CN105397330A - Lead-free solder with high-temperature aging resistance and high strength - Google Patents
Lead-free solder with high-temperature aging resistance and high strength Download PDFInfo
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- CN105397330A CN105397330A CN201511010578.6A CN201511010578A CN105397330A CN 105397330 A CN105397330 A CN 105397330A CN 201511010578 A CN201511010578 A CN 201511010578A CN 105397330 A CN105397330 A CN 105397330A
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- free solder
- solder
- timeliness
- temperature resistance
- high strength
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Abstract
The invention discloses lead-free solder with high-temperature aging resistance and high strength. In terms of 100wt% of the lead-free solder by total weight, the lead-free solder comprises elements as follows: 3wt%-5wt% of silver, 0.2wt%-0.8wt% of copper, 0.5wt%-20wt% of bismuth, 0.005wt%-0.06wt% of nickel, 0.005wt%-0.02wt% of germanium or 0.0002wt%-1wt%of zinc and the balance of tin. The lead-free solder is made of an innovative material formed by the elements in a proper addition ratio, the material strength, hardness and silver needle forming resistance of the lead-free solder after aging can be improved and maintained, meanwhile, the strength and the oxidation resistance of a port are improved, and the lead-free solder can be applicable to wafer level encapsulation.
Description
Technical field
The present invention relates to a kind of solder alloy constituent, be specifically related to the high temperature resistance timeliness high strength Pb-free solder that a kind of applicable electronic component solder joint uses.
Background technology
In known skill, leypewter is often used as the solder alloy of electronic component, but because seriously polluted to environment of plumbous and compound, add environmental consciousness now and come back, leaded scolding tin suffers that the world limits the use of, and therefore replaces with Pb-free solder gradually in recent years gradually.
And generally traditional non-wafer-level packaging must through the step such as routing and filler, the size after encapsulation is also larger than original crystal grain, and this is the common denominator for early stage IC encapsulation technology.Again, Pb-free solder alloy can be made as the form of tin ball in application, electronic building brick can be engaged, the cement between suitable electronic building brick and distance piece (spacer) across a preset space length with printed circuit board (PCB) or substrate through tin ball.And the tin ball of soldering alloy must be considered grain size size, the strength of materials of ball and reduce acupuncture needle formation, welding cement when encapsulating just can be applicable to.
Along with the progress of encapsulation technology, develop a kind of wafer-level packaging (WaferLevelPackaging at present, be called for short WLP), this is the one of IC packaged type, after referring to that full wafer wafer production completes, its wafer in steps all before section completes, therefore directly on wafer, carry out packaging and testing, just be cut into single IC after completing, do not need the step through routing or filler.And the grain size of chip size almost with original after encapsulation is identical, chip size wafer-level packaging (WaferLevelChipScalePackage, be called for short WLCSP) therefore also can be called.
Again, because wafer-level packaging has less package dimension, the requirement of the size and alloy strength that are applied to solder alloy tin ball wherein requires different from the solder of traditional non-wafer-level packaging certainly.In general, wafer-level packaging IC comprises temperature relative to conventional package for environmental change, the resistance of humidity can be more weak, antagonism high-temperature aging performance requirement is higher, and acupuncture needle precipitate easily appears in wafer-level packaging scolding tin, severe patient, this acupuncture needle precipitate can pass solder joint and connect different solder joint, causes short circuit between solder joint, therefore, need develop a kind of scolding tin constituent of innovation, it is applicable to the solder demand of wafer-level packaging.
Summary of the invention
The object of this invention is to provide a kind of new Pb-free solder material compositions, it has high temperature resistance timeliness, high strength and anti-acupuncture needle being shaped.
