JP2001127144A - Method and device for holding substrate with suction and exposing device and device manufacturing method using the device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for holding a substrate with suction by which the influence of the coordinate error, shape error, etc., of a working pattern caused by the surface deformation of a substrate which occurs when the substrate is hold by suction on the working accuracy of the substrate can be reduced by improving the reproducibility of the error, and, in addition, the influence of the surface deformation of the substrate which occurs when the substrate is held at every shot. SOLUTION: On a chuck 1 which holds a substrate 100 with suction, projecting sections 2a for supporting the working areas of a substrate 100 placed on a placing base that supports the substrate 100 are arranged along, for example, the boundary lines 101 of the working areas of the substrate 100, so that a specific positional relation may be established and the sections 2a may support the working areas of the substrate 100 by the sane arrangement. Consequently, the surface deformation of the substrate 100 which occurs when the substrate 100 is held by suction can be put in order at every working area and the correction of the coordinate error, shape error, etc., of a pattern caused by the surface deformation of the substrate can be made easier by improving the reproducibility of the error between the working areas.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus for manufacturing a semiconductor device, a liquid crystal substrate manufacturing apparatus for manufacturing a liquid crystal element, a magnetic head manufacturing apparatus, a substrate suction holding method used for manufacturing a micromachine, and the like, and a substrate suction holding method. More particularly, the present invention relates to an exposure apparatus and a device manufacturing method using such a substrate holding apparatus.

[0002]

2. Description of the Related Art In an apparatus for processing a substrate such as a semiconductor wafer for manufacturing a semiconductor device or a liquid crystal substrate for manufacturing a liquid crystal display element, for example, a projection exposure apparatus, etc., a substrate to be processed is generally held. In order to fix and correct the warpage of the substrate to maintain the flatness, a substrate suction holding device using a vacuum suction force is used. Such a conventional substrate suction and hold device is configured as shown in FIG. 21. In the substrate suction and hold device (chuck) 201, a mounting surface for mounting a substrate has a plurality of grids. A pin contact type convex portion 202 arranged and an edge bank convex portion 203 provided on the peripheral portion of the mounting surface for supporting the peripheral portion of the substrate.
And a mounting surface on which the pin contact type convex portion 202 is arranged, wherein a suction hole 205 communicating with a vacuum piping system for reducing pressure between the substrate to be mounted and the mounting surface is provided. It is provided in.

[0003] The substrate suction holding apparatus constructed as described above is used, for example, in a semiconductor exposure apparatus. A wafer as a substrate is conveyed onto a chuck 201 by a transfer system. Hole 205
Is held and fixed on the chuck 201 by vacuum suction through the. At this time, in order to reduce the probability of occurrence of deformation of the wafer surface due to the foreign matter being interposed between the mounting table of the chuck and the wafer, the entire area of the projections of the substrate support scattered on the mounting surface is reduced. ing.

[0004]

In the above-described conventional substrate suction and holding apparatus, the arrangement of the projections for supporting the substrate serving as the mounting table on the mounting surface of the chuck is determined with respect to the processing area of the substrate. It is not taken into consideration, and is provided without any positional relationship with the processing area of the substrate, so the same chuck is always used even if the processing area of the substrate changes, When the substrate surface is deformed, this deformation is processed in a single processing area (hereinafter referred to as a shot).
And may change for each semiconductor element (hereinafter, referred to as a die). The deformation of the substrate surface due to the holding of the substrate by suction causes defocus in the exposure apparatus, causing a pattern shape error, and this deformation also distorts the substrate in that portion also in the direction of the substrate plane, and is transferred. This is also a factor that promotes a coordinate error of an image to be exposed. And
Since such a deformation of the substrate surface is different for each shot, die, or scanning exposure slit in the case of scanning exposure, there is a problem that there is no effective correction method.

In a lithography process for exposing and transferring a fine pattern on a substrate in a semiconductor manufacturing process, a lithographic process is carried on a chuck in consideration of a depth of focus and a coordinate error of a transfer pattern which are reduced with the miniaturization. It is necessary to make the flatness of the substrate as small as possible. If the deformation of the substrate surface is large, the coordinate error of the transfer pattern becomes large as a result, and if it is different for each shot,
In a semiconductor manufactured by superimposing various patterns, the superposition of the patterns deteriorates, and if there is a large difference between shots, there is no method for easily correcting the difference, and in the worst case, the semiconductor element is defective.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and has been made in consideration of the above problems, and has been made in consideration of a coordinate error or a shape error of a processing pattern caused by deformation of a substrate surface caused by suction holding of the substrate. A substrate suction holding method, a substrate suction holding device, which can improve the reproducibility of errors and the like, improve the influence on the processing accuracy of the substrate, and further reduce the influence of the deformation of the substrate surface caused by holding the substrate for each shot; It is another object of the present invention to provide an exposure apparatus and a device manufacturing method using the substrate suction holding device.

