KR20150038360A - 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템 - Google Patents

빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템 Download PDF

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Publication number
KR20150038360A
KR20150038360A KR20157004933A KR20157004933A KR20150038360A KR 20150038360 A KR20150038360 A KR 20150038360A KR 20157004933 A KR20157004933 A KR 20157004933A KR 20157004933 A KR20157004933 A KR 20157004933A KR 20150038360 A KR20150038360 A KR 20150038360A
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KR
South Korea
Prior art keywords
substrate
transfer
module
arm
chamber
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Ceased
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KR20157004933A
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English (en)
Korean (ko)
Inventor
크리스토퍼 호프마이스터
알렉산더 쥐. 크루피쉐브
율리시스 길크라이스트
Original Assignee
브룩스 오토메이션 인코퍼레이티드
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Publication of KR20150038360A publication Critical patent/KR20150038360A/ko
Ceased legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00Manipulators not otherwise provided for
    • B25J11/0095Manipulators transporting wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/02Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041Cylindrical coordinate type
    • B25J9/042Cylindrical coordinate type comprising an articulated arm
    • B25J9/043Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/10Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR20157004933A 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템 Ceased KR20150038360A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US93891307P 2007-05-18 2007-05-18
US60/938,913 2007-05-18
US12/123,329 US8562271B2 (en) 2007-05-18 2008-05-19 Compact substrate transport system
US12/123,329 2008-05-19
PCT/US2008/064144 WO2008144664A1 (en) 2007-05-18 2008-05-19 Compact substrate transport system with fast swap robot

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020097026390A Division KR20100031681A (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020167013801A Division KR101887110B1 (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템

Publications (1)

Publication Number Publication Date
KR20150038360A true KR20150038360A (ko) 2015-04-08

Family

ID=40122195

Family Applications (3)

Application Number Title Priority Date Filing Date
KR20157004933A Ceased KR20150038360A (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
KR1020097026390A Ceased KR20100031681A (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
KR1020167013801A Active KR101887110B1 (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020097026390A Ceased KR20100031681A (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
KR1020167013801A Active KR101887110B1 (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템

Country Status (4)

Country Link
US (2) US8562271B2 (enExample)
JP (4) JP5543336B2 (enExample)
KR (3) KR20150038360A (enExample)
WO (1) WO2008144664A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200050039A (ko) * 2018-10-31 2020-05-11 세메스 주식회사 기판 처리 장치 및 방법

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6918731B2 (en) 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
US10086511B2 (en) * 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
WO2012089732A1 (en) * 2010-12-29 2012-07-05 Oc Oerlikon Balzers Ag Vacuum treatment apparatus and a method for manufacturing
KR102179267B1 (ko) 2011-09-16 2020-11-16 퍼시몬 테크놀로지스 코포레이션 패시브 회전자를 가진 로봇 구동
US9202733B2 (en) * 2011-11-07 2015-12-01 Persimmon Technologies Corporation Robot system with independent arms
KR101271794B1 (ko) * 2011-12-01 2013-06-07 박호현 로드락 챔버
JP5885528B2 (ja) * 2012-02-14 2016-03-15 株式会社安川電機 搬送装置
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
US9149936B2 (en) 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
KR20220153121A (ko) * 2013-01-18 2022-11-17 퍼시몬 테크놀로지스 코포레이션 이송 장치
EP2948980B1 (en) * 2013-01-22 2021-08-25 Brooks Automation, Inc. Substrate transport
TWI684229B (zh) 2013-07-08 2020-02-01 美商布魯克斯自動機械公司 具有即時基板定心的處理裝置
US10348172B2 (en) 2013-11-13 2019-07-09 Brooks Automation, Inc. Sealed switched reluctance motor
TWI695447B (zh) 2013-11-13 2020-06-01 布魯克斯自動機械公司 運送設備
KR102686315B1 (ko) 2013-11-13 2024-07-19 브룩스 오토메이션 인코퍼레이티드 씰링된 로봇 드라이브
KR20220000416A (ko) 2013-11-13 2022-01-03 브룩스 오토메이션 인코퍼레이티드 브러쉬리스 전기 기계 제어 방법 및 장치
KR102401836B1 (ko) * 2014-05-07 2022-05-25 에이에스엠엘 네델란즈 비.브이. 타겟 가공 기계용 봉입체
US11691268B2 (en) 2015-03-12 2023-07-04 Persimmon Technologies Corporation Robot having a variable transmission ratio
CN106298583B (zh) * 2015-05-27 2019-12-03 中微半导体设备(上海)股份有限公司 处理腔、处理腔和真空锁组合以及基片处理系统
US9564350B1 (en) * 2015-09-18 2017-02-07 Globalfoundries Inc. Method and apparatus for storing and transporting semiconductor wafers in a vacuum pod
US10124492B2 (en) 2015-10-22 2018-11-13 Lam Research Corporation Automated replacement of consumable parts using end effectors interfacing with plasma processing system
US10062599B2 (en) 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US20170115657A1 (en) * 2015-10-22 2017-04-27 Lam Research Corporation Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
US9881820B2 (en) 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
JP7158133B2 (ja) * 2017-03-03 2022-10-21 アプライド マテリアルズ インコーポレイテッド 雰囲気が制御された移送モジュール及び処理システム
JP7251673B2 (ja) * 2017-06-16 2023-04-04 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6939335B2 (ja) * 2017-09-27 2021-09-22 Tdk株式会社 ロードポート装置、ロードポート装置の駆動方法
TWI628133B (zh) * 2017-11-03 2018-07-01 東台精機股份有限公司 雙向搬運臺車
US11380564B2 (en) * 2018-09-19 2022-07-05 Applied Materials, Inc. Processing system having a front opening unified pod (FOUP) load lock
US20200395232A1 (en) * 2019-06-14 2020-12-17 Brooks Automation, Inc. Substrate process apparatus
US11031269B2 (en) * 2019-08-22 2021-06-08 Kawasaki Jukogyo Kabushiki Kaisha Substrate transport robot, substrate transport system, and substrate transport method
US11823932B2 (en) * 2020-08-26 2023-11-21 Samsung Electronics Co., Ltd. Substrate processing system and substrate processing apparatus
KR102625679B1 (ko) * 2021-11-05 2024-01-17 프리시스 주식회사 로드락모듈 및 이를 포함하는 기판처리시스템
JP7582232B2 (ja) 2022-03-03 2024-11-13 村田機械株式会社 保管装置及び保管方法

