CN1799757A - Environmental friendly lead-free solder and its preparation method - Google Patents
Environmental friendly lead-free solder and its preparation method Download PDFInfo
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- CN1799757A CN1799757A CN 200610032636 CN200610032636A CN1799757A CN 1799757 A CN1799757 A CN 1799757A CN 200610032636 CN200610032636 CN 200610032636 CN 200610032636 A CN200610032636 A CN 200610032636A CN 1799757 A CN1799757 A CN 1799757A
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Abstract
The invention relates to welding material, especially providing a high-temperature resistance oxidation environment-friendly leadless solder and relative preparation method. said leadless solder comprises following elements in weight percents: 2-5% AG, 0.1-2% Cu, 0.001-0.1% Ce, 0.001-0.5% Ni and Sn. Compared to present technique, the invention is environment-friendly, which can effectively avoid lead poisoning of operator and when the solder is welded in high temperature (380-500Deg. C), it has minute oxidation sludge. The invention has high-temperature resistance oxidation ability which can keep the surface of tin furnace bright without oxidation in this temperature, and the welded tin furnace can last non-oxidation condition for longer time. The invention has less welding defects compared to common Sn-Ag-Cu system, bright surface of welding point and improved welding quality.
Description
Technical field
The present invention relates to welding material, relate in particular to a kind of resistance to high temperature oxidation that has, environment-friendly type lead-free solder and preparation method thereof.
Background technology
The welding material of electronics industry is mainly based on leypewter, though leypewter has excellent welding performance, lead is noxious material, enters behind the human body in bone constantly accumulation and is difficult for discharging, and causes operating personnel's lead poisoning.Unleaded is the development trend of domestic and international microelectronics assembling industry soldering tech.But existing lead-free solder, when at high temperature welding, often welding slag is too much, and bridge defects is more, and welding quality is not high
Summary of the invention
The object of the present invention is to provide a kind of environment-friendly high-temperature oxidation resistant lead-free solder and preparation method thereof.
A kind of environment-friendly type lead-free solder of the present invention and preparation method thereof, the composition percentage by weight of this lead-free solder is:
Ag2-5%, Cu0.1-2%, Ce0.001-0.1%, Ni0.001-0.5% and Sn surplus are formed.
Preparation method of the present invention adopts following steps:
A prepares intermediate alloy
Preparation nickel, ashbury metal:
The raw material weight proportioning is a nickel: tin=0.5: 99.5, nickel is inserted in the high temperature furnace of 800 ℃-1500 ℃ of temperature and melt, adding tin again and rocking gently mixes tin and nickel, shift out high temperature furnace, temperature is reduced between 550-600 ℃, stirred 10-15 minute, pour in the mould, make nickeliferously 0.5%, the alloy of tin 99.5% is stand-by;
B prepares scolder
(1) tin is put into the container of a steel, steel vessel is placed on the electric furnace,, make tin be fused into liquid state 250 ℃-360 ℃ heating down;
(2) add silver, copper stirring 30-60 minute, it is fully melted;
(3) add nickeltin, stirred 8-12 minute;
(4) scolder that stirs is poured in the mould, promptly obtained required scolder.
Environment-friendly type lead-free solder of the present invention compared with prior art; help environmental protection; avoid operating personnel's lead poisoning effectively, when scolder welds at high temperature (380 ℃-500 ℃), few oxidizing slag; has high-temperature oxidation resistance; and can remain on the basic non-oxidation of tin stove surface-brightening under this temperature, welding back tin stove can keep non-oxidation state for more time, is still less weld defect than common Sn-Ag-Cu during welding; the solder joint surface-brightening has improved welding quality effectively.
The specific embodiment
Below in conjunction with specific embodiment the present invention is described in further detail, but content of the present invention is not limited to embodiment.
Embodiment lead-free solder prescription
| Composition | 1# | 2# | 3# | 4# | 5# | 6# |
| Ag | 2 | 2 | 5 | 5 | 2.3 | 3.6 |
| Cu | 0.1 | 0.1 | 2 | 2 | 0.16 | 1 |
| Ce | 0.001 | 0.001 | 0.1 | 0.1 | 0.07 | 0.09 |
| Ni | 0.001 | 0.001 | 0.5 | 0.5 | 0.05 | 0.15 |
| Sn | 97.898 | 97.898 | 92.4 | 92.4 | 97.42 | 95.16 |
These properties of product
The certain cerium of interpolation and phosphorus solder alloy physical property, solder joint performance mechanical property, wetability and institutional framework all get very big improvement in SAC.
