SG11201401482UA - Lead-free and antimony-free tin solder reliable at high temperatures - Google Patents

Lead-free and antimony-free tin solder reliable at high temperatures

Info

Publication number
SG11201401482UA
SG11201401482UA SG11201401482UA SG11201401482UA SG11201401482UA SG 11201401482U A SG11201401482U A SG 11201401482UA SG 11201401482U A SG11201401482U A SG 11201401482UA SG 11201401482U A SG11201401482U A SG 11201401482UA SG 11201401482U A SG11201401482U A SG 11201401482UA
Authority
SG
Singapore
Prior art keywords
free
antimony
reliable
lead
high temperatures
Prior art date
Application number
SG11201401482UA
Inventor
Pritha Choudhury
Avila Ribas Morgana De
Sutapa Mukherjee
Anil Kumar
Siuli Sarkar
Ranjit Pandher
Ravi Bhatkal
Bawa Singh
Original Assignee
Alpha Metals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=49382536&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201401482U(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Alpha Metals filed Critical Alpha Metals
Publication of SG11201401482UA publication Critical patent/SG11201401482UA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/002Soldering by means of induction heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/005Soldering by means of radiant energy
    • B23K1/0056Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/012Soldering with the use of hot gas
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/19Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203Fluxing, i.e. applying flux onto surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227Rods, wires
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233Sheets, foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3463Solder compositions in relation to features of the printed circuit board or the mounting process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/12Copper or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Contacts (AREA)
  • Conductive Materials (AREA)
SG11201401482UA 2012-10-09 2013-10-09 Lead-free and antimony-free tin solder reliable at high temperatures SG11201401482UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261711277P 2012-10-09 2012-10-09
PCT/GB2013/052624 WO2014057261A1 (en) 2012-10-09 2013-10-09 Lead-free and antimony-free tin solder reliable at high temperatures

Publications (1)

Publication Number Publication Date
SG11201401482UA true SG11201401482UA (en) 2014-06-27

Family

ID=49382536

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201401482UA SG11201401482UA (en) 2012-10-09 2013-10-09 Lead-free and antimony-free tin solder reliable at high temperatures
SG10201705882UA SG10201705882UA (en) 2012-10-09 2013-10-09 Lead-free and antimony-free tin solder reliable at high temperatures

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201705882UA SG10201705882UA (en) 2012-10-09 2013-10-09 Lead-free and antimony-free tin solder reliable at high temperatures

Country Status (10)