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590381A (ja) * 1991-09-26 1993-04-09 Tokyo Electron Ltd 搬送装置
US5102280A (en) 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
IT1251017B (it) 1991-05-21 1995-04-28 Ugo Crippa Meccanismo per compiere traiettorie prefissate assimilabili ad ellittiche
JP3429786B2 (ja) * 1991-05-29 2003-07-22 東京エレクトロン株式会社 半導体製造装置
JPH0536809A (ja) * 1991-07-31 1993-02-12 Mitsubishi Electric Corp 半導体基板処理装置に於ける半導体基板搬送アーム
US5334761A (en) * 1992-08-28 1994-08-02 Life Technologies, Inc. Cationic lipids
JPH0697258A (ja) * 1992-09-17 1994-04-08 Hitachi Ltd 連続真空処理装置
JPH06285780A (ja) * 1993-04-06 1994-10-11 Kokusai Electric Co Ltd 搬送用ロボット
KR100267617B1 (ko) 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
JPH07142551A (ja) * 1993-11-20 1995-06-02 Tokyo Electron Ltd 搬送アーム装置及びこれを用いた処理室集合装置
JP3554534B2 (ja) 1995-12-12 2004-08-18 東京エレクトロン株式会社 半導体処理装置の基板支持機構及び基板交換方法、並びに半導体処理装置及び基板搬送装置
US5944857A (en) 1997-05-08 1999-08-31 Tokyo Electron Limited Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor
US6491491B1 (en) 1997-10-30 2002-12-10 Sankyo Seiki Mfg. Co., Ltd. Articulated robot
JPH11129175A (ja) * 1997-10-30 1999-05-18 Sankyo Seiki Mfg Co Ltd 多関節ロボット
US6042623A (en) 1998-01-12 2000-03-28 Tokyo Electron Limited Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor
US6375746B1 (en) 1998-07-10 2002-04-23 Novellus Systems, Inc. Wafer processing architecture including load locks
US6431807B1 (en) 1998-07-10 2002-08-13 Novellus Systems, Inc. Wafer processing architecture including single-wafer load lock with cooling unit
KR100283425B1 (ko) 1998-09-24 2001-04-02 윤종용 반도체소자의금속배선형성공정및그시스템
US6960057B1 (en) * 1998-09-30 2005-11-01 Brooks Automation, Inc. Substrate transport apparatus
JP2000150618A (ja) * 1998-11-17 2000-05-30 Tokyo Electron Ltd 真空処理システム
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
JP4256551B2 (ja) 1998-12-25 2009-04-22 東京エレクトロン株式会社 真空処理システム
JP4312965B2 (ja) * 1999-01-12 2009-08-12 東京エレクトロン株式会社 真空処理装置
US6318945B1 (en) 1999-07-28 2001-11-20 Brooks Automation, Inc. Substrate processing apparatus with vertically stacked load lock and substrate transport robot
JP2001135704A (ja) 1999-11-09 2001-05-18 Sharp Corp 基板処理装置及び基板搬送用トレイの搬送制御方法
US6977014B1 (en) 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
KR100364656B1 (ko) 2000-06-22 2002-12-16 삼성전자 주식회사 실리사이드 증착을 위한 화학 기상 증착 방법 및 이를수행하기 위한 장치
JP4576694B2 (ja) * 2000-10-11 2010-11-10 東京エレクトロン株式会社 被処理体の処理システムの搬送位置合わせ方法及び被処理体の処理システム
JP2002158272A (ja) * 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
