CN108080810A - A kind of solder alloy used for electronic packaging and preparation method thereof - Google Patents
A kind of solder alloy used for electronic packaging and preparation method thereof Download PDFInfo
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- CN108080810A CN108080810A CN201711333398.0A CN201711333398A CN108080810A CN 108080810 A CN108080810 A CN 108080810A CN 201711333398 A CN201711333398 A CN 201711333398A CN 108080810 A CN108080810 A CN 108080810A
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- solder alloy
- electronic packaging
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- temperature
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of solder alloys used for electronic packaging and preparation method thereof, calculate, are prepared using the following raw material in percentage by weight：Bi 0.2 0.6%, Ag 0.05 0.09%, Y0.3 0.7%, Zn 0.2 0.8%, Tb 0.01 0.05%, Nb 0.6 1.6%, Cu 0.4 0.9%, Ti 1.1 1.7%, surplus Sn.Compared with prior art, the present invention is interacted using Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn as each ingredient of raw material, influenced each other, and improves the wellability of the solder alloy of preparation, and fusing point is low.
Description
Technical field
The present invention relates to solder alloy technical field more particularly to a kind of solder alloy used for electronic packaging and its preparation sides
Method.
Background technology
As electronic product is towards thin, light, river digitizes, multifunction direction is developed, the miniaturization of electronic component,
The development trend of precise treatment and high performance is further speeded up so that the amount of solder of Electronic Packaging increases, size becomes smaller,
Away from less and less.Major part in the failure of electronic device is the wherein solder joint failure as caused by the failure for encapsulating and assembling
When main cause, therefore, solder be determine electronic device quality an important factor for.
In the prior art, solder alloy and preparation method thereof has obtained extensive report, for example, Application No.
201210494897.9 Chinese patent literature report a kind of low melting point lead-free solder alloy, belong to welding material technology neck
Domain.In order to solve the problem of that the high shear strength of existing solder alloy fusing point is low, a kind of low melting point lead-free solder alloy is provided,
The solder includes the weight percent of following component：Bi：10%-30%；Ag：2.2%-3.0%；In：0.5%-1.0%；P：
0.004%-0.008%；Remaining is tin.The Co of RE and 0.0002%-0.0005% containing 0.002%-0.005%.Shen
It please number for 200610151104.8 Chinese patent literature, to report a kind of leadless solder unleaded soft in existing Sn-Cu
Alloy element Zn is added in cored solder system, the addition for controlling Zn is 0.2-1.0wt.%；Cu in leadless solder
Addition be 0.7wt.%.The Chinese patent literature of Application No. 201210497172.5 reports a kind of
SnCuNiGaGeIn systems belong to technical field of welding materials without silver lead-free solder alloy.In order to solve existing solder heat-resisting quantity
The problem of difference, scruff is more, poor ductility provide a kind of SnCuNiGaGeIn systems without silver lead-free solder alloy, the solder contain with
The weight percent of lower ingredient：Cu：0.1%-1.0%；Ni：0.01%-1.0%；In：0.01%-1.0%；Ga：0.002%-
0.004%；Ge：0.002%-0.004%；Surplus is tin.Can contain 0.005%-0.008% Dy and/or Er and
The Co of 0.002%-0.003%.
But the fusing point of the solder alloy of above-mentioned report is higher, and wellability is also up for further improving.
The content of the invention
Present invention solves the technical problem that it is to provide a kind of solder alloy used for electronic packaging and preparation method thereof, fusing point
Low, wellability is good.
In view of this, the present invention provides a kind of solder alloy used for electronic packaging, calculate in percentage by weight, using such as
It is prepared by lower raw material：Bi 0.2-0.6%, Ag 0.05-0.09%, Y 0.3-0.7%, Zn 0.2-0.8%, Tb 0.01-
0.05%th, Nb 0.6-1.6%, Cu 0.4-0.9%, Ti 1.1-1.7%, surplus Sn.
Preferably, Bi 0.2-0.5%.
Preferably, Ag 0.06-0.09%.
Preferably, Y 0.3-0.5%.
Preferably, Zn 0.4-0.8%.