For achieving the above object, the invention provides a kind of high temperature resistance timeliness high strength Pb-free solder, in the gross weight of this Pb-free solder for 100wt%, this Pb-free solder comprises:
The silver of 3 ~ 5wt%;
The copper of 0.2 ~ 0.8wt%;
The bismuth of 0.5-20wt%;
The nickel of 0.005 ~ 0.06wt%;
The germanium of 0.005 ~ 0.02wt%; And
Surplus is tin.
Above-mentioned high temperature resistance timeliness high strength Pb-free solder, wherein, the weight content of bismuth in described high temperature resistance timeliness high strength Pb-free solder is 0.5-10wt%; More preferably, the weight content of bismuth in described high temperature resistance timeliness high strength Pb-free solder is 1 ~ 7wt%.
Above-mentioned high temperature resistance timeliness high strength Pb-free solder, wherein, this high temperature resistance timeliness high strength Pb-free solder also comprises: the zinc of 0.0002 ~ 1wt%; Preferably, be the zinc of 0.0002 ~ 0.5wt%; More preferably, be the zinc of 0.0002 ~ 0.2wt%.
Present invention also offers the purposes that above-mentioned high temperature resistance timeliness high strength Pb-free solder is applicable to wafer-level packaging.
The innovative material composition that Pb-free solder provided by the invention is formed by the suitable adding proportion of above-mentioned each element, can promote and maintain the material strength of materials and hardness after high-temperature aging, promote joint strength, non-oxidizability, anti-acupuncture needle crystallized ability simultaneously, form complete Pb-free solder design of material, and this wafer-level packaging IC can be made to be applicable to the harsh environment of elevated temperature thermal cycles.
Detailed description of the invention
Technical scheme of the present invention is described in detail below in conjunction with embodiment.
The invention provides a kind of preferred embodiment of high temperature resistance timeliness high strength Pb-free solder, in gross weight contained by this high temperature resistance timeliness high strength Pb-free solder for 100wt%, this Pb-free solder comprises: the bismuth (Bi) of the silver (Ag) of 3 ~ 5wt%, the copper (Cu) of 0.2 ~ 0.8wt%, 1 ~ 7wt%, the nickel (Ni) of 0.005 ~ 0.06wt%, the germanium (Ge) of 0.005 ~ 0.02wt%, and surplus is tin (Sn).
Present invention also offers the preferred embodiment of a kind of high temperature resistance timeliness anti-acupuncture needle form high strength Pb-free solder, in gross weight contained by this high temperature resistance timeliness anti-acupuncture needle form high strength Pb-free solder for 100wt%, this Pb-free solder comprises: the bismuth (Bi) of the silver (Ag) of 3 ~ 5wt%, the copper (Cu) of 0.2 ~ 0.8wt%, 1 ~ 7wt%, the zinc (Zn) of 0.0002 ~ 0.2wt%, the nickel (Ni) of 0.005 ~ 0.06wt%, the germanium (Ge) of 0.005 ~ 0.02wt%, and surplus is tin (Sn).
Unleaded wlding alloy configuration mode: first by refractory metal silver, copper, nickel and germanium use high frequency calciner to be mixed with the weight ratio that this percentage of Sn+10wt%Ag(is Ag and Sn respectively, namely, foundry alloy composition is 90wt%Sn+10wt%Ag, lower same), Sn+5wt%Cu, Sn+1wt%Ni and Sn+1wt%Ge foundry alloy.Low-melting-point metal bismuth and zinc then add in simple metal mode, follow according to demand alloy composition ratio, each simple metal and foundry alloy addition is calculated according to percentage by weight, first 3N or 4N pure tin is devoted in calciner, sequential is needed to avoid pure tin ingot to build bridge when feeding intake, after completing by calciner temperature to 490 DEG C, after making pure tin melt into liquid state completely, first by Sn+10wt%Ag, Sn+5wt%Cu, Sn+1wt%Ni tri-kinds of foundry alloys and pure bismuth (not oxidizable foundry alloy and simple metal) add calciner, use agitator to stir 30 minutes simultaneously, make foundry alloy and simple metal can evenly melt dispersion to fuse in pure tin.Sn+1wt%Ge and pure zinc metal due to easily because of oxidization burning loss, cause composition variation error, so at silver, copper, after nickel and bismuth are melted in tin liquor completely, finally just add calciner to, Sn+1wt%Ge and pure zinc metal Keep agitation after 10 minutes again after adding, after sampling is cast and is analyzed sample ingot casting, spectrum analysis instrument (AES) is used to measure silver in tin liquor, copper, nickel, bismuth, zinc and gallium concentration, after confirming all metal ingredients ratio up to specification, by after calciner greenhouse cooling to 350 DEG C, again all tin liquors are cast tin bar, before tin liquor is cast in tin bar process and is completed the casting of all tin bars, need get again and analyse sample ingot casting and do analysis of components, guarantee that tin bar does not cause alloy composition segregation because holding temperature for a long time and exceeds standard.