Country Link
US (4) US20150266137A1 (en)
EP (1) EP2773484B1 (en)
JP (1) JP6395713B2 (en)
KR (3) KR101738007B1 (en)
CN (2) CN103889644B (en)
ES (1) ES2628028T3 (en)
MY (1) MY179941A (en)
SG (2) SG11201401482UA (en)
TW (2) TWI655052B (en)
WO (1) WO2014057261A1 (en)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201401482UA (en) * 2012-10-09 2014-06-27 Alpha Metals Lead-free and antimony-free tin solder reliable at high temperatures
US20140290931A1 (en) * 2013-04-01 2014-10-02 University Of Maryland, College Park High Temperature Solder For Downhole Components
US10180035B2 (en) 2013-04-01 2019-01-15 Schlumberger Technology Corporation Soldered components for downhole use
US10076808B2 (en) * 2013-08-05 2018-09-18 Senju Metal Industry Co., Ltd. Lead-free solder alloy
KR20160147996A (en) 2014-04-30 2016-12-23 가부시키가이샤 니혼슈페리어샤 Lead-free solder alloy
KR101985646B1 (en) * 2014-07-21 2019-06-04 알파 어셈블리 솔루션스 인크. Low temperature high reliability tin alloy for soldering
CN104259685A (en) * 2014-08-06 2015-01-07 上海新华锦焊接材料科技有限公司 Lead-free solder and preparation method thereof
CN104353840B (en) * 2014-11-25 2017-11-03 北京康普锡威科技有限公司 A kind of LED inexpensive lead-free solder alloy powders and preparation method thereof
CN104526190A (en) * 2014-12-23 2015-04-22 苏州龙腾万里化工科技有限公司 Novel tin bar manufacturing method
CN104625464A (en) * 2014-12-23 2015-05-20 苏州龙腾万里化工科技有限公司 Novel lead-free tin bar
CN105834610A (en) * 2015-02-04 2016-08-10 日本电波工业株式会社 Solder material and electronic component
CN104690441B (en) * 2015-02-09 2017-06-20 深圳市兴鸿泰锡业有限公司 The preparation method of solder stick and solder stick
US10307868B2 (en) * 2015-05-20 2019-06-04 Nec Corporation Solder alloy
US10195698B2 (en) 2015-09-03 2019-02-05 AIM Metals & Alloys Inc. Lead-free high reliability solder alloys
US9953908B2 (en) * 2015-10-30 2018-04-24 International Business Machines Corporation Method for forming solder bumps using sacrificial layer
CN105463247B (en) * 2015-12-03 2017-06-20 江阴恩特莱特镀膜科技有限公司 One kind binding target alloy and its preparation method and application
CN105397330A (en) * 2015-12-30 2016-03-16 上海新阳半导体材料股份有限公司 Lead-free solder with high-temperature aging resistance and high strength
US10468375B2 (en) * 2016-07-04 2019-11-05 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing same
CN106181110B (en) * 2016-08-16 2018-11-23 镇江市锶达合金材料有限公司 A kind of preparation method of rare earth alloy solder
CN106181109B (en) * 2016-08-16 2018-12-28 镇江市锶达合金材料有限公司 A kind of High-performance green brazing material
CN106181111A (en) * 2016-08-16 2016-12-07 镇江市锶达合金材料有限公司 A kind of high-performance copper aluminum composite solder
CN106238951A (en) * 2016-08-26 2016-12-21 王泽陆 A kind of environment-friendly high-intensity lead-free brazing and preparation technology thereof
JP6780994B2 (en) * 2016-09-22 2020-11-04 日本電波工業株式会社 Solder materials and electronic components
US20180102464A1 (en) 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects
CN106624433A (en) * 2016-11-30 2017-05-10 安徽华众焊业有限公司 Low-melting-point lead-free solder alloy
TWI650196B (en) * 2017-02-07 2019-02-11 國立雲林科技大學 Metal joint pipe and metal pipe joint method
CN106825982B (en) * 2017-02-07 2019-04-16 深圳市斯特纳新材料有限公司 A kind of anti-collapse leadless soldering tin paste of low viscosity and preparation method thereof
JP6355091B1 (en) * 2017-03-07 2018-07-11 パナソニックIpマネジメント株式会社 Solder alloy and joint structure using the same
CN107177751B (en) * 2017-04-25 2019-08-30 广西大学 The good lead-free solder and preparation method thereof of a kind of corrosion-resistant and wetability
TWI602929B (en) * 2017-05-17 2017-10-21 Solder composition
US11732330B2 (en) * 2017-11-09 2023-08-22 Alpha Assembly Solutions, Inc. High reliability lead-free solder alloy for electronic applications in extreme environments
US11577343B2 (en) 2017-11-09 2023-02-14 Alpha Assembly Solutions Inc. Low-silver alternative to standard SAC alloys for high reliability applications
WO2019103025A1 (en) 2017-11-24 2019-05-31 千住金属工業株式会社 Solder material, solder paste, and solder joint
CN107999993A (en) * 2017-12-05 2018-05-08 广东省焊接技术研究所(广东省中乌研究院) A kind of lead-free solder for temperature controller bellows iron bottom plate solder and preparation method thereof
CN108080810A (en) * 2017-12-13 2018-05-29 柳州智臻智能机械有限公司 A kind of solder alloy used for electronic packaging and preparation method thereof
CN108296668A (en) * 2017-12-21 2018-07-20 柳州智臻智能机械有限公司 A kind of leadless welding alloy and preparation method thereof
JP6578393B2 (en) * 2018-02-27 2019-09-18 株式会社タムラ製作所 Lead-free solder alloy, electronic circuit mounting board, and electronic control device
CN112518127B (en) * 2018-04-04 2022-11-08 山东世商焊材有限公司 Corrosion-resistant low-temperature welding material
JP6521161B1 (en) * 2018-07-20 2019-05-29 千住金属工業株式会社 Solder alloy, solder powder, solder paste, and solder joint using them
JP6521160B1 (en) * 2018-07-20 2019-05-29 千住金属工業株式会社 Solder alloy, solder powder, solder paste, and solder joint using them
JP6643691B2 (en) * 2018-07-27 2020-02-12 千住金属工業株式会社 Solder paste
JP6880438B2 (en) * 2018-07-27 2021-06-02 千住金属工業株式会社 Solder paste
KR102145215B1 (en) * 2018-07-30 2020-08-18 경북대학교 산학협력단 LASER WELDING PASTE COMPOSITION FOR DENTAL Co-Cr ALLOY, WELDING METHOD FOR MANUFACTURING DENTAL Co-Cr ALLOY, DENTAL Co-Cr ALLOY BY USING THE METHOD AND DENTAL PROSTHESIS INCLUDING THE DENTAL Co-Cr ALLOY
JP7287606B2 (en) 2018-08-10 2023-06-06 株式会社日本スペリア社 Lead-free solder alloy
CN108941971B (en) * 2018-08-16 2020-12-18 广东省科学院中乌焊接研究所 Cleaning-free water-based solder paste and preparation method thereof
CN109277721B (en) * 2018-09-20 2020-11-27 常熟市华银焊料有限公司 Sn-Cu-Ni lead-free solder containing Ga and Nd
JP6573019B1 (en) 2018-10-25 2019-09-11 千住金属工業株式会社 Flux and solder paste
TW202403062A (en) * 2018-12-27 2024-01-16 美商阿爾發金屬化工公司 Lead-free solder compositions
EP3914054B1 (en) * 2019-01-18 2023-01-25 Mitsubishi Electric Corporation Life prediction means for solder joint, and life prediction method for solder joint
KR102187085B1 (en) * 2019-01-24 2020-12-04 주식회사 경동엠텍 lead-free solder composition for high-temperature and vibrational circumstance and manufacturing method thereof
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KR102460042B1 (en) * 2020-05-14 2022-10-28 엠케이전자 주식회사 Lead-free solder alloy, solder ball, solder paste, and semiconductor device
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CN112975202B (en) * 2021-03-01 2024-01-12 无锡市斯威克科技有限公司 Low-melting-point lead-free welding strip and preparation method and application thereof
CN114807677B (en) * 2021-05-19 2023-08-08 苏州优诺电子材料科技有限公司 Tin alloy and preparation method thereof
CN113042935A (en) * 2021-05-20 2021-06-29 江苏德誉环保设备科技有限公司 Preparation method of solder for lead-free tin-silver-copper brazing
CN114045412B (en) * 2021-10-08 2022-08-16 安徽贵乾新材料有限公司 Manufacturing method and forming die of environment-friendly tin bar
TWI789165B (en) * 2021-12-14 2023-01-01 昇貿科技股份有限公司 Lead-free copper-free tin alloys and solder balls for ball grid array packages
CN116690026A (en) * 2022-02-21 2023-09-05 中山翰华锡业有限公司 Halogen-free lead-free soldering paste with high wettability and preparation method thereof
CN115156755A (en) * 2022-08-12 2022-10-11 云南锡业集团(控股)有限责任公司研发中心 Sn-Ag-Cu lead-free solder containing Bi, ni and Ga and preparation method thereof
CN115194363B (en) * 2022-08-23 2024-03-12 无锡市斯威克科技有限公司 Low-melting-point lead-free solder, low-melting-point lead-free solder strip, preparation method and application
CN115401359B (en) * 2022-09-23 2023-11-24 晶科能源股份有限公司 Solder strip and preparation method thereof