Preferably, Tb 0.01-0.03%.
Preferably, Nb 0.9-1.6%.
Preferably, Cu 0.4-0.7%.
Preferably, Ti 1.3-1.7%.
Correspondingly, a kind of preparation side of the solder alloy used for electronic packaging described in the present invention also provides above-mentioned technical proposal
Method comprises the following steps：According to weight percent, Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn are added in into smelting furnace, heated up
To 180 DEG C, 40 minutes are kept the temperature, stirring is warming up to 250 DEG C, keeps the temperature 30 minutes, is continuously heating to 400 DEG C, keeps the temperature 50 minutes, stirs
It mixes, is cooled to room temperature, obtain solder alloy used for electronic packaging.
The present invention provides a kind of solder alloy used for electronic packaging and preparation method thereof, calculates in percentage by weight, uses
It is prepared by the following raw material：Bi 0.2-0.6%, Ag 0.05-0.09%, Y 0.3-0.7%, Zn 0.2-0.8%, Tb 0.01-
0.05%th, Nb 0.6-1.6%, Cu 0.4-0.9%, Ti 1.1-1.7%, surplus Sn；It is prepared as follows：According to
Weight percent adds in Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn into smelting furnace, is warming up to 180 DEG C, keeps the temperature 40 minutes,
Stirring is warming up to 250 DEG C, keeps the temperature 30 minutes, is continuously heating to 400 DEG C, keeps the temperature 50 minutes, and stirring is cooled to room temperature, obtains electricity
Sub- encapsulation solder alloy.Compared with prior art, the present invention using Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn as raw material it is each into
Split-phase interaction influences each other, and improves the wellability of the solder alloy of preparation, and fusing point is low.
Specific embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, still
It should be appreciated that these descriptions are simply for the feature and advantage that further illustrate the present invention rather than to the claims in the present invention
Limitation.
The embodiment of the invention discloses a kind of solder alloys used for electronic packaging, calculate in percentage by weight, using as follows
It is prepared by raw material：Bi 0.2-0.6%, Ag 0.05-0.09%, Y 0.3-0.7%, Zn 0.2-0.8%, Tb 0.01-0.05%,
Nb 0.6-1.6%, Cu 0.4-0.9%, Ti 1.1-1.7%, surplus Sn.
Preferably, Bi 0.2-0.5%, Ag 0.06-0.09%, Y 0.3-0.5%, Zn 0.4-0.8%, Tb
0.01-0.03%, Nb 0.9-1.6%, Cu 0.4-0.7%, Ti 1.3-1.7%.
Correspondingly, a kind of preparation side of the solder alloy used for electronic packaging described in the present invention also provides above-mentioned technical proposal
Method comprises the following steps：According to weight percent, Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn are added in into smelting furnace, heated up
To 180 DEG C, 40 minutes are kept the temperature, stirring is warming up to 250 DEG C, keeps the temperature 30 minutes, is continuously heating to 400 DEG C, keeps the temperature 50 minutes, stirs
It mixes, is cooled to room temperature, obtain solder alloy used for electronic packaging.
The present invention provides a kind of solder alloy used for electronic packaging and preparation method thereof, calculates in percentage by weight, uses
It is prepared by the following raw material：Bi 0.2-0.6%, Ag 0.05-0.09%, Y 0.3-0.7%, Zn 0.2-0.8%, Tb 0.01-
0.05%th, Nb 0.6-1.6%, Cu 0.4-0.9%, Ti 1.1-1.7%, surplus Sn；It is prepared as follows：According to
Weight percent adds in Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn into smelting furnace, is warming up to 180 DEG C, keeps the temperature 40 minutes,
Stirring is warming up to 250 DEG C, keeps the temperature 30 minutes, is continuously heating to 400 DEG C, keeps the temperature 50 minutes, and stirring is cooled to room temperature, obtains electricity
Sub- encapsulation solder alloy.Compared with prior art, the present invention using Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn as raw material it is each into
Split-phase interaction influences each other, and improves the wellability of the solder alloy of preparation, and fusing point is low.