The present invention adds this six kinds of elements in tinbase material, this solder alloy can be made into the spherical state of tin, and can be applicable to wafer-level packaging (being called for short WLP), there is excellent solder bond power, even if this solder alloy still can maintain identical sufficient intensity in high temperature environments after long-time (hereinafter referred to as high-temperature aging), solder alloy will be caused to crack because long-time high-temperature aging or cold and hot change impact or interface generation break apart between solder alloy and PCB weld pad (PCBPad) or substrate.
Wherein, the function that the present invention adds the silver of 3 ~ 5wt% is: suitable silver content can promote tensile strength and the solder hardness of solder alloy, but is above 5wt% silver content and solder alloy fusing point can be made too high and cannot apply.Through test, preferably the content of silver is 3 ~ 5wt%.
The object of adding copper is reduce solder alloy fusing point and promote solder alloy intensity, but when the excessive concentration of copper, can improve solder alloy fusing point on the contrary, and therefore preferably the content of copper is 0.2 ~ 0.8wt%.
Adding bismuth can help the silver in solder alloy to be dispersed in whole solder alloy material, avoids assembling forming the thick Ag of particle
3jie's Sn metal.And the bismuth added can be scattered in whole solder alloy to promote solder alloy intensity and hardness, avoid solder alloy because of after long-time high-temperature aging simultaneously, silver wherein and copper are assembled and are formed coarsening Jie metal, cause crack to grow up along Jie's metal to expand, and finally cause solder joints to lose efficacy.Follow and study discovery according to us, 0.5 ~ 20wt% bi content adds can effectively promote solder alloy intensity and hardness, but too high bi content can cause, and solder alloy is brittle, toughness forms non-plastic fracture when reducing and easily make Pb-free solder base material bear external force, through the better interpolation content of test 0.5 ~ 10wt% bismuth, the interpolation content of best bismuth is 1 ~ 7wt%.
