger Technology Corporation Soldered components for downhole use
US10076808B2 (en) * 2013-08-05 2018-09-18 Senju Metal Industry Co., Ltd. Lead-free solder alloy
CA2946994C (en) * 2014-04-30 2020-04-14 Nihon Superior Co., Ltd. Lead-free solder alloy
WO2016012754A2 (en) * 2014-07-21 2016-01-28 Alpha Metals, Inc. Low temperature high reliability alloy for solder hierarchy
CN104259685A (zh) * 2014-08-06 2015-01-07 上海新华锦焊接材料科技有限公司 无铅焊料及其制备方法
CN104353840B (zh) * 2014-11-25 2017-11-03 北京康普锡威科技有限公司 一种led用低成本无铅焊料合金粉末及其制备方法
CN104526190A (zh) * 2014-12-23 2015-04-22 苏州龙腾万里化工科技有限公司 一种新型锡条的制作方法
CN104625464A (zh) * 2014-12-23 2015-05-20 苏州龙腾万里化工科技有限公司 一种新型无铅锡棒
CN105834610A (zh) * 2015-02-04 2016-08-10 日本电波工业株式会社 焊料材料及电子零件
CN104690441B (zh) * 2015-02-09 2017-06-20 深圳市兴鸿泰锡业有限公司 焊锡丝及焊锡丝的制备方法
JP6848859B2 (ja) * 2015-05-20 2021-03-24 日本電気株式会社 はんだ合金
US10195698B2 (en) 2015-09-03 2019-02-05 AIM Metals & Alloys Inc. Lead-free high reliability solder alloys
US9953908B2 (en) * 2015-10-30 2018-04-24 International Business Machines Corporation Method for forming solder bumps using sacrificial layer
CN105463247B (zh) * 2015-12-03 2017-06-20 江阴恩特莱特镀膜科技有限公司 一种绑定靶材用合金及其制备方法和应用
CN105397330A (zh) * 2015-12-30 2016-03-16 上海新阳半导体材料股份有限公司 抗高温时效高强度无铅焊锡
CN109478517B (zh) * 2016-07-04 2020-02-21 三菱电机株式会社 半导体装置及其制造方法
CN106181111A (zh) * 2016-08-16 2016-12-07 镇江市锶达合金材料有限公司 一种高性能铜铝复合焊料
CN106181110B (zh) * 2016-08-16 2018-11-23 镇江市锶达合金材料有限公司 一种稀土合金钎料的制备方法
CN106181109B (zh) * 2016-08-16 2018-12-28 镇江市锶达合金材料有限公司 一种高性能绿色钎焊材料
CN106238951A (zh) * 2016-08-26 2016-12-21 王泽陆 一种环保高强度无铅钎料及其制备工艺
JP6780994B2 (ja) * 2016-09-22 2020-11-04 日本電波工業株式会社 はんだ材料及び電子部品
US20180102464A1 (en) * 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects
CN106624433A (zh) * 2016-11-30 2017-05-10 安徽华众焊业有限公司 低熔点无铅焊料合金
TWI650196B (zh) * 2017-02-07 2019-02-11 國立雲林科技大學 金屬接合管材及金屬管接合方法
CN106825982B (zh) * 2017-02-07 2019-04-16 深圳市斯特纳新材料有限公司 一种低粘度防坍塌无铅焊锡膏及其制备方法
JP6355091B1 (ja) * 2017-03-07 2018-07-11 パナソニックIpマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
CN107177751B (zh) * 2017-04-25 2019-08-30 广西大学 一种耐腐蚀及润湿性好的无铅焊料及其制备方法
TWI602929B (zh) * 2017-05-17 2017-10-21 Solder composition
US11732330B2 (en) 2017-11-09 2023-08-22 Alpha Assembly Solutions, Inc. High reliability lead-free solder alloy for electronic applications in extreme environments
US11577343B2 (en) 2017-11-09 2023-02-14 Alpha Assembly Solutions Inc. Low-silver alternative to standard SAC alloys for high reliability applications
KR102600306B1 (ko) 2017-11-24 2023-11-10 센주긴조쿠고교 가부시키가이샤 땜납 재료, 솔더 페이스트 및 납땜 이음
CN107999993A (zh) * 2017-12-05 2018-05-08 广东省焊接技术研究所(广东省中乌研究院) 一种用于温控器波纹管铁底板软钎焊的无铅焊料及其制备方法
CN108080810A (zh) * 2017-12-13 2018-05-29 柳州智臻智能机械有限公司 一种电子封装用焊料合金及其制备方法
CN108296668A (zh) * 2017-12-21 2018-07-20 柳州智臻智能机械有限公司 一种无铅焊料合金及其制备方法
JP6578393B2 (ja) * 2018-02-27 2019-09-18 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置
CN108705222B (zh) * 2018-04-04 2021-02-09 胡妍 一种耐腐蚀低温焊接材料及其制备方法
JP6521160B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
JP6521161B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
JP6880438B2 (ja) * 2018-07-27 2021-06-02 千住金属工業株式会社 ソルダペースト
JP6643691B2 (ja) * 2018-07-27 2020-02-12 千住金属工業株式会社 ソルダペースト
KR102145215B1 (ko) * 2018-07-30 2020-08-18 경북대학교 산학협력단 치과용 코발트계 합금의 레이저 용접 페이스트 조성물, 치과용 코발트계 합금의 용접방법, 이에 따라 제조된 치과용 코발트계 합금 및 이를 포함하는 치과용 보철물
CN108941971B (zh) * 2018-08-16 2020-12-18 广东省科学院中乌焊接研究所 一种免清洗水性锡膏及其制备方法
CN109277721B (zh) * 2018-09-20 2020-11-27 常熟市华银焊料有限公司 一种含Ga和Nd的Sn-Cu-Ni无铅钎料
JP6573019B1 (ja) 2018-10-25 2019-09-11 千住金属工業株式会社 フラックス及びソルダペースト
TW202403062A (zh) 2018-12-27 2024-01-16 美商阿爾發金屬化工公司 無鉛焊料組成物
EP3914054B1 (en) * 2019-01-18 2023-01-25 Mitsubishi Electric Corporation Life prediction means for solder joint, and life prediction method for solder joint
KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
JP6649597B1 (ja) * 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、およびはんだ継手
DE112020000278B4 (de) 2019-05-27 2023-07-06 Senju Metal Industry Co., Ltd. Lotlegierung, lotpaste, lötkugel, lötvorform und lötstelle
JP6649595B1 (ja) * 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
JP6721849B1 (ja) * 2019-05-27 2020-07-15 千住金属工業株式会社 ソルダペースト
WO2020241574A1 (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 はんだペースト及びはんだペースト用フラックス
WO2020241544A1 (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 はんだペースト及びはんだペースト用フラックス
JP6700568B1 (ja) * 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ball Grid Arrayおよびはんだ継手
CN110936062A (zh) * 2019-12-18 2020-03-31 陕西易莱德新材料科技有限公司 一种添加有铂金属的焊料及其制备方法
JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
CN111590233B (zh) * 2020-06-11 2021-12-31 中山翰华锡业有限公司 一种用于智能机械手焊接的高可焊环保超细焊锡丝及其制备方法
CN114700651B (zh) * 2020-06-11 2024-04-05 中山翰华锡业有限公司 一种应用于智能机械手焊接的耐热环保超细焊锡丝及其制备方法
EP4578592A1 (en) * 2020-11-19 2025-07-02 Senju Metal Industry Co., Ltd. Solder alloy, solder ball and solder joint
CN112975202B (zh) * 2021-03-01 2024-01-12 无锡市斯威克科技有限公司 一种低熔点无铅焊带及其制备方法与应用
CN114807677B (zh) * 2021-05-19 2023-08-08 苏州优诺电子材料科技有限公司 一种锡合金及其制备方法
CN113042935A (zh) * 2021-05-20 2021-06-29 江苏德誉环保设备科技有限公司 一种无铅锡银铜钎焊用钎料的制备方法
CN114045412B (zh) * 2021-10-08 2022-08-16 安徽贵乾新材料有限公司 一种环保锡条制造方法及其成型模具
TWI789165B (zh) * 2021-12-14 2023-01-01 昇貿科技股份有限公司 無鉛無銅錫合金與用於球柵陣列封裝的錫球
CN114367760B (zh) * 2022-02-21 2023-08-18 中山翰华锡业有限公司 一种高可靠性的无卤无铅焊锡膏及其制备方法
CN115156755A (zh) * 2022-08-12 2022-10-11 云南锡业集团(控股)有限责任公司研发中心 一种含Bi、Ni、Ga的Sn-Ag-Cu无铅钎料及其制备方法
CN115194363B (zh) * 2022-08-23 2024-03-12 无锡市斯威克科技有限公司 低熔点无铅焊料、低熔点无铅焊带及制备方法和应用
CN115401359B (zh) * 2022-09-23 2023-11-24 晶科能源股份有限公司 焊带及其制备方法
CN116586815A (zh) * 2023-04-24 2023-08-15 江苏科技大学 SnAgCu系高温稳定焊料合金及其应用
CN116618884A (zh) * 2023-07-07 2023-08-22 浙江涟屹轴承科技有限公司 铝锡药芯焊丝用的药芯、铝锡药芯焊丝及其制备方法
CN117245267A (zh) * 2023-09-14 2023-12-19 杭州华光焊接新材料股份有限公司 一种含Ga和Sb的复合钎料及其应用
CN117548897B (zh) * 2023-11-27 2024-06-25 北京理工大学 一种固溶强化焊料及其高可靠性互连接头的制备方法
CN118023761B (zh) * 2024-02-06 2025-11-21 江苏长灵贵金属有限公司 一种合金焊料及其制备方法
CN120527313A (zh) * 2025-07-23 2025-08-22 常州佳讯光电产业发展有限公司 一种基于钼片的tvs二极管