For a further understanding of the present invention, technical solution provided by the invention is carried out specifically with reference to embodiment
Bright, protection scope of the present invention is not limited by the following examples.
The raw material that the embodiment of the present invention uses is purchased in market.
Embodiment 1
A kind of solder alloy used for electronic packaging, is calculated, is prepared using the following raw material in percentage by weight：
Bi 0.4%, Ag 0.07%, Y 0.5%, Zn 0.5%, Tb 0.03%, Nb 0.9%, Cu 0.7%, Ti
1.5%, surplus Sn.
Preparation process：
According to weight percent, Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn are added in into smelting furnace, are warming up to 180 DEG C,
Heat preservation 40 minutes, stirring are warming up to 250 DEG C, keep the temperature 30 minutes, are continuously heating to 400 DEG C, keep the temperature 50 minutes, and stirring is cooled to
Room temperature obtains solder alloy used for electronic packaging.
The performance of solder alloy used for electronic packaging manufactured in the present embodiment is detected, solidus temperature is 218 DEG C, liquid
Liquidus temperature is 227 DEG C, elongation percentage 73%.
Embodiment 2
A kind of solder alloy used for electronic packaging, is calculated, is prepared using the following raw material in percentage by weight：
Bi 0.5%, Ag 0.08%, Y 0.4%, Zn 0.7%, Tb 0.02%, Nb 1.5%, Cu 0.7%, Ti
1.1%, surplus Sn.
Preparation process：
According to weight percent, Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn are added in into smelting furnace, are warming up to 180 DEG C,
Heat preservation 40 minutes, stirring are warming up to 250 DEG C, keep the temperature 30 minutes, are continuously heating to 400 DEG C, keep the temperature 50 minutes, and stirring is cooled to
Room temperature obtains solder alloy used for electronic packaging.
The performance of solder alloy used for electronic packaging manufactured in the present embodiment is detected, solidus temperature is 217 DEG C, liquid
Liquidus temperature is 229 DEG C, elongation percentage 72%.
Embodiment 3
A kind of solder alloy used for electronic packaging, is calculated, is prepared using the following raw material in percentage by weight：
Bi 0.3%, Ag 0.06%, Y 0.6%, Zn 0.4%, Tb 0.03%, Nb 0.8%, Cu 0.5%, Ti
1.2%, surplus Sn.
Preparation process：
According to weight percent, Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn are added in into smelting furnace, are warming up to 180 DEG C,
Heat preservation 40 minutes, stirring are warming up to 250 DEG C, keep the temperature 30 minutes, are continuously heating to 400 DEG C, keep the temperature 50 minutes, and stirring is cooled to
Room temperature obtains solder alloy used for electronic packaging.
The performance of solder alloy used for electronic packaging manufactured in the present embodiment is detected, solidus temperature is 215 DEG C, liquid
Liquidus temperature is 224 DEG C, elongation percentage 69%.
Embodiment 4
A kind of solder alloy used for electronic packaging, is calculated, is prepared using the following raw material in percentage by weight：
Bi 0.6%, Ag 0.05%, Y 0.7%, Zn 0.2%, Tb 0.05%, Nb 0.6%, Cu 0.9%, Ti
1.1%, surplus Sn.
Preparation process：
According to weight percent, Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn are added in into smelting furnace, are warming up to 180 DEG C,
Heat preservation 40 minutes, stirring are warming up to 250 DEG C, keep the temperature 30 minutes, are continuously heating to 400 DEG C, keep the temperature 50 minutes, and stirring is cooled to
Room temperature obtains solder alloy used for electronic packaging.
The performance of solder alloy used for electronic packaging manufactured in the present embodiment is detected, solidus temperature is 214 DEG C, liquid
Liquidus temperature is 226 DEG C, elongation percentage 71%.
Embodiment 5
A kind of solder alloy used for electronic packaging, is calculated, is prepared using the following raw material in percentage by weight：
Bi 0.2%, Ag 0.09%, Y 0.3%, Zn 0.8%, Tb 0.01%, Nb 1.6%, Cu 0.4%, Ti
1.7%, surplus Sn.
