KR20130044132A - 은피복 구리분 - Google Patents

은피복 구리분 Download PDF

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Publication number
KR20130044132A
KR20130044132A KR1020120024483A KR20120024483A KR20130044132A KR 20130044132 A KR20130044132 A KR 20130044132A KR 1020120024483 A KR1020120024483 A KR 1020120024483A KR 20120024483 A KR20120024483 A KR 20120024483A KR 20130044132 A KR20130044132 A KR 20130044132A
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KR
South Korea
Prior art keywords
silver
copper powder
coated copper
coated
particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020120024483A
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English (en)
Korean (ko)
Inventor
다쿠 후지모토
마사히로 미와
야스나리 와키모리
도미오 하야시
Original Assignee
미쓰이 긴조꾸 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 미쓰이 긴조꾸 고교 가부시키가이샤 filed Critical 미쓰이 긴조꾸 고교 가부시키가이샤
Publication of KR20130044132A publication Critical patent/KR20130044132A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Conductive Materials (AREA)
KR1020120024483A 2011-10-21 2012-03-09 은피복 구리분 Ceased KR20130044132A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011232196 2011-10-21
JPJP-P-2011-232196 2011-10-21

Publications (1)

Publication Number Publication Date
KR20130044132A true KR20130044132A (ko) 2013-05-02

Family

ID=48099409

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120024483A Ceased KR20130044132A (ko) 2011-10-21 2012-03-09 은피복 구리분

Country Status (4)