Add the function of zinc: at the unleaded wlding of high silver content 3 ~ 5wt% silver, exceed saturated concentration owing to adding silver content, when Pb-free solder is in reflow process of setting, too much silver can separate out into Ag
3there is solder joints in Sn, and separates out Ag
3sn acupuncture needle is along with the thick acupuncture needle of process of setting president great achievement, and it is longer that setting rate maintains the liquid time more slowly, and institute's growth acupuncture needle size can be larger, due to Ag
3sn acupuncture needle is that a kind of Jie's metal has firmly crisp and low thermal coefficient of expansion characteristic, acupuncture needle and solder joints have very big-difference due to thermal coefficient of expansion and hardness, when electronic product is used in elevated temperature thermal cycles harsh environment, electronic product can because ambient temperature variation, and Pb-free solder contact produces internal stress in the middle of chip and substrate, this internal stress can make thick Ag
3sn acupuncture needle and scolding tin body produce crack, along with crack propagation and then cause whole contact to rupture, finally cause IC chip failure electronic product to scrap.Secondly; chip is being planted in ball assembling back welding process; thick acupuncture needle can protrude contact surface; and contact with contiguous solder joints and cause contact bridge joint, and between different solder joint, be designed to state of insulation often, but huge acupuncture needle belongs to conductor; acupuncture needle is crossed over two different solder joints and short circuit between solder joint finally can be caused to lose insulating effect; therefore can make the logical operation dysfunction of chip or the circuit that transmits electric power abnormal and lost efficacy, need rework in processing procedure, cause yield loss or product rejection.Add Zn-ef ficiency and can change Ag in solder joints
3sn nucleation and growth mechanism, and then back contact tissue is solidified in change, effectively suppresses Ag
3sn acupuncture needle nucleation with become to grow up to thick acupuncture needle.Study discovery according to us, Zn-ef ficiency adds effectively can suppress Ag from 0.0002 ~ 1wt%
3sn acupuncture needle is formed, but zinc is a kind of easily oxidizing elemental, add too many zinc and can change solder joints surface tension and oxide-film form, when chip needs repeatedly reflow in encapsulation procedure, solder joints is easily because oxidation causes contact surface deflections to be out of shape, affect tin ball coplanarity after chip reflow, cause chip yield loss or product rejection in SMT processing procedure.The better zinc of experimental result suggestion adds content range 0.0002 ~ 0.5wt%, and the interpolation content range of best zinc is 0.0002 ~ 0.2wt%.
Add the function of nickel: solder alloy not only wants to maintain intensity and the hardness of solder alloy itself in welding use procedure, while also to consider between solder alloy and substrate or PCB weld pad bond strength.If when the material of substrate or PCB weld pad is copper, then after high-temperature aging, the interface of solder alloy and weld pad or substrate can form more crisp Cu
3jie's Sn metal level, so will cause the adhesion of solder alloy and weld pad or substrate to reduce.And the present invention adds appropriate nickel can help adhesion preferably Cu
6sn
5formed, thus suppress Cu
3the generation of Sn, and can promote and strengthen adhesion.On the other hand, the Cu that nickel not only can suppress between solder alloy and substrate or weld pad is added
3the generation of Sn, also can suppress Cu and the Sn in the material of solder alloy own to form the Cu of fragility simultaneously
3sn.But, too high nickel element concentration not only not easily adds for solder alloy in manufacture, and the problem easily having interpolation uneven, too high nickel element can cause nickel supersaturation to separate out simultaneously, solder alloy is made to have brittle risk, alloy strength and hardness can be caused on the contrary to reduce, and through test, preferably the content of nickel is 0.005 ~ 0.06wt%.
Add the function of germanium: solder alloy is except needs consideration tin substrate intensity and in conjunction with except joint strength, due to solder alloy surface easily oxidation in reflow and long-time high-temperature aging process, so need to add the adhesion reduction that anti-oxidizing elements germanium causes to avoid base material be oxidized.And due to Ge content too low time without antioxidant effect or poor effect, Ge content is too high and the interface bond strength of solder alloy and substrate or weld pad then can be caused when being greater than 0.02wt% to reduce, and through test, preferably the content of germanium is 0.005 ~ 0.02wt%.
From illustrating above, above-mentioned six kinds of elements must be added to maintain and to guarantee to maintain substrate intensity and interface adhesion in the environment that leadless welding alloy can change at long-time high temperature or cold and heat succeed each other, avoid tinbase material to produce breaking and be separated in tinbase material simultaneously, and avoid being oxidized and the formation of huge acupuncture needle.Pb-free solder provided by the invention has the excellent specific properties such as high temperature resistance timeliness, high strength, anti-acupuncture needle shaping, is applicable to elevated temperature thermal cycles harsh environment, is specially adapted to wafer-level packaging IC.