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3693762B2 (ja) * 1996-07-26 2005-09-07 株式会社ニホンゲンマ 無鉛はんだ
JP2000015476A (ja) * 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk 無鉛はんだ
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
JP3262113B2 (ja) * 1999-01-29 2002-03-04 富士電機株式会社 はんだ合金
JP2000288772A (ja) 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ
EP1106301A1 (en) * 1999-06-11 2001-06-13 Nippon Sheet Glass Co., Ltd. Lead-free solder
JP2001058287A (ja) * 1999-06-11 2001-03-06 Nippon Sheet Glass Co Ltd 無鉛ハンダ
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
JP2002096191A (ja) * 2000-09-18 2002-04-02 Matsushita Electric Ind Co Ltd はんだ材料およびこれを利用する電気・電子機器
JP2002224881A (ja) * 2001-02-05 2002-08-13 Hitachi Metals Ltd はんだボール
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy
JP3768849B2 (ja) * 2001-08-27 2006-04-19 白光株式会社 半田ごて用の半田
JP2003126987A (ja) * 2001-10-16 2003-05-08 Denki Kagaku Kogyo Kk 回路基板用鉛フリー半田及び回路基板
JP3602529B1 (ja) * 2003-01-22 2004-12-15 白光株式会社 マニュアルソルダリング用またはフローソルダリング用鉛フリーはんだ及びそれを用いた電子部品
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
CN1570166A (zh) * 2004-05-09 2005-01-26 邓和升 无铅焊料合金及其制备方法
JP3966554B2 (ja) * 2004-08-24 2007-08-29 日本アルミット株式会社 半田合金
GB2421030B (en) 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
FR2888253B1 (fr) * 2005-07-07 2007-11-23 Ind Des Poudres Spheriques Sa Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage.
JP2009506203A (ja) * 2005-08-24 2009-02-12 フライズ メタルズ インコーポレイテッド 半田合金
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
ES2612560T3 (es) * 2007-07-13 2017-05-17 Senju Metal Industry Co., Ltd Circuito electrónico montado en vehículo
CN101801589B (zh) * 2007-07-18 2013-05-15 千住金属工业株式会社 车载电子电路用In掺入无铅焊料
TW200927357A (en) * 2007-10-17 2009-07-01 Ishikawa Metal Co Ltd Lead-free solder
CN101214588B (zh) * 2008-01-14 2010-06-02 哈尔滨工业大学 低银抗氧化活性无铅钎料
KR101318454B1 (ko) * 2008-04-23 2013-10-16 센주긴조쿠고교 가부시키가이샤 수축공이 억제된 납프리 땜납 합금
JP2011005510A (ja) * 2009-06-24 2011-01-13 Mitsubishi Electric Corp はんだ合金および電子回路基板
JP2011183430A (ja) * 2010-03-08 2011-09-22 Nippon Genma:Kk はんだ
CN110900036B (zh) 2012-10-09 2022-10-28 阿尔法组装解决方案公司 高温可靠的无铅并且无锑的锡焊料
TWI576195B (zh) 2013-05-03 2017-04-01 Accurus Scientific Co Ltd High temperature resistant high strength lead free solder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210141327A (ko) * 2020-05-14 2021-11-23 엠케이전자 주식회사 무연 솔더 합금, 솔더볼, 솔더 페이스트, 및 반도체 부품