1. its electric conductivity and resistivity all are lower than the 63Sn-37Pb eutectic alloy.
Fusion temperature measure its solidus, liquidus curve, with the increase of Ce content present gradually, reduction trend.
3. spreadability presents increase trend with the increase of Ce content, spreading ratio; But when Ce content (〉=1wt%), spreading ratio no longer increase when (〉=spreading ratio presents decline 3wt%) time.
4. after the adding of tensile property Ce, make its performance become complicated; Presenting first the reduction afterwards for as-cast specimen increases; Percentage elongation presents increases back reduction trend earlier.
Butt welding point, the fusing point fusing point that influences the basic butt welding point alloy of micro-Ce do not have influence, when Ce is that the 0.019wt% alloy melting point slightly reduces, scruff obviously reduces, the solder joint brightness increases.
Claims (2)
1, a kind of environment-friendly type lead-free solder and preparation method thereof is characterized in that the composition percentage by weight of this scolder is: Ag2-5%, Cu0.1-2%, Ce0.001-0.1%, Ni0.001-0.5% and Sn surplus.
2, the preparation method of lead-free solder according to claim 1 is characterized in that this preparation method adopts following steps:
A prepares intermediate alloy
Preparation nickel, ashbury metal:
The raw material weight proportioning is a nickel: tin=0.5: 99.5, nickel is inserted in the high temperature furnace of 800 ℃-1500 ℃ of temperature and melt, adding tin again and rocking gently mixes tin and nickel, shift out high temperature furnace, temperature is reduced between 550-600 ℃, stirred 10-15 minute, pour in the mould, make nickeliferously 0.5%, the alloy of tin 99.5% is stand-by;
B prepares scolder
(1) tin is put into the container of a steel, steel vessel is placed on the electric furnace,, make tin be fused into liquid state 250 ℃-360 ℃ heating down;
(2) add silver, copper stirring 30-60 minute, it is fully melted;
(3) add nickeltin, stirred 8-12 minute;
(4) scolder that stirs is poured in the mould, promptly obtained required scolder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610032636 CN1799757A (en) | 2006-01-04 | 2006-01-04 | Environmental friendly lead-free solder and its preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610032636 CN1799757A (en) | 2006-01-04 | 2006-01-04 | Environmental friendly lead-free solder and its preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1799757A true CN1799757A (en) | 2006-07-12 |
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ID=36810096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610032636 Pending CN1799757A (en) | 2006-01-04 | 2006-01-04 | Environmental friendly lead-free solder and its preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1799757A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102642096A (en) * | 2011-02-18 | 2012-08-22 | 苏州宇邦新型材料有限公司 | Solder, tin-plated solder strip adopting solder and preparation methods of solder and tin-plated solder strip |
| CN105397330A (en) * | 2015-12-30 | 2016-03-16 | 上海新阳半导体材料股份有限公司 | Lead-free solder with high-temperature aging resistance and high strength |
| CN106271187B (en) * | 2016-09-12 | 2020-10-09 | 东莞市千岛金属锡品有限公司 | Lead-free high-temperature oxidation-resistant solder and preparation method thereof |
-
2006
- 2006-01-04 CN CN 200610032636 patent/CN1799757A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102642096A (en) * | 2011-02-18 | 2012-08-22 | 苏州宇邦新型材料有限公司 | Solder, tin-plated solder strip adopting solder and preparation methods of solder and tin-plated solder strip |
| CN105397330A (en) * | 2015-12-30 | 2016-03-16 | 上海新阳半导体材料股份有限公司 | Lead-free solder with high-temperature aging resistance and high strength |
| CN106271187B (en) * | 2016-09-12 | 2020-10-09 | 东莞市千岛金属锡品有限公司 | Lead-free high-temperature oxidation-resistant solder and preparation method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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