Country Link
JP (2) JP5631910B2 (https=)
KR (1) KR20130044132A (https=)
CN (1) CN103056356B (https=)
TW (1) TWI570196B (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106604794A (zh) * 2014-09-12 2017-04-26 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
KR101940772B1 (ko) 2018-07-13 2019-01-21 서재원 식판 자동 투입장치
US10654101B2 (en) 2015-05-15 2020-05-19 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder
US10695830B2 (en) 2015-05-15 2020-06-30 Sumitomo Metal Mining Co., Ltd. Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5503813B1 (ja) * 2012-08-02 2014-05-28 三井金属鉱業株式会社 導電性フィルム
JP6278969B2 (ja) * 2013-10-24 2018-02-14 三井金属鉱業株式会社 銀被覆銅粉
WO2015115139A1 (ja) * 2014-01-29 2015-08-06 三井金属鉱業株式会社 銅粉
KR101483905B1 (ko) * 2014-04-04 2015-01-16 한동철 수분경화형 실리콘을 이용한 ｅｍｉ 차폐용 디스펜싱 가스켓에 적용 가능한 은코팅구리분말의 제조 방법
JP2015214742A (ja) * 2014-05-13 2015-12-03 有限会社 ナプラ 多結晶金属粒子、及び、導電性ペースト
JP6001796B2 (ja) * 2014-06-16 2016-10-05 三井金属鉱業株式会社 銅粉、その製造方法、及びそれを含む導電性組成物
JP6432174B2 (ja) * 2014-06-18 2018-12-05 セメダイン株式会社 導電性接着剤
JP5858201B1 (ja) * 2014-06-25 2016-02-10 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート
WO2016006285A1 (ja) * 2014-07-07 2016-01-14 住友金属鉱山株式会社 銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート、帯電防止塗料
EP3187279A4 (en) * 2014-08-26 2018-04-18 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet each of which uses same
CN107427912A (zh) * 2015-03-26 2017-12-01 住友金属矿山株式会社 覆银铜粉及使用该覆银铜粉的导电性膏、导电性涂料、导电性片
US20180051176A1 (en) * 2015-03-26 2018-02-22 Sumitomo Metal Mining Co., Ltd. Copper powder and copper paste, conductive coating material, and conductive sheet using same
TWI553661B (zh) * 2015-03-27 2016-10-11 Sumitomo Metal Mining Co Silver powder and its use of conductive paste, conductive paint, conductive film
JP6056901B2 (ja) * 2015-04-30 2017-01-11 住友金属鉱山株式会社 樹枝状銀コート銅粉の製造方法、及びその樹枝状銀コート銅粉を用いた銅ペースト、導電性塗料、導電性シート
JP6165399B1 (ja) 2015-08-31 2017-07-19 三井金属鉱業株式会社 銀被覆銅粉
KR20210154865A (ko) * 2016-03-15 2021-12-21 세키스이가가쿠 고교가부시키가이샤 금속 함유 입자, 접속 재료, 접속 구조체 및 접속 구조체의 제조 방법
CN121086680A (zh) 2017-02-17 2025-12-09 株式会社力森诺科 粘接剂膜
CN109598039B (zh) * 2018-11-21 2022-07-08 中国电建集团成都勘测设计研究院有限公司 对称三岔形梁式岔管及其设计方法
WO2023074580A1 (ja) * 2021-10-25 2023-05-04 トッパン・フォームズ株式会社 焼結材、金属焼結体、焼結材の製造方法、接合体の製造方法、及び接合体
CN117620193B (zh) * 2023-10-18 2024-11-05 广东聚砺新材料有限责任公司 一种银粉的制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60226570A (ja) * 1984-04-25 1985-11-11 Fukuda Kinzoku Hakufun Kogyo Kk 導電塗料用銅粉およびその製造方法
JPS6381706A (ja) * 1986-09-26 1988-04-12 三井金属鉱業株式会社 銅系厚膜用組成物
JPS63286477A (ja) * 1987-05-19 1988-11-24 Mitsui Mining & Smelting Co Ltd 導電性塗料
JPH01119602A (ja) * 1987-11-02 1989-05-11 Mitsui Mining & Smelting Co Ltd 銀被覆銅粉の製造法
JP2706110B2 (ja) * 1988-11-18 1998-01-28 福田金属箔粉工業株式会社 銅微粉末の製造方法
US4944797A (en) * 1989-01-03 1990-07-31 Gte Products Corporation Low oxygen content fine spherical copper particles and process for producing same by fluid energy milling and high temperature processing
JPH10147801A (ja) * 1996-11-20 1998-06-02 Tokuyama Corp 樹枝状銅粉の表面処理法
US6036839A (en) * 1998-02-04 2000-03-14 Electrocopper Products Limited Low density high surface area copper powder and electrodeposition process for making same
JP4163278B2 (ja) * 1998-02-26 2008-10-08 福田金属箔粉工業株式会社 導電塗料用片状銅粉の製造方法
CN1206064C (zh) * 2002-10-10 2005-06-15 武汉大学 一种镀银铜粉的制备方法
JP4149364B2 (ja) * 2003-11-18 2008-09-10 三井金属鉱業株式会社 デンドライト状微粒銀粉及びその製造方法
JP5181434B2 (ja) * 2006-07-10 2013-04-10 住友金属鉱山株式会社 微小銅粉及びその製造方法
JP2008122030A (ja) * 2006-11-15 2008-05-29 Mitsui Mining & Smelting Co Ltd ヒートパイプ構成原料
CN101214547A (zh) * 2008-01-07 2008-07-09 李伟强 一种含有纳米级别表面结构的微米银-铜颗粒及其制备方法和用途
CN101514486B (zh) * 2009-02-27 2011-09-21 华东师范大学 一种Cu树枝状单晶纳米材料及其制备方法
CN102211186B (zh) * 2011-06-08 2013-10-16 北京工业大学 一种树枝状铜粉表面镀银的方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106604794A (zh) * 2014-09-12 2017-04-26 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
US10654101B2 (en) 2015-05-15 2020-05-19 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder
US10695830B2 (en) 2015-05-15 2020-06-30 Sumitomo Metal Mining Co., Ltd. Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder
KR101940772B1 (ko) 2018-07-13 2019-01-21 서재원 식판 자동 투입장치

Also Published As

Publication number Publication date
JP5631910B2 (ja) 2014-11-26
TW201317311A (zh) 2013-05-01
CN103056356A (zh) 2013-04-24
JP2014220244A (ja) 2014-11-20
TWI570196B (zh) 2017-02-11
JP2013100592A (ja) 2013-05-23
CN103056356B (zh) 2016-08-10

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