CN102203671B - 压印工艺的分离阶段中的应变和动力学控制 - Google Patents

压印工艺的分离阶段中的应变和动力学控制 Download PDF

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Publication number
CN102203671B
CN102203671B CN2009801426456A CN200980142645A CN102203671B CN 102203671 B CN102203671 B CN 102203671B CN 2009801426456 A CN2009801426456 A CN 2009801426456A CN 200980142645 A CN200980142645 A CN 200980142645A CN 102203671 B CN102203671 B CN 102203671B
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China
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template
substrate
pattern
layer
separation
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Chinese (zh)
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CN102203671A (zh
Inventor
N·胡斯努季诺夫
F·Y·徐
M·J·美斯尔
M·N·米勒
E·汤普森
G·施米德
P·K·尼玛卡雅拉
吕晓明
崔炳镇
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Canon Nanotechnologies Inc
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Molecular Imprints Inc
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003Discharging moulded articles from the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2009801426456A 2008-10-24 2009-10-26 压印工艺的分离阶段中的应变和动力学控制 Active CN102203671B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US10813108P 2008-10-24 2008-10-24
US61/108,131 2008-10-24
US10955708P 2008-10-30 2008-10-30
US61/109,557 2008-10-30
US12/604,517 2009-10-23
US12/604,517 US8652393B2 (en) 2008-10-24 2009-10-23 Strain and kinetics control during separation phase of imprint process
PCT/US2009/005803 WO2010047837A2 (en) 2008-10-24 2009-10-26 Strain and kinetics control during separation phase of imprint process

Publications (2)

Publication Number Publication Date
CN102203671A CN102203671A (zh) 2011-09-28
CN102203671B true CN102203671B (zh) 2013-07-17

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Country Link
US (3) US8652393B2 (enExample)
EP (1) EP2350741B1 (enExample)
JP (2) JP2012507141A (enExample)
KR (1) KR20110086832A (enExample)
CN (1) CN102203671B (enExample)
MY (1) MY152446A (enExample)
TW (2) TWI405659B (enExample)
WO (1) WO2010047837A2 (enExample)

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JP4940262B2 (ja) * 2009-03-25 2012-05-30 株式会社東芝 インプリントパターン形成方法
JP5499668B2 (ja) * 2009-12-03 2014-05-21 大日本印刷株式会社 インプリント用モールドおよび該モールドを用いたパターン形成方法
JP5833636B2 (ja) * 2010-04-27 2015-12-16 モレキュラー・インプリンツ・インコーポレーテッド ナノインプリント・リソグラフィのテンプレート製作方法およびそのシステム
JP5750992B2 (ja) * 2011-04-27 2015-07-22 大日本印刷株式会社 インプリント方法およびそれを実施するためのインプリント装置
JP5875250B2 (ja) * 2011-04-28 2016-03-02 キヤノン株式会社 インプリント装置、インプリント方法及びデバイス製造方法
JP5747670B2 (ja) * 2011-06-10 2015-07-15 大日本印刷株式会社 成形部材およびその製造方法
JP6004738B2 (ja) * 2011-09-07 2016-10-12 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP5535162B2 (ja) * 2011-09-21 2014-07-02 株式会社東芝 パターン形成装置、パターン形成方法及びパターン形成用プログラム
JP2013069920A (ja) * 2011-09-22 2013-04-18 Toshiba Corp 成膜方法およびパターン形成方法
JP6140966B2 (ja) * 2011-10-14 2017-06-07 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP2014033050A (ja) * 2012-08-02 2014-02-20 Toshiba Corp インプリントシステム及びインプリント方法
US20140239529A1 (en) * 2012-09-28 2014-08-28 Nanonex Corporation System and Methods For Nano-Scale Manufacturing
JP6060796B2 (ja) * 2013-04-22 2017-01-18 大日本印刷株式会社 インプリントモールド及びダミーパターン設計方法
CN103529644A (zh) * 2013-10-25 2014-01-22 无锡英普林纳米科技有限公司 一种纳米压印机
CN106462054B (zh) * 2014-03-31 2020-07-07 皇家飞利浦有限公司 压印方法、用于压印方法的计算机程序产品和装置
JP6472189B2 (ja) * 2014-08-14 2019-02-20 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6774178B2 (ja) * 2015-11-16 2020-10-21 キヤノン株式会社 基板を処理する装置、及び物品の製造方法
JP6335948B2 (ja) * 2016-02-12 2018-05-30 キヤノン株式会社 インプリント装置および物品製造方法
TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
US10627715B2 (en) * 2016-10-31 2020-04-21 Canon Kabushiki Kaisha Method for separating a nanoimprint template from a substrate
JP6762853B2 (ja) 2016-11-11 2020-09-30 キヤノン株式会社 装置、方法、及び物品製造方法
US11442359B2 (en) 2019-03-11 2022-09-13 Canon Kabushiki Kaisha Method of separating a template from a shaped film on a substrate
JP7284639B2 (ja) * 2019-06-07 2023-05-31 キヤノン株式会社 成形装置、および物品製造方法
US11034057B2 (en) * 2019-08-15 2021-06-15 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article
TWI888630B (zh) * 2020-09-01 2025-07-01 美商伊路米納有限公司 夾具及相關系統及方法

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US20100102469A1 (en) 2010-04-29
JP2014160844A (ja) 2014-09-04
US8652393B2 (en) 2014-02-18
US20190232533A1 (en) 2019-08-01
KR20110086832A (ko) 2011-08-01
TWI541125B (zh) 2016-07-11
JP5728602B2 (ja) 2015-06-03
EP2350741B1 (en) 2012-08-29
WO2010047837A3 (en) 2010-10-07
US20140117574A1 (en) 2014-05-01
JP2012507141A (ja) 2012-03-22
CN102203671A (zh) 2011-09-28
WO2010047837A2 (en) 2010-04-29
TWI405659B (zh) 2013-08-21
TW201345698A (zh) 2013-11-16
MY152446A (en) 2014-09-30
EP2350741A2 (en) 2011-08-03
TW201026482A (en) 2010-07-16
US11161280B2 (en) 2021-11-02

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