KR20150119806A - 연삭 장치 - Google Patents

연삭 장치 Download PDF

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Publication number
KR20150119806A
KR20150119806A KR1020150052626A KR20150052626A KR20150119806A KR 20150119806 A KR20150119806 A KR 20150119806A KR 1020150052626 A KR1020150052626 A KR 1020150052626A KR 20150052626 A KR20150052626 A KR 20150052626A KR 20150119806 A KR20150119806 A KR 20150119806A
Authority
KR
South Korea
Prior art keywords
grinding
ultrasonic
cleaning liquid
workpiece
cleaning solution
Prior art date
Application number
KR1020150052626A
Other languages
English (en)
Korean (ko)
Inventor
유키 이노우에
신야 와타나베
준수 우
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20150119806A publication Critical patent/KR20150119806A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
KR1020150052626A 2014-04-16 2015-04-14 연삭 장치 KR20150119806A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-084198 2014-04-16
JP2014084198A JP2015202545A (ja) 2014-04-16 2014-04-16 研削装置

Publications (1)

Publication Number Publication Date
KR20150119806A true KR20150119806A (ko) 2015-10-26

Family

ID=54372365

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150052626A KR20150119806A (ko) 2014-04-16 2015-04-14 연삭 장치

Country Status (4)

Country Link
JP (1) JP2015202545A (ja)
KR (1) KR20150119806A (ja)
CN (1) CN104999370A (ja)
TW (1) TW201600240A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170086310A (ko) * 2016-01-18 2017-07-26 삼성전자주식회사 기판 씨닝 장치, 이를 이용한 기판의 씨닝 방법, 및 반도체 패키지의 제조 방법
KR20180037113A (ko) * 2016-10-03 2018-04-11 가부시기가이샤 디스코 웨이퍼의 가공 방법 및 연마 장치

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6814579B2 (ja) * 2016-09-20 2021-01-20 株式会社ディスコ 研削ホイール及び研削装置
CN106392884B (zh) * 2016-12-14 2019-10-18 北京中电科电子装备有限公司 一种砂轮的修整控制系统及方法
JP7154690B2 (ja) * 2018-06-22 2022-10-18 株式会社ディスコ 研削砥石の目立て方法
JP7299773B2 (ja) * 2019-07-09 2023-06-28 株式会社ディスコ 研削装置
JP2021176661A (ja) 2020-05-07 2021-11-11 株式会社ディスコ 研削装置
CN115847293A (zh) * 2022-12-15 2023-03-28 西安奕斯伟材料科技有限公司 研磨清洗设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001038594A (ja) * 1999-07-29 2001-02-13 Olympus Optical Co Ltd 光学素子研磨方法及び光学素子研磨装置
TW492065B (en) * 2001-07-20 2002-06-21 United Microelectronics Corp Structure of polishing pad conditioner and method of use
JP2005254424A (ja) * 2004-03-15 2005-09-22 Kiyoshi Suzuki 超音波重畳型加工液供給ノズル
JP2006095663A (ja) * 2004-09-30 2006-04-13 Toyo Advanced Technologies Co Ltd 研削装置の砥石修正方法、研削方法および研削装置
JP2006281341A (ja) * 2005-03-31 2006-10-19 Matsushita Electric Ind Co Ltd 研削装置
JP2011189456A (ja) * 2010-03-15 2011-09-29 Disco Corp 研削装置及び研削方法
JP5982693B2 (ja) * 2012-08-13 2016-08-31 国立大学法人長岡技術科学大学 研削液供給装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170086310A (ko) * 2016-01-18 2017-07-26 삼성전자주식회사 기판 씨닝 장치, 이를 이용한 기판의 씨닝 방법, 및 반도체 패키지의 제조 방법
KR20180037113A (ko) * 2016-10-03 2018-04-11 가부시기가이샤 디스코 웨이퍼의 가공 방법 및 연마 장치

Also Published As

Publication number Publication date
CN104999370A (zh) 2015-10-28
TW201600240A (zh) 2016-01-01
JP2015202545A (ja) 2015-11-16

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E902 Notification of reason for refusal
E601 Decision to refuse application