Effect of the present invention is confirmed below by way of several experimental example of the present invention and several comparative example, and carry out the boundary strength at the contact place of substrate intensity, solder alloy and the copper pad after the substrate intensity of the solder alloy entirety of more each experimental example and each comparative example, high-temperature aging by experiment, or the non-oxidizability of solder alloy and anti-acupuncture needle formability.
The judgement of substrate intensity, the hardness using microhardness machine to detect the solder alloy entirety of each experimental example and each comparative example, and use VickersPyramidDiamondIndenter to apply pressure to each experimental example and each comparative example after 15 seconds with 50 grammes per square metres, measure the impression size being formed at surface, and converse microhardness value (Hv).The recording mode of the experimental result in each table is as follows:
Zero: represent microhardness value > 20Hv;
△: represent 15Hv < microhardness Zhi≤20Hv;
╳: represent microhardness Zhi≤15Hv.
The judgement of the substrate intensity after high-temperature aging is then make solder alloy in 150 DEG C of environment and after 7 days, then tests in the mensuration mode identical with above-mentioned substrate intensity.The recording mode of its experimental result is as follows:
Zero: represent microhardness value > 16Hv;
△: represent 11Hv < microhardness Zhi≤16Hv;
╳: represent microhardness Zhi≤11Hv.
The judgement of non-oxidizability is positioned in baking box by solder alloy, and 200 DEG C temperature and place after 30 minutes under passing to the environment of air, to take out and the surface brightness observing solder alloy changes.Wherein, oxidation resistant ability is the ability that anti-look becomes, and recording mode is as follows:
Zero: represent that metallic brightness is still possessed in the surface of solder alloy;
△: the micro-yellow of surface presentation representing solder alloy;
╳: represent the yellow blue or purple phase advancing coloud nearside of the surface presentation of solder alloy.
The judgement of joint strength is after being coordinated by solder alloy copper pad to carry out reflow, destroys the contact place of solder alloy and copper pad with high speed thrust machine, and through analysis failure mechanics brittle break degree to evaluate the joint strength at aforementioned contact place.Wherein, aforementioned test process is zonesheartest, and recording mode is as follows:
Zero: represent non-plastic fracture rate < 10%;
△: represent 10%≤non-plastic fracture rate < 15%;
╳: represent non-plastic fracture Shuai≤15%.
The judgement of anti-acupuncture needle formability is after being coordinated by solder alloy copper pad to carry out reflow, forms ratio with ultramicroscopic observation 100 pad surface acupuncture needles.Wherein, pad surface occurs that the lower ability being anti-acupuncture needle formability of acupuncture needle ratio is better, and recording mode is as follows:
Zero: represent that acupuncture needle ratio <5% appears in pad surface;
△: represent that acupuncture needle ratio <20% appears in 5%≤pad surface;
╳: represent that pad surface occurs that acupuncture needle is Bi Li≤20%.
Experimental example 1 ~ 3 changes Ag content, as shown in table 1.The silver content of experimental example 1 ~ 3 of the present invention is suitable as seen from Table 1, and the substrate intensity of solder alloy is good.And comparative example 1 not argentiferous, solder alloy intensity is poor and be unfavorable for that welding uses.The silver content of comparative example 2 is 6.0wt% and too high, causes solder alloy fusing point too high, and cannot apply higher than WLP process temperatures.
Table 1: experimental example 1 ~ 3 changes Ag content and comparative example 1-2
Experimental example 4 ~ 6 changes Cu content, as shown in table 2.The copper content of experimental example 4 ~ 6 of the present invention is suitable as seen from Table 2, and the substrate intensity of solder alloy is good.And comparative example 3 not cupric, solder alloy intensity is poor and be unfavorable for that welding uses.The copper content of comparative example 4 is 1.0wt% and too high, causes solder alloy fusing point too high, and cannot apply higher than WLP process temperatures.
