KR20150013627A - Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치 - Google Patents

Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치 Download PDF

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Publication number
KR20150013627A
KR20150013627A KR1020147033299A KR20147033299A KR20150013627A KR 20150013627 A KR20150013627 A KR 20150013627A KR 1020147033299 A KR1020147033299 A KR 1020147033299A KR 20147033299 A KR20147033299 A KR 20147033299A KR 20150013627 A KR20150013627 A KR 20150013627A
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KR
South Korea
Prior art keywords
chuck
processing chamber
bonding material
protective
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020147033299A
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English (en)
Korean (ko)
Inventor
싱 린
제니퍼 와이. 선
수만트 반다
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20150013627A publication Critical patent/KR20150013627A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
KR1020147033299A 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치 Ceased KR20150013627A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261638908P 2012-04-26 2012-04-26
US61/638,908 2012-04-26
PCT/US2012/056617 WO2013162641A1 (en) 2012-04-26 2012-09-21 Methods and apparatus toward preventing esc bonding adhesive erosion

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020177026402A Division KR20170109690A (ko) 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치
KR1020197031915A Division KR20190124348A (ko) 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치

Publications (1)

Publication Number Publication Date
KR20150013627A true KR20150013627A (ko) 2015-02-05

Family

ID=49477073

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020147033299A Ceased KR20150013627A (ko) 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치
KR1020177026402A Ceased KR20170109690A (ko) 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치
KR1020227033028A Active KR102780538B1 (ko) 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치
KR1020197031915A Ceased KR20190124348A (ko) 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020177026402A Ceased KR20170109690A (ko) 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치
KR1020227033028A Active KR102780538B1 (ko) 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치
KR1020197031915A Ceased KR20190124348A (ko) 2012-04-26 2012-09-21 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치

Country Status (6)

Country Link
US (2) US8982530B2 (https=)
JP (2) JP6180510B2 (https=)
KR (4) KR20150013627A (https=)
CN (2) CN104247003B (https=)
TW (1) TWI578436B (https=)
WO (1) WO2013162641A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180042223A (ko) * 2015-08-27 2018-04-25 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
KR20240083131A (ko) * 2013-12-26 2024-06-11 램 리써치 코포레이션 하부 전극 어셈블리용 에지 시일

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US20130286530A1 (en) 2013-10-31
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