[0007]

To achieve the above object, a method for holding a substrate by suction according to the present invention comprises a mounting table having a convex portion for supporting a substrate, the substrate being held and held by the convex portion. In the method, the protrusions are arranged so as to have a specific positional relationship according to the shape of a region to be processed on the substrate, and the substrate is suction-held.

In the substrate holding method according to the present invention, the substrate has a plurality of processing regions, and the projections are formed so as to have the same arrangement in each of the processing regions on the substrate. Is preferred.

In the substrate suction and holding method according to the present invention, it is preferable that the convex portion is at least one of an edge bank type convex portion and a pin contact type convex portion.

Further, the substrate suction holding apparatus of the present invention includes a mounting table having a convex portion for supporting the substrate, and the substrate suction holding device for suction holding the substrate by the convex portion. Are arranged so as to have a specific positional relationship in accordance with the shape of the region to which is applied.

In the substrate holding apparatus according to the present invention, the substrate has a plurality of processing regions, and the projections are formed so as to have the same arrangement with respect to each of the processing regions on the substrate. It is preferable that the projection is at least one of an edge bank type projection and a pin contact type projection.

In the substrate suction and holding apparatus according to the present invention, it is preferable that the protrusions are arranged along a boundary line that divides a processing region of the substrate. Within, it is preferable that they are arranged symmetrically.

In the substrate suction and holding apparatus of the present invention, a vacuum suction means and / or a substrate for sucking and holding the substrate on the mounting table by reducing the pressure between the mounting table and the substrate mounted on the mounting table. It is preferable that the apparatus further comprises pressure adjusting means capable of adjusting the pressure in the space between the mounting table and the substrate in each processing area, and the pressure adjusting means has a substrate attraction force in each processing area of the substrate. Is preferably configured to be the same over the entire substrate.

Further, the substrate suction holding apparatus of the present invention includes a mounting table having a convex portion for supporting the substrate, and the substrate suction holding device for suction holding the substrate by the convex portion. The period Fx (m ^-1 ) in the X direction of the array of the convex portions supporting the region to be subjected to the processing and the period Fy (m ^-1 ) in the Y direction are the X of the array of the region to be processed in the substrate.
Cycle in the direction Cx (m ^-1 ) and cycle in the Y direction Cy
(M ⁻¹ ), Fx = m · Cx Fy = n · Cy (where m and n are arbitrary natural numbers (1, 2, 3,...))
It is. The projections are arranged so as to have the relationship of (1).

It is preferable that the substrate suction holding apparatus of the present invention includes a mechanism capable of adjusting the position of the substrate and the projection of the mounting table so that the two have a specific positional relationship.

Further, an exposure apparatus according to the present invention is provided with the above-mentioned substrate suction holding device, and exposure means for exposing and transferring a pattern of an original onto a substrate sucked and held by the substrate suction holding device. And

In the exposure apparatus according to the present invention, the coordinate error of the transfer pattern and the shape error of the pattern caused by the deformation of the processing surface of the substrate caused by the suction holding of the substrate can be corrected by the original plate. It is preferable to include a drive adjusting unit for bending the original according to a coordinate error of a transfer pattern and a pattern shape error generated by deformation of a processing surface of a substrate caused by suction holding.

In the exposure apparatus according to the present invention, the original plate is deflected by the defocus caused by the difference between the deformation of the processing surface of the substrate caused by the suction holding of the substrate and the shape of the projection image plane of the projection optical system. Can be corrected with
The projection optical system can correct the defocus caused by the difference between the deformation of the processing surface of the substrate due to the suction holding of the substrate, the shape of the projected image plane of the projection optical system, the holding deformation of the original plate, and the shape of its own weight deformation. I do.

In the exposure apparatus according to the present invention, it is possible to control the deformation of the processing surface of the substrate caused by the suction and holding of the substrate in accordance with the shape of the projection image plane of the projection optical system and the shape of the original holding or deforming its own weight. enable.

