JP4458995B2 - ウェハ支持部材 - Google Patents
ウェハ支持部材 Download PDFInfo
- Publication number
- JP4458995B2 JP4458995B2 JP2004264508A JP2004264508A JP4458995B2 JP 4458995 B2 JP4458995 B2 JP 4458995B2 JP 2004264508 A JP2004264508 A JP 2004264508A JP 2004264508 A JP2004264508 A JP 2004264508A JP 4458995 B2 JP4458995 B2 JP 4458995B2
- Authority
- JP
- Japan
- Prior art keywords
- support member
- wafer support
- recess
- wafer
- protective member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001681 protective effect Effects 0.000 claims description 41
- 239000012790 adhesive layer Substances 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 239000004809 Teflon Substances 0.000 claims description 6
- 229920006362 Teflon® Polymers 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 description 16
- 239000010410 layer Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- 239000010408 film Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000003628 erosive effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000013464 silicone adhesive Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920006169 Perfluoroelastomer Polymers 0.000 description 1
- 241000555745 Sciuridae Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
102、202、402、502:板状セラミック体
103、203、403、:載置面
104、204、404、504:静電吸着用電極
107、207、407、507:ベース部材
Claims (6)
- 板状セラミックス体の一方の主面をウェハを載せる載置面とし、他方の主面あるいは内部に電極を備えた静電チャック部と、該静電チャック部と接着層を介して接合したベース部とからなるウェハ支持部材において、上記接着層の周辺部に断面が台形状の凹部を形成し、該凹部内にその壁面を押圧するように断面が上記凹部と同一形状で、環状の保護部材を配置したことを特徴とするウェハ支持部材。
- 上記載置面と平行な投影面からみて上記環状の保護部材の外形辺が上記静電チャック部の外形辺と同一であるかあるいは内側にあることを特徴とする請求項1に記載のウェハ支持部材。
- 上記環状の保護部材の開放厚みは、上記凹部の幅の1.02〜2.0倍であることを特徴とする請求項1または2に記載のウェハ支持部材。
- 上記環状の保護部材がフッ素系樹脂またはテフロン(登録商標)系樹脂の少なくとも一種を主成分とすることを特徴とする請求項1〜3のいずれかに記載のウェハ支持部材。
- 上記静電チャック部と上記ベース部との間に、抵抗発熱体を内蔵した発熱部を2つの接着層を介して接続したことを特徴とする請求項1〜4のいずれかに記載のウェハ支持部材。
- 上記抵抗発熱体と上記2つの接着層との周辺の端面が上記凹部の底面の一部であることを特徴とする請求項5に記載のウェハ支持部材。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004264508A JP4458995B2 (ja) | 2004-09-10 | 2004-09-10 | ウェハ支持部材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004264508A JP4458995B2 (ja) | 2004-09-10 | 2004-09-10 | ウェハ支持部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006080389A JP2006080389A (ja) | 2006-03-23 |
JP4458995B2 true JP4458995B2 (ja) | 2010-04-28 |
Family
ID=36159582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004264508A Expired - Lifetime JP4458995B2 (ja) | 2004-09-10 | 2004-09-10 | ウェハ支持部材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4458995B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112530854A (zh) * | 2021-02-18 | 2021-03-19 | 北京中硅泰克精密技术有限公司 | 半导体承载装置及半导体设备 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG188141A1 (en) * | 2008-02-08 | 2013-03-28 | Lam Res Corp | A protective coating for a plasma processing chamber part and a method of use |
JP5250408B2 (ja) | 2008-12-24 | 2013-07-31 | 新光電気工業株式会社 | 基板温調固定装置 |
US9428715B2 (en) | 2011-11-07 | 2016-08-30 | The Nisshin Oillio Group, Ltd. | Composition for cleansing agent and cleansing agent |
US8677586B2 (en) * | 2012-04-04 | 2014-03-25 | Lam Research Corporation | Installation fixture for elastomer bands and methods of using the same |
KR20150013627A (ko) * | 2012-04-26 | 2015-02-05 | 어플라이드 머티어리얼스, 인코포레이티드 | Esc 본딩 접착제 부식을 방지하기 위한 방법들 및 장치 |
JP6140457B2 (ja) * | 2013-01-21 | 2017-05-31 | 東京エレクトロン株式会社 | 接着方法、載置台及び基板処理装置 |
TWI613753B (zh) * | 2015-02-16 | 2018-02-01 | 靜電吸附承盤側壁之改良密封件 | |
US20170047238A1 (en) * | 2015-08-10 | 2017-02-16 | Lam Research Corporation | Annular edge seal with convex inner surface for electrostatic chuck |
JP6715388B2 (ja) * | 2017-03-29 | 2020-07-01 | 京セラ株式会社 | 試料保持具 |
CN107195578B (zh) * | 2017-07-17 | 2019-11-29 | 北京北方华创微电子装备有限公司 | 静电卡盘 |
JP6700362B2 (ja) * | 2018-09-28 | 2020-05-27 | 日本特殊陶業株式会社 | 半導体製造用部品 |
JP7445386B2 (ja) * | 2019-02-19 | 2024-03-07 | 日本特殊陶業株式会社 | 基板保持部材および基板保持機構 |
JP7488796B2 (ja) | 2021-06-10 | 2024-05-22 | 日本碍子株式会社 | フォーカスリング載置台 |
JP7488795B2 (ja) * | 2021-06-10 | 2024-05-22 | 日本碍子株式会社 | 半導体製造装置用部材 |
-
2004
- 2004-09-10 JP JP2004264508A patent/JP4458995B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112530854A (zh) * | 2021-02-18 | 2021-03-19 | 北京中硅泰克精密技术有限公司 | 半导体承载装置及半导体设备 |
CN112530854B (zh) * | 2021-02-18 | 2022-01-04 | 北京中硅泰克精密技术有限公司 | 半导体承载装置及半导体设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2006080389A (ja) | 2006-03-23 |
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