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3693762B2 (en) * 1996-07-26 2005-09-07 株式会社ニホンゲンマ Lead-free solder
JP2000015476A (en) * 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk Lead-free solder
JP3262113B2 (en) * 1999-01-29 2002-03-04 富士電機株式会社 Solder alloy
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
JP2000288772A (en) 1999-02-02 2000-10-17 Nippon Genma:Kk Lead-free solder
EP1106301A1 (en) * 1999-06-11 2001-06-13 Nippon Sheet Glass Co., Ltd. Lead-free solder
JP2001058287A (en) * 1999-06-11 2001-03-06 Nippon Sheet Glass Co Ltd Non-lead solder
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
JP2002096191A (en) * 2000-09-18 2002-04-02 Matsushita Electric Ind Co Ltd Soldering material and electric/electronic equipment using the same
JP2002224881A (en) * 2001-02-05 2002-08-13 Hitachi Metals Ltd Solder ball
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy
JP3768849B2 (en) * 2001-08-27 2006-04-19 白光株式会社 Soldering iron
JP2003126987A (en) * 2001-10-16 2003-05-08 Denki Kagaku Kogyo Kk Lead-free solder for circuit board and circuit board
JP3602529B1 (en) * 2003-01-22 2004-12-15 白光株式会社 Lead-free solder for manual soldering or flow soldering and electronic components using it
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
CN1570166A (en) * 2004-05-09 2005-01-26 邓和升 Lead free solder alloy and its preparation method
JP3966554B2 (en) * 2004-08-24 2007-08-29 日本アルミット株式会社 Solder alloy
GB2421030B (en) 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
FR2888253B1 (en) * 2005-07-07 2007-11-23 Ind Des Poudres Spheriques Sa UNLEADED, TIN-BASED, LEAD-FREE ASSEMBLY ALLOY, AND OXIDATION TO AIR IS DELAYED AND USE OF SUCH ALLOY.
JP2009506203A (en) * 2005-08-24 2009-02-12 フライズ メタルズ インコーポレイテッド Solder alloy
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
JP5376553B2 (en) * 2006-06-26 2013-12-25 日立金属株式会社 Wiring conductor and terminal connection
JP5024380B2 (en) * 2007-07-13 2012-09-12 千住金属工業株式会社 Lead-free solder for in-vehicle mounting and in-vehicle electronic circuit
EP2177305B1 (en) * 2007-07-18 2013-07-03 Senju Metal Industry Co., Ltd In-containing lead-free solder for on-vehicle electronic circuit
TW200927357A (en) * 2007-10-17 2009-07-01 Ishikawa Metal Co Ltd Lead-free solder
CN101214588B (en) * 2008-01-14 2010-06-02 哈尔滨工业大学 Low silver oxidation resistance active leadless solder
WO2009131178A1 (en) * 2008-04-23 2009-10-29 千住金属工業株式会社 Lead-free solder alloy suppressed in occurrence of shrinkage cavity
JP2011005510A (en) * 2009-06-24 2011-01-13 Mitsubishi Electric Corp Solder alloy and electronic circuit board
JP2011183430A (en) * 2010-03-08 2011-09-22 Nippon Genma:Kk Solder
SG11201401482UA (en) 2012-10-09 2014-06-27 Alpha Metals Lead-free and antimony-free tin solder reliable at high temperatures
TWI576195B (en) 2013-05-03 2017-04-01 Accurus Scientific Co Ltd High temperature resistant high strength lead free solder

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