Further, a device manufacturing method according to the present invention is characterized in that a device is manufactured by a manufacturing process including a process of exposing a substrate using the above-described exposure apparatus.

[0021]

According to the present invention, the projections supporting the substrate of the mounting table in the substrate suction holding device (chuck) are arranged so as to have a specific positional relationship according to the shape of the region (shot) where the substrate is processed. Then, for example, by arranging the protrusions of the chuck along the scribe lines of the shots of the substrate, and by making the same for every shot, it becomes possible to uniform the deformation of the substrate surface for each shot In addition, it is possible to improve the reproducibility between pattern coordinate errors and shape errors or defocus shots caused by this deformation, and it becomes possible to correct these adverse factors. Further, it becomes easy to correct the adverse effects of lens distortion and field curvature on a shot or die basis.

Also, the occurrence of pattern shape errors can be corrected by aligning the pattern coordinate error and the exposure image surface of the exposure apparatus with the substrate surface, and the occurrence of defects such as semiconductor elements due to the shape of the substrate surface can be reduced. Can be eliminated.

[0023]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a view best showing the features of the substrate suction and holding method of the present invention. FIG. 1A shows one embodiment of a substrate suction and holding apparatus constructed based on the substrate suction and holding method of the present invention. FIG. 4B is a plan view showing an example, and FIG. 4B is a plan view of the substrate showing an example of an arrangement of shots or dies on the substrate.

In FIGS. 1A and 1B, 1
Denotes a chuck as a substrate suction holding device installed on a chuck stage such as a semiconductor exposure apparatus;
Reference numeral denotes a substrate such as a wafer sucked and held by the chuck 1. Reference numeral 101 denotes a shot of the substrate 100 or a boundary line of a die (hereinafter, referred to as a scribe line). 2a is
An edge bank-type projection as a projection supporting a substrate constituting a mounting table for mounting the substrate 100, the top surface of the edge bank projection is finished to a high degree of flatness, and at the center of the width thereof. Is provided with a vacuum suction groove.
In this embodiment, the scribe line 101 is arranged along the scribe line 101 of the shot of the substrate 100. Reference numeral 3 denotes an annular convex portion provided on the outer peripheral portion of the chuck 1 for supporting the substrate, which is constituted by an edge bank convex portion and a vacuum suction groove, and 4 is an annular convex portion 3 and a convex portion 2a. The region 4 is a region where a convex portion for supporting a substrate and a vacuum suction groove can be provided as necessary.
Reference numeral 5 denotes a suction hole which communicates with a vacuum suction device 8 (see FIG. 2) used for sucking the substrate, and is provided so as to communicate with the respective vacuum suction grooves of the projections 2a and 3.
The projections 2a and 3 of the mounting table supporting the substrate 100 are
The total area of the portion in contact with the substrate 100 is 1 of the substrate area.
It is desirable to set it to be 0% or less.

FIG. 2 shows a state in which the substrate 100 is sucked and held on the chuck 1 configured as described above. That is, the substrate 100 is positioned and placed on the chuck 1, and the vacuum suction device 8 is operated to apply a negative pressure through the suction holes 5 to the inside of the vacuum suction grooves of the convex portions 2 a and 3. ,
The substrate 100 is sucked and held by the projections 2 a and 3 of the chuck 1. In this state, in this embodiment, the chuck 1
Are arranged along a scribe line 101 of a shot or a die of the substrate 100 (hereinafter, these are simply referred to as shots). Therefore, the projections 2a are provided on the projections 2a. Although the scribe line 101 is sucked and fixed by the vacuum suction groove, the surface of the substrate 100 is deformed. However, the deflection of the substrate 100 is the same in shot units.
Therefore, there is no difference between the shots in the deflection of the substrate 100 occurring between the protrusions 2a. FIG. 3 illustrates an example of a coordinate error in shot units due to a distortion in a horizontal plane caused by deformation of the substrate surface caused by holding the substrate 100 by suction. In FIG. 3, a circle indicates a position in the shot of the substrate, and a line length indicates a coordinate error amount of the position of the circle. The coordinate error in shot units is determined by the amount of inclination of the substrate surface, and is large in the vicinity of the projections 2a arranged along the scribe line 101, as shown in FIG. In other words, there is almost no displacement at the center of the shot unit, and there is almost no coordinate error. Note that FIG. 3 does not show the coordinate error of the scribe line 101 portion, but since this portion is sucked and held by the convex portion, there is almost no coordinate error.