Preparation process：
According to weight percent, Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn are added in into smelting furnace, are warming up to 180 DEG C,
Heat preservation 40 minutes, stirring are warming up to 250 DEG C, keep the temperature 30 minutes, are continuously heating to 400 DEG C, keep the temperature 50 minutes, and stirring is cooled to
Room temperature obtains solder alloy used for electronic packaging.
The performance of solder alloy used for electronic packaging manufactured in the present embodiment is detected, solidus temperature is 217 DEG C, liquid
Liquidus temperature is 226 DEG C, elongation percentage 70%.
The explanation of above example is only intended to help to understand method and its core concept of the invention.It should be pointed out that pair
For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out
Several improvement and modification, these improvement and modification are also fallen into the protection domain of the claims in the present invention.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide scope caused.
Claims (10)
1. a kind of solder alloy used for electronic packaging, which is characterized in that calculate, prepared using the following raw material in percentage by weight：
Bi 0.2-0.6%, Ag 0.05-0.09%, Y 0.3-0.7%, Zn 0.2-0.8%, Tb 0.01-0.05%, Nb
0.6-1.6%, Cu 0.4-0.9%, Ti 1.1-1.7%, surplus Sn.
2. solder alloy used for electronic packaging according to claim 1, which is characterized in that Bi 0.2-0.5%.
3. solder alloy used for electronic packaging according to claim 1, which is characterized in that Ag 0.06-0.09%.
4. solder alloy used for electronic packaging according to claim 1, which is characterized in that Y 0.3-0.5%.
5. solder alloy used for electronic packaging according to claim 1, which is characterized in that Zn 0.4-0.8%.
6. solder alloy used for electronic packaging according to claim 1, which is characterized in that Tb 0.01-0.03%.
7. solder alloy used for electronic packaging according to claim 1, which is characterized in that Nb 0.9-1.6%.
8. solder alloy used for electronic packaging according to claim 1, which is characterized in that Cu 0.4-0.7%.
9. solder alloy used for electronic packaging according to claim 1, which is characterized in that Ti 1.3-1.7%.
10. a kind of preparation method of solder alloy used for electronic packaging described in any one of claim 1-9, which is characterized in that
Comprise the following steps：
According to weight percent, Bi, Ag, Y, Zn, Tb, Nb, Cu, Ti, Sn are added in into smelting furnace, are warming up to 180 DEG C, heat preservation
40 minutes, stirring was warming up to 250 DEG C, keeps the temperature 30 minutes, is continuously heating to 400 DEG C, keeps the temperature 50 minutes, and stirring is cooled to room
Temperature obtains solder alloy used for electronic packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711333398.0A CN108080810A (en) | 2017-12-13 | 2017-12-13 | A kind of solder alloy used for electronic packaging and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711333398.0A CN108080810A (en) | 2017-12-13 | 2017-12-13 | A kind of solder alloy used for electronic packaging and preparation method thereof |
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| CN108080810A true CN108080810A (en) | 2018-05-29 |
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|---|---|---|---|---|
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| CN101318269A (en) * | 2008-07-14 | 2008-12-10 | 天津大学 | Tin-Silver-Zinc system lead-free solder with low silver content |
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| CN103889644A (en) * | 2012-10-09 | 2014-06-25 | 阿尔法金属公司 | Lead-free and antimony-free tin solder reliable at high temperatures |
| WO2015004467A2 (en) * | 2013-07-10 | 2015-01-15 | Cambridge Enterprise Limited | Materials and methods for soldering, and soldered products |
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2017
- 2017-12-13 CN CN201711333398.0A patent/CN108080810A/en active Pending
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| CN103889644A (en) * | 2012-10-09 | 2014-06-25 | 阿尔法金属公司 | Lead-free and antimony-free tin solder reliable at high temperatures |
| WO2015004467A2 (en) * | 2013-07-10 | 2015-01-15 | Cambridge Enterprise Limited | Materials and methods for soldering, and soldered products |
| US20160066435A1 (en) * | 2014-08-29 | 2016-03-03 | International Business Machines Corporation | Forming a solder joint between metal layers |
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Application publication date: 20180529 |