KR20110086832A - 임프린트 공정의 분리 단계 동안의 변형 및 동력학 제어 - Google Patents

임프린트 공정의 분리 단계 동안의 변형 및 동력학 제어 Download PDF

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Publication number
KR20110086832A
KR20110086832A KR1020117011723A KR20117011723A KR20110086832A KR 20110086832 A KR20110086832 A KR 20110086832A KR 1020117011723 A KR1020117011723 A KR 1020117011723A KR 20117011723 A KR20117011723 A KR 20117011723A KR 20110086832 A KR20110086832 A KR 20110086832A
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South Korea
Prior art keywords
template
substrate
separation
solidified layer
layer
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KR1020117011723A
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Korean (ko)
Inventor
니야즈 크후스나트디노브
프랭크 와이. 수
마리오 요하네스 메이슬
마이클 엔. 밀러
에크론 톰슨
제라드 슈미드
파완 케이. 님마카얄라
샤오밍 루
병진 최
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몰레큘러 임프린츠 인코퍼레이티드
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Publication of KR20110086832A publication Critical patent/KR20110086832A/ko
Ceased legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003Discharging moulded articles from the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020117011723A 2008-10-24 2009-10-26 임프린트 공정의 분리 단계 동안의 변형 및 동력학 제어 Ceased KR20110086832A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US10813108P 2008-10-24 2008-10-24
US61/108,131 2008-10-24
US10955708P 2008-10-30 2008-10-30
US61/109,557 2008-10-30
US12/604,517 2009-10-23
US12/604,517 US8652393B2 (en) 2008-10-24 2009-10-23 Strain and kinetics control during separation phase of imprint process

Publications (1)

Publication Number Publication Date
KR20110086832A true KR20110086832A (ko) 2011-08-01

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KR1020117011723A Ceased KR20110086832A (ko) 2008-10-24 2009-10-26 임프린트 공정의 분리 단계 동안의 변형 및 동력학 제어

Country Status (8)

Country Link
US (3) US8652393B2 (enExample)
EP (1) EP2350741B1 (enExample)
JP (2) JP2012507141A (enExample)
KR (1) KR20110086832A (enExample)
CN (1) CN102203671B (enExample)
MY (1) MY152446A (enExample)
TW (2) TWI405659B (enExample)
WO (1) WO2010047837A2 (enExample)

Cited By (1)

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KR20220031078A (ko) * 2019-08-15 2022-03-11 캐논 가부시끼가이샤 평탄화 공정, 장치, 및 물품 제조 방법

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CN103529644A (zh) * 2013-10-25 2014-01-22 无锡英普林纳米科技有限公司 一种纳米压印机
CN106462054B (zh) * 2014-03-31 2020-07-07 皇家飞利浦有限公司 压印方法、用于压印方法的计算机程序产品和装置
JP6472189B2 (ja) * 2014-08-14 2019-02-20 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6774178B2 (ja) * 2015-11-16 2020-10-21 キヤノン株式会社 基板を処理する装置、及び物品の製造方法
JP6335948B2 (ja) * 2016-02-12 2018-05-30 キヤノン株式会社 インプリント装置および物品製造方法
TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
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JP7284639B2 (ja) * 2019-06-07 2023-05-31 キヤノン株式会社 成形装置、および物品製造方法
TWI888630B (zh) * 2020-09-01 2025-07-01 美商伊路米納有限公司 夾具及相關系統及方法

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Publication number Priority date Publication date Assignee Title
KR20220031078A (ko) * 2019-08-15 2022-03-11 캐논 가부시끼가이샤 평탄화 공정, 장치, 및 물품 제조 방법

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US20100102469A1 (en) 2010-04-29
JP2014160844A (ja) 2014-09-04
CN102203671B (zh) 2013-07-17
US8652393B2 (en) 2014-02-18
US20190232533A1 (en) 2019-08-01
TWI541125B (zh) 2016-07-11
JP5728602B2 (ja) 2015-06-03
EP2350741B1 (en) 2012-08-29
WO2010047837A3 (en) 2010-10-07
US20140117574A1 (en) 2014-05-01
JP2012507141A (ja) 2012-03-22
CN102203671A (zh) 2011-09-28
WO2010047837A2 (en) 2010-04-29
TWI405659B (zh) 2013-08-21
TW201345698A (zh) 2013-11-16
MY152446A (en) 2014-09-30
EP2350741A2 (en) 2011-08-03
TW201026482A (en) 2010-07-16
US11161280B2 (en) 2021-11-02

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