JP2002164402A (ja) * 2000-11-24 2002-06-07 Meidensha Corp 基板搬送用ロボット
US6918731B2 (en) 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
US20030014155A1 (en) 2001-07-12 2003-01-16 Applied Material, Inc. High temperature substrate transfer robot
JP3962609B2 (ja) * 2002-03-05 2007-08-22 東京エレクトロン株式会社 搬送装置
US6932871B2 (en) 2002-04-16 2005-08-23 Applied Materials, Inc. Multi-station deposition apparatus and method
KR100483428B1 (ko) 2003-01-24 2005-04-14 삼성전자주식회사 기판 가공 장치
KR101121937B1 (ko) 2003-03-31 2012-03-14 램 리써치 코포레이션 웨이퍼 처리를 위한 챔버 및 관련 방법
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
JP4673548B2 (ja) 2003-11-12 2011-04-20 東京エレクトロン株式会社 基板処理装置及びその制御方法
JP4356480B2 (ja) * 2004-03-03 2009-11-04 株式会社安川電機 搬送装置と半導体製造装置
JP2005259858A (ja) 2004-03-10 2005-09-22 Hitachi Kokusai Electric Inc 基板処理装置
JP4524132B2 (ja) 2004-03-30 2010-08-11 東京エレクトロン株式会社 真空処理装置
US8292563B2 (en) 2004-06-28 2012-10-23 Brooks Automation, Inc. Nonproductive wafer buffer module for substrate processing apparatus
US20060011297A1 (en) * 2004-07-15 2006-01-19 Jusung Engineering Co., Ltd. Semiconductor manufacturing apparatus
JP4860219B2 (ja) 2005-02-14 2012-01-25 東京エレクトロン株式会社 基板の処理方法、電子デバイスの製造方法及びプログラム
US7472581B2 (en) 2005-03-16 2009-01-06 Tokyo Electron Limited Vacuum apparatus
JP4566798B2 (ja) 2005-03-30 2010-10-20 東京エレクトロン株式会社 基板位置決め装置,基板位置決め方法,プログラム
JP4595053B2 (ja) * 2005-04-11 2010-12-08 日本電産サンキョー株式会社 多関節型ロボット
US7286890B2 (en) 2005-06-28 2007-10-23 Tokyo Electron Limited Transfer apparatus for target object
US9248568B2 (en) * 2005-07-11 2016-02-02 Brooks Automation, Inc. Unequal link SCARA arm
US8573919B2 (en) * 2005-07-11 2013-11-05 Brooks Automation, Inc. Substrate transport apparatus
JP4933789B2 (ja) 2006-02-13 2012-05-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
TWI476855B (zh) 2006-05-03 2015-03-11 Gen Co Ltd 基板傳輸設備、和使用該設備的高速基板處理系統
US7738987B2 (en) 2006-11-28 2010-06-15 Tokyo Electron Limited Device and method for controlling substrate processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200050039A (ko) * 2018-10-31 2020-05-11 세메스 주식회사 기판 처리 장치 및 방법

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JP2020010059A (ja) 2020-01-16
JP5543336B2 (ja) 2014-07-09
JP2011504288A (ja) 2011-02-03
US9401294B2 (en) 2016-07-26
JP6898403B2 (ja) 2021-07-07
KR101887110B1 (ko) 2018-08-09
JP2017143270A (ja) 2017-08-17
KR20160066555A (ko) 2016-06-10
US20090003976A1 (en) 2009-01-01
US8562271B2 (en) 2013-10-22
US20140044504A1 (en) 2014-02-13
WO2008144664A1 (en) 2008-11-27

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