As described above, the convex portions of the mounting table supporting the substrate in the chuck are set to have a specific positional relationship according to the shape of the region (shot) where the substrate is processed.
For example, by arranging the protrusions of the chuck along the scribe lines of the shots on the substrate so that they are the same for all shots, it is possible to uniform the deformation of the substrate surface for each shot. , The reproducibility between coordinate shots and defocus shots can be improved, and these adverse effects can be corrected.
Further, it becomes easy to correct the adverse effects of lens distortion and field curvature on a shot or die basis.

Here, when the substrate 100 is attracted and held by the chuck 1 shown in FIG. 1, a pattern drawn on an original plate (hereinafter simply referred to as a reticle) such as a reticle or a mask is exposed and transferred on the substrate 100. Next, a mode of correcting a coordinate error of a pattern caused by substrate surface deformation caused by substrate suction holding with a reticle will be described with reference to FIG.

In the case where the coordinate error generated in each shot of the substrate due to the substrate surface deformation caused when the substrate 100 is sucked and held on the chuck 1 becomes as shown in FIG.
For example, when the L-shaped pattern 150 of the reticle shown in FIG. 4A is exposed and transferred to the substrate 100 via the projection optical system, and then the substrate suction and holding is released,
The L-shaped transfer pattern 151 at the top is shown in FIG.
Will be distorted as shown in FIG. In order to prevent the transfer pattern on the substrate from being distorted as indicated by 153 in FIG.
The pattern of the reticle is distorted in the opposite direction so as to correct the substrate surface deformation during substrate adsorption.
A distorted L-shaped pattern as shown by 52 is formed and exposed and transferred. In this way, when forming a pattern to be exposed and transferred on a substrate on a reticle, the substrate surface deformation and the coordinate error when the substrate is suction-held on the chuck are obtained in advance, and the coordinate error caused by the substrate surface deformation is corrected. To form a reticle pattern. By exposing and transferring onto the substrate via the projection optical system using the pattern corrected in this way, it is possible to make the exposure transfer pattern on the substrate free from distortion when the substrate suction holding is released.

Furthermore, in the substrate suction holding apparatus of the present invention, as described above, since the surface deformation of each shot of the substrate at the time of substrate suction is all the same, the reticle pattern is caused by the coordinate error caused by the substrate surface deformation. If the direction is reversed, the exposure transfer pattern on the substrate when the substrate suction holding is released in all shots can be made distortion-free. Also, the formation of a distorted L-shaped pattern as indicated by 152 in FIG. 4C on the reticle can be corrected by taking into account the substrate surface deformation caused by holding the substrate when drawing the pattern on the reticle. Further, as will be described later, it is also possible to make correction by bending the reticle using a reticle bending amount adjusting function of a reticle stage in an exposure apparatus or the like.

Next, another embodiment of the substrate suction holding apparatus of the present invention will be described with reference to FIG.

In this embodiment, the edge ridge-shaped protrusion 2a in the embodiment shown in FIG. 1A is replaced with a pin contact-type protrusion 2b. Although the installation position is changed, the other configuration is substantially the same as the configuration of the above-described embodiment. In this embodiment, the pin contact type projections 2b are arranged at a predetermined pitch along the scribe line 101 of the shot on the substrate.
Since the entire area for processing the substrate is held by the pin contact type projection 2b, the same operation and effect as those of the above-described embodiment can be obtained, and the contact area between the substrate and the chuck can be reduced. The effect of the foreign substance sandwiched between the substrate and the chuck can be reduced.

FIG. 6 shows another embodiment of the substrate suction and holding apparatus of the present invention. In each of the above-described embodiments, the protrusion that holds the processing area of the substrate is supported only at the scribe line portion of the shot, whereas in the present embodiment, the pin contact type protrusion along the scribe line is provided. 2b are arranged, and a pin contact type projection 2b (s) is provided at a portion corresponding to the inside of the shot so as to support the substrate even inside the shot. In the present embodiment, the arrangement of the pin contact type projections 2b (s) in the shot is such that a portion corresponding to the inside of the shot is formed in a + -shape to give symmetry inside the shot. Further, the periphery of the substrate is supported by an edge ridge 3a having no vacuum suction groove.