Table 2: experimental example 4 ~ 6 changes Cu content and comparative example 3-4
Experimental example 7 ~ 12 changes Bi content, as shown in table 3.Can find out that the bi content of experimental example 7 ~ 12 of the present invention is suitable, continue after 7 days under the environment of 150 DEG C, the substrate intensity after the high-temperature aging of this solder alloy is still good.And comparative example 5 not bismuth-containing, the intensity difference of solder alloy after long-time high temperature.The bi content of comparative example 6 is 21wt% and too high, causes solder alloy toughness to reduce on the contrary and easily forms fragility, is easy to break, so the substrate intensity after the high-temperature aging of comparative example 6 is poor.
Table 3: experimental example 7 ~ 12 changes Bi content and comparative example 5-6
Experimental example 13,14 changes the content of germanium, as shown in table 4.The Ge content of experimental example 13,14 of the present invention is suitable as seen from Table 4, and solder alloy intensity is good, and the intensity between solder alloy and copper pad interface is also good.And anti oxidation layer can be formed in solder alloy outside by germanium metal, to intercept extraneous oxygen, and then promote non-oxidizability and the anti-look change ability of solder alloy entirety.And comparative example 7 is not germanic, the non-oxidizability of solder alloy is poor, so will cause that solder alloy is easily oxidated and solder bond power is poor.The Ge content of comparative example 8 is 0.030wt%, although can provide good non-oxidizability, cause base material to produce fragility and weaken, and joint strength is also deteriorated because Ge content is too high.
Table 4: experimental example 13-14 changes Ge content and comparative example 7-8
Experimental example 15-16 changes Ni content, as shown in table 5.The nickel content of experimental example 15-16 of the present invention is suitable as seen from Table 5, and the intensity between solder alloy and copper pad interface is good, and representative has good solder bond power.And comparative example 9 is not nickeliferous, the Cu of the fragility at interface cannot be suppressed
3the formation of Sn, therefore joint strength is poor.The nickel content of comparative example 10 is 0.10wt% and too high, and cause nickel not easily evenly to add on the contrary and be scattered in whole solder alloy, and can cause nickel supersaturation and separate out, cause solder alloy easily brittle on the contrary, thus joint strength is deteriorated.
Table 5: experimental example 15-16 changes Ni content and comparative example 9-10
Experimental example 17-20 changes Zn content, as shown in table 6.The Zn content of experimental example 17,18,19,20 of the present invention is suitable as seen from Table 6, and solder alloy anti-acupuncture needle formability is good, and representing solder has good anti-acupuncture needle crystallized ability to avoid chip failure.And comparative example 11 is not containing zinc, anti-acupuncture needle formability is poor, and solder joint can be caused to occur, and acupuncture needle makes chip failure probability increase.The Zn content of comparative example 13 is 1wt% and too high, causes weldability bad on the contrary, cannot apply.
Table 6: experimental example 17-20 changes Zn content and comparative example 11-13
In sum, the innovative material composition that high temperature resistance timeliness high strength Pb-free solder provided by the invention is formed by the suitable adding proportion of above-mentioned each element, can promote and the strength of materials, hardness, the anti-acupuncture needle crystallized ability of this Pb-free solder after maintaining high-temperature aging, promote joint strength and non-oxidizability simultaneously, be applicable to wafer-level packaging.
Although content of the present invention has done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple amendment of the present invention and substitute will be all apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (8)
1. a high temperature resistance timeliness high strength Pb-free solder, is characterized in that, in the gross weight of this high temperature resistance timeliness high strength Pb-free solder for 100wt%, this high temperature resistance timeliness high strength Pb-free solder comprises:
The silver of 3 ~ 5wt%;
The copper of 0.2 ~ 0.8wt%;
The bismuth of 0.5-20wt%;
The nickel of 0.005 ~ 0.06wt%;
The germanium of 0.005 ~ 0.02wt%; And
Surplus is tin.
2. high temperature resistance timeliness high strength Pb-free solder as claimed in claim 1, it is characterized in that, the weight content of bismuth in described high temperature resistance timeliness high strength Pb-free solder is 0.5-10wt%.