Also Published As

Publication number Publication date
TWI587964B (zh) 2017-06-21
US20150266137A1 (en) 2015-09-24
TW201422356A (zh) 2014-06-16
JP6395713B2 (ja) 2018-09-26
WO2014057261A1 (en) 2014-04-17
CN103889644A (zh) 2014-06-25
CN103889644B (zh) 2019-12-31
CN110900036A (zh) 2020-03-24
SG10201705882UA (en) 2017-08-30
KR20170056712A (ko) 2017-05-23
TW201728398A (zh) 2017-08-16
PH12014500905A1 (en) 2014-06-09
EP2773484A1 (en) 2014-09-10
TWI655052B (zh) 2019-04-01
KR101738007B1 (ko) 2017-05-29
KR20140074362A (ko) 2014-06-17
SG11201401482UA (en) 2014-06-27
US20150224604A1 (en) 2015-08-13
MY179941A (en) 2020-11-19
JP2016500578A (ja) 2016-01-14
ES2628028T3 (es) 2017-08-01
US20160023309A1 (en) 2016-01-28
EP2773484B1 (en) 2017-05-24
US11090768B2 (en) 2021-08-17
US20230330788A1 (en) 2023-10-19
KR101974477B1 (ko) 2019-05-02
CN110900036B (zh) 2022-10-28

Similar Documents

Publication Publication Date Title
KR101974477B1 (ko) 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜
US20250375841A1 (en) High impact solder toughness alloy
KR102769164B1 (ko) 고온 초고신뢰성 합금
WO2018067426A1 (en) Advanced solder alloys for electronic enterconnects
KR20170031769A (ko) 솔더링용 저온 고신뢰성 주석 합금
JP2017213596A (ja) はんだ合金およびそれを用いた実装構造体

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20160118

Application number text: 1020147011276

Filing date: 20140425

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20180920

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20181113

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20190812

PC1904 Unpaid initial registration fee