FIG. 7 shows still another embodiment of the substrate suction and holding apparatus of the present invention. The processing area of the substrate is defined by pin contact with an edge ridge-shaped projection 2a comprising an edge ridge and a vacuum suction groove. It is designed to be supported by two types of protrusions of the mold protrusion 2b.
In other words, the edge ridge-shaped projections 2a composed of the edge ridges and the vacuum suction grooves are arranged along the scribe line 101 of the shot (see FIG. 1B), and the portion corresponding to the inside of the shot is pin-contacted. The mold projections 2b (s) are provided in a circular array. In the present embodiment, since two types of protrusions, that is, the ridge-type protrusion and the pin-contact-type protrusion, are used, the ridge-type protrusion 2a and the suction hole 5 for sucking the substrate are used. 3
And a suction hole communicating with a portion corresponding to the inside of the shot.

FIGS. 8A to 8F show still another embodiment of the substrate suction and holding apparatus of the present invention, in which the arrangement of projections in shot units is shown. Note that a broken line 102 in the drawing indicates a portion corresponding to the position of the scribe line of the shot.

In the projections shown in FIGS. 8A and 8B, the pin contact type projections 2b are arranged along the scribe line as in the embodiment shown in FIG. This is an example in which pin contact type projections 2b (s) are arranged at portions corresponding to the inside of the shot so as to support the substrate, and the shot area is equally divided, and FIG.
Is an even numbered division (four divisions) with the support point at the center of the shot
FIG. 3B shows an example of odd division (five divisions).

FIG. 2C shows an example in which the shot area is equally divided and the projections 2b (s) are arranged without arranging the projections at the portions corresponding to the scribe lines. In FIG. 6D, in the embodiment shown in FIG. 6, the pin contact type projections 2b (s) of the portion corresponding to the inner side of the shot are arranged in a + shape, whereas the pin contact type projections are arranged. Part 2b (s)
This is an example in which they are arranged obliquely in a character shape.

The projections shown in FIG. 4E are edge projections 2a composed of edge projections arranged along scribe lines and vacuum suction grooves, and pin contacts provided at portions corresponding to the inside of the shot. In this example, the projections 2b (s) inside the shot are arranged without any symmetry in the shot. Even in such an arrangement, if the same support is provided in units of shots, the deflection due to the suction holding of the substrate surface becomes the same in units of shots, so that the object of the present invention can be achieved. Also, FIG.
Are examples in which the edge bank-shaped projections 2a (s) are arranged also in a portion corresponding to the inside of the shot.

As described above, since the support in the shot unit is all the same, the deflection due to the suction holding of the substrate surface becomes the same in the shot unit, so that the same operation and effect as in the above-described embodiment can be obtained. it can. In addition, the arrangement of the convex portions in the portion corresponding to the inside of the shot can be determined according to the portion of the shot in which flatness correction of the substrate surface is required, particularly by suction holding of the substrate, and the portion for supporting the substrate can be determined. The greater the number, the greater the effect of flattening the substrate.

FIGS. 9A and 9B show still another embodiment of the substrate suction and holding apparatus of the present invention, in which the arrangement of projections in shot units is shown.

The embodiments shown in FIGS. 9A and 9B are both examples which are effective when applied to a scanning exposure method, and the scanning exposure method usually focuses on the substrate in the scanning direction according to the unevenness of the substrate. Since the scanning can be controlled, if the flatness correcting force of the substrate in the direction perpendicular to the scanning direction (x direction) can be ensured for each slit area of the scanning exposure, the arrangement of the supporting projections of the substrate in the scanning direction is relative to the x direction. The density can be made lower. FIG. 7A shows an example of arrangement in which the inside of the shot has symmetry, and FIG. 8B shows an example of arrangement in the case where there is no symmetry. The embodiment shown in FIG. 10 is also an example which is similarly effective when applied to the scanning exposure method. According to the focus and scanning control in the scanning direction of the scanning exposure method as described above, the case of the scanning exposure method Does not need to have the same arrangement of projections in shot units. As shown in FIG. 10, if the substrate plane correcting force in the x direction is maintained even when the arrangement of the projections is changed in some shots, if the shots of the substrate and the mounting table projections have a predetermined positional relationship, Thus, the effects of the present invention can be obtained. Actually, it is desirable to use a combination of the features of the above-described embodiments depending on an exposure method, an object to be processed on a substrate, and a distribution of required accuracy in a shot.

Next, still another embodiment of the substrate suction holding apparatus of the present invention will be described with reference to FIGS. The present embodiment is provided with a pressure adjusting device for adjusting the gas pressure between the chuck and the substrate held by suction,
The purpose of the present invention is to adjust the amount of deflection of the substrate surface. That is, a pressure adjusting device is added to the substrate suction holding device shown in FIGS. 1 and 2, and the same members as those in the embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals.

In FIG. 11 and FIG.
An edge ridge protrusion 2a composed of a ridge line arranged along the scribing line of the substrate around the scribing line, a vacuum suction groove, and an edge ridge protrusion provided on the outer peripheral portion of the chuck 1. An annular edge bank-shaped protrusion 3 composed of a vacuum suction groove is formed, and a vacuum suction device 8 is connected to the vacuum suction grooves of these edge bank-shaped protrusions 2 a and 3 via suction holes 5. An opening 6 communicating with the pressure adjusting device 7 is provided in a portion corresponding to the inside of the shot. Therefore, the substrate 100 mounted on the chuck 1
It is sucked through the suction hole 5 by the operation of the vacuum suction device 8 and is sucked and held on the edge bank-shaped projections 2 a and 3. By controlling the pressure adjusting device 7, the space between the substrate 100 and the chuck 1, which is sucked and held by the chuck 1, is exhausted or supplied to the space through the opening 6, so that the gas in that space is exhausted. The pressure can be adjusted,
It is possible to adjust the amount of deflection of the substrate 100 inside the shot, and it is possible to appropriately correct the flatness of the substrate surface by sucking and holding the substrate.

In this embodiment, the gas whose temperature has been adjusted so as to keep the temperature of the substrate 100 constant so that the substrate 100 does not undergo thermal deformation due to a rise in the temperature of the substrate 100 due to absorption of exposure light or the like. The flow can also be caused by the adjusting device 7. In this case, it is more effective to appropriately arrange the opening 6 communicating with the pressure adjusting device 7 also in the region 4 between the annular ridge-shaped protrusion 3 and the ridge-shaped protrusion 2a.

Further, in the apparatus of the present embodiment, the deflection of the substrate surface is adjusted by the reticle holding stage on which the exposure pattern is drawn by the exposure apparatus, the reticle's own weight deformation generated by the reticle holding method, the projection lens, and the like. It can also be performed in accordance with the curvature of field of the projected image or the coordinate error of the projected image as shown in FIG. In the present embodiment, the ridge-shaped protrusion 2a is used as the protrusion for supporting the substrate.
However, as shown in FIG. 12, by using a pin contact type convex portion 2b and providing a suction hole for vacuum suction in the center of the pin convex portion as in the embodiment shown in FIGS. The pressure adjusting device can be additionally provided in the embodiment and the like shown in FIGS. 5 and 6, and the same effect can be obtained.

FIG. 13 shows still another embodiment of the substrate suction holding apparatus of the present invention. This embodiment is an embodiment in which a vacuum suction groove is not provided in the convex portion supporting the substrate, and the pressure of the gas between the substrate and the chuck is adjusted on the negative pressure side with respect to the air pressure on the upper surface of the substrate by the pressure adjusting device 7. By doing so, the substrate suction function is also used, and the same function and effect as the embodiment shown in FIG. 12 can be obtained. FIG.
In the embodiment illustrated in FIG. 2 and FIG.
If different pressure adjustments can be performed on each of the opening holes 6 facing each other, it is possible to individually cope with flexure over the entire substrate or local severe bending.

Next, still another embodiment of the substrate suction holding apparatus of the present invention will be described with reference to FIG.

In FIG. 14, the chuck 1 of this embodiment is
Are a plurality of pin contact type projections 2b arranged in a grid in a region corresponding to an array of processing regions (shots) for processing on the substrate 100 as substrate support projections of the mounting table; An annular ridge-type ridge 3 composed of an edge ridge and a vacuum suction groove provided on the outer peripheral portion is provided, and a suction hole 5 communicating with a vacuum suction device for sucking a substrate is provided at the edge ridge. Inside the vacuum suction groove of the mold projection 3 and a number of pin contact type projections 2b
It is arranged in a region 4 between the outer peripheral portion and the annular convex portion 3. The arrangement of a large number of pin contact type projections 2b arranged in a lattice is set so as to have a specific relationship with the arrangement of each shot divided by the scribe line 101 of the substrate 100. For example, the pitch in the X direction and the pitch in the Y direction of a shot (shot divided by the scribe line 101), which is a processing region of the substrate 100, are Sx (m) and Sy (m) as shown in FIG. ), The pitch of the pin contact type projection 2b is set to 1/10 of Sx (m) and Sy (m) in both the X and Y directions. When these pitches are expressed in a cycle, the substrate 10
When the cycles of the array of 0 shots in the X and Y directions are Cx (m ^-1 ) and Cy (m ^-1 ), respectively, Cx = 1 / S
Since x and Cy = 1 / Sy, the periods of the arrangement of the pin contact type projections 2b in the X and Y directions are Fx (m ⁻¹ ),
Assuming that Fy (m ^-1 ), in the present embodiment shown in FIG. 14, there is a relationship of Fx = 10 · Cx (1) Fy = 10 · Cy (2)