3. high temperature resistance timeliness high strength Pb-free solder as claimed in claim 2, it is characterized in that, the weight content of bismuth in described high temperature resistance timeliness high strength Pb-free solder is 1 ~ 7wt%.
4. as the high temperature resistance timeliness high strength Pb-free solder in claim 1-3 as described in any one, it is characterized in that, this high temperature resistance timeliness high strength Pb-free solder also comprises: the zinc of 0.0002 ~ 1wt%.
5. high temperature resistance timeliness high strength Pb-free solder as claimed in claim 4, it is characterized in that, this high temperature resistance timeliness high strength Pb-free solder also comprises: the zinc of 0.0002 ~ 0.5wt%.
6. high temperature resistance timeliness high strength Pb-free solder as claimed in claim 5, it is characterized in that, this high temperature resistance timeliness high strength Pb-free solder also comprises: the zinc of 0.0002 ~ 0.2wt%.
7. according to a purposes for the high temperature resistance timeliness high strength Pb-free solder in claim 1-3 described in any one, it is characterized in that, this high temperature resistance timeliness high strength Pb-free solder is applicable to wafer-level packaging.
8. a purposes for high temperature resistance timeliness high strength Pb-free solder according to claim 4, is characterized in that, this high temperature resistance timeliness high strength Pb-free solder is applicable to wafer-level packaging.
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|---|---|---|---|
| CN201810124342.2A CN108406158A (en) | 2015-12-30 | 2015-12-30 | High temperature resistance timeliness high intensity Pb-free solder |
| CN201511010578.6A CN105397330A (en) | 2015-12-30 | 2015-12-30 | Lead-free solder with high-temperature aging resistance and high strength |
| TW105142614A TWI610378B (en) | 2015-12-30 | 2016-12-22 | High temperature resistant, high strength, lead free solder |
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| CN201511010578.6A CN105397330A (en) | 2015-12-30 | 2015-12-30 | Lead-free solder with high-temperature aging resistance and high strength |
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| CN201810124342.2A Pending CN108406158A (en) | 2015-12-30 | 2015-12-30 | High temperature resistance timeliness high intensity Pb-free solder |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018023987A (en) * | 2016-08-09 | 2018-02-15 | 株式会社日本スペリア社 | Jointing method |
| CN107900550A (en) * | 2017-05-17 | 2018-04-13 | 上海飞凯光电材料股份有限公司 | Solder composition |
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| JP2004058085A (en) * | 2002-07-26 | 2004-02-26 | Senju Metal Ind Co Ltd | Lead-free soldering alloy |
| CN1799757A (en) * | 2006-01-04 | 2006-07-12 | 东莞市千岛金属锡品有限公司 | Environmental friendly lead-free solder and its preparation method |
| CN101992362A (en) * | 2010-11-30 | 2011-03-30 | 广州市铠特电子材料有限公司 | Oxidation-resistant lead-free solder alloy suitable for powder process |
| CN103889644A (en) * | 2012-10-09 | 2014-06-25 | 阿尔法金属公司 | Lead-free and antimony-free tin solder reliable at high temperatures |
| TW201442818A (en) * | 2013-05-03 | 2014-11-16 | Accurus Scient Co Ltd | High strength lead-free solder at high temperature aging resistance |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018023987A (en) * | 2016-08-09 | 2018-02-15 | 株式会社日本スペリア社 | Jointing method |
| CN107900550A (en) * | 2017-05-17 | 2018-04-13 | 上海飞凯光电材料股份有限公司 | Solder composition |
| CN107900550B (en) * | 2017-05-17 | 2020-07-21 | 上海飞凯光电材料股份有限公司 | Solder composition |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI610378B (en) | 2018-01-01 |
| TW201724299A (en) | 2017-07-01 |
| CN108406158A (en) | 2018-08-17 |
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