EP2007566A4 - Chucking system comprising an array of fluid chambers - Google Patents
Chucking system comprising an array of fluid chambersInfo
- Publication number
- EP2007566A4 EP2007566A4 EP07754062A EP07754062A EP2007566A4 EP 2007566 A4 EP2007566 A4 EP 2007566A4 EP 07754062 A EP07754062 A EP 07754062A EP 07754062 A EP07754062 A EP 07754062A EP 2007566 A4 EP2007566 A4 EP 2007566A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- array
- fluid chambers
- chucking system
- chucking
- chambers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78877706P | 2006-04-03 | 2006-04-03 | |
PCT/US2007/007487 WO2007126767A2 (en) | 2006-04-03 | 2007-03-26 | Chucking system comprising an array of fluid chambers |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2007566A2 EP2007566A2 (en) | 2008-12-31 |
EP2007566A4 true EP2007566A4 (en) | 2010-10-13 |
Family
ID=38656006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07754062A Withdrawn EP2007566A4 (en) | 2006-04-03 | 2007-03-26 | Chucking system comprising an array of fluid chambers |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2007566A4 (en) |
JP (2) | JP4667524B2 (en) |
KR (1) | KR20090004910A (en) |
CN (1) | CN101415535A (en) |
TW (1) | TWI352874B (en) |
WO (1) | WO2007126767A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4854383B2 (en) * | 2006-05-15 | 2012-01-18 | アピックヤマダ株式会社 | Imprint method and nano-imprint apparatus |
US8215946B2 (en) * | 2006-05-18 | 2012-07-10 | Molecular Imprints, Inc. | Imprint lithography system and method |
US8652393B2 (en) * | 2008-10-24 | 2014-02-18 | Molecular Imprints, Inc. | Strain and kinetics control during separation phase of imprint process |
US8309008B2 (en) * | 2008-10-30 | 2012-11-13 | Molecular Imprints, Inc. | Separation in an imprint lithography process |
US8913230B2 (en) * | 2009-07-02 | 2014-12-16 | Canon Nanotechnologies, Inc. | Chucking system with recessed support feature |
JP5875250B2 (en) * | 2011-04-28 | 2016-03-02 | キヤノン株式会社 | Imprint apparatus, imprint method, and device manufacturing method |
JP5893303B2 (en) * | 2011-09-07 | 2016-03-23 | キヤノン株式会社 | Imprint apparatus and article manufacturing method using the same |
CN105792998A (en) * | 2013-12-03 | 2016-07-20 | 哈莫技术股份有限公司 | Holding device, holding system, control method, and conveyance device |
JP6333031B2 (en) * | 2014-04-09 | 2018-05-30 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
US10620532B2 (en) | 2014-11-11 | 2020-04-14 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, mold, and article manufacturing method |
JP6647027B2 (en) | 2015-12-03 | 2020-02-14 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
JP6940944B2 (en) * | 2016-12-06 | 2021-09-29 | キヤノン株式会社 | Imprint device and article manufacturing method |
JP7132739B2 (en) | 2018-04-06 | 2022-09-07 | キヤノン株式会社 | Imprinting apparatus, imprinting method and article manufacturing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5534073A (en) * | 1992-09-07 | 1996-07-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor producing apparatus comprising wafer vacuum chucking device |
JP2000195927A (en) * | 1998-12-28 | 2000-07-14 | Sony Corp | Vacuum chuck device |
WO2004044651A1 (en) * | 2002-11-13 | 2004-05-27 | Molecular Imprints, Inc. | A chucking system and method for modulating shapes of substrates |
US6809802B1 (en) * | 1999-08-19 | 2004-10-26 | Canon Kabushiki Kaisha | Substrate attracting and holding system for use in exposure apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001127145A (en) * | 1999-08-19 | 2001-05-11 | Canon Inc | Method and device for holding substrate with suction and exposing device and device manufacturing method using the device |
JP2001127144A (en) * | 1999-08-19 | 2001-05-11 | Canon Inc | Method and device for holding substrate with suction and exposing device and device manufacturing method using the device |
-
2007
- 2007-03-26 CN CNA2007800120092A patent/CN101415535A/en active Pending
- 2007-03-26 WO PCT/US2007/007487 patent/WO2007126767A2/en active Application Filing
- 2007-03-26 JP JP2009504203A patent/JP4667524B2/en active Active
- 2007-03-26 KR KR1020087024314A patent/KR20090004910A/en not_active Application Discontinuation
- 2007-03-26 EP EP07754062A patent/EP2007566A4/en not_active Withdrawn
- 2007-03-29 TW TW96111034A patent/TWI352874B/en not_active IP Right Cessation
-
2010
- 2010-11-05 JP JP2010248309A patent/JP2011077529A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5534073A (en) * | 1992-09-07 | 1996-07-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor producing apparatus comprising wafer vacuum chucking device |
JP2000195927A (en) * | 1998-12-28 | 2000-07-14 | Sony Corp | Vacuum chuck device |
US6809802B1 (en) * | 1999-08-19 | 2004-10-26 | Canon Kabushiki Kaisha | Substrate attracting and holding system for use in exposure apparatus |
WO2004044651A1 (en) * | 2002-11-13 | 2004-05-27 | Molecular Imprints, Inc. | A chucking system and method for modulating shapes of substrates |
Non-Patent Citations (1)
Title |
---|
See also references of WO2007126767A2 * |
Also Published As
Publication number | Publication date |
---|---|
WO2007126767A2 (en) | 2007-11-08 |
TWI352874B (en) | 2011-11-21 |
JP4667524B2 (en) | 2011-04-13 |
JP2011077529A (en) | 2011-04-14 |
WO2007126767A3 (en) | 2008-07-31 |
KR20090004910A (en) | 2009-01-12 |
CN101415535A (en) | 2009-04-22 |
EP2007566A2 (en) | 2008-12-31 |
JP2009532899A (en) | 2009-09-10 |
TW200813619A (en) | 2008-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20081103 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK RS |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: SHACKLETON, STEVEN, C. Inventor name: LAD, PANKAJ, B. Inventor name: CHOI, BYUNG-JIN Inventor name: CHERALA, ANSHUMAN |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20100914 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/683 20060101AFI20100908BHEP |
|
17Q | First examination report despatched |
Effective date: 20101111 |
|
DAX | Request for extension of the european patent (deleted) | ||
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/67 20060101ALI20120716BHEP Ipc: G03F 7/00 20060101ALI20120716BHEP Ipc: B82Y 10/00 20110101ALI20120716BHEP Ipc: H01L 21/683 20060101AFI20120716BHEP |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20121001 |