As described above, at least the arrangement of the pin contact type projections 2b of the entire portion supporting the shot arrangement portion of the substrate and the arrangement of each shot divided by the scribe line 101 of the substrate 100 have a specific positional relationship. By adjusting the position of the substrate and the substrate support protrusion using a position adjustment mechanism and suppressing at least the rotation error, the suction support can be made the same state for any shot (working area) of the substrate, As a result, there is an effect that the surface deformation of the substrate when the substrate is sucked can be made the same.

In the above-described embodiment, the arrangement of the pin contact type projections 2b and the arrangement of the shots of the substrate 100 in at least the entire portion supporting the shot arrangement portion of the substrate are defined by the equations (1) and (2). However, the present invention is not limited to these arrangement relationships, and at least the pin-contact-type projections of the entire portion supporting the shot arrangement portion of the substrate are arranged such that Fx = m · Cx (3) Fy = n · Cy (4) (where m and n are arbitrary natural numbers (1, 2, 3,...))
It is. By arranging them so as to have a relationship that can be expressed by the expression (3), the same effect as described above can be obtained.

In the substrate suction and holding apparatus of the present invention, as described above, the convex portions for supporting the substrate of the chuck are provided in accordance with the arrangement and arrangement of the shots and dies on the substrate. It is important that the relationship be in a specific state, and an embodiment in which alignment marks for this purpose are provided on the chuck and the substrate, respectively, will be described with reference to FIGS.

FIG. 15A is a plan view of the chuck 1, and the arrangement of the projections 2b supporting the processing area of the substrate is substantially the same as that of the embodiment shown in FIG. Indicates the location of the mark. FIG. 2B shows the substrate 100.
FIG. 10 is a plan view of the substrate showing the shot arrangement of FIG. 10, 10 and 11 show the positions of the alignment marks, and FIG.
An example of a pattern of alignment marks set on the chuck 1 and the substrate 100 is shown, wherein 12 is an alignment mark for position measurement in the x direction, and 13 is an alignment mark for position measurement in the y direction.

The alignment marks provided on the chuck 1 are as follows:
As shown in (a) of FIG.
In the portion 9 which is covered by the substrate 100 and is not hidden when the substrate is sucked and held, the alignment mark 1 shown in FIG.
A set of 2 and 13 is provided at a plurality of locations. Substrate 100
In FIG. 2B, for example, the alignment mark 1 shown in FIG.
2 are provided, and the alignment marks 13 shown in FIG. The chuck 1 and the substrate 100 are held by the chuck 1 and the chuck 1 using an alignment scope (108) and a chuck stage (107) movable in a horizontal plane in an exposure apparatus (see FIG. 16 described later) or the like. The positional relationship between the chuck 1 and the substrate 100 is measured by a driving mechanism (not shown), and the substrate 100 is sucked. In this manner, the arrangement of the processing region of the substrate and the projection of the chuck can be set to a specific positional relationship. Note that the alignment mark may be a mark generally used for aligning the projected image of the substrate and the reticle in a normal exposure apparatus, and the exposure apparatus usually has the function of an alignment scope. There is an advantage that it is not necessary to add the above function to the exposure apparatus.

Next, an exposure apparatus using the substrate suction holding apparatus of the present invention will be described with reference to FIG.

In FIG. 16, reference numeral 103 denotes a reticle as an original on which a pattern to be exposed and transferred to a substrate 100 such as a wafer is drawn, and 104 denotes a reticle stage 1.
06 on the reticle 103 and the driving mechanism 1
A reticle holder having a function of bending the reticle 103 by the reticle 105 is provided with a reticle 10.
Drive mechanisms 105a, 105 so that
This is a flexure amount adjusting device for controlling b. In this manner, by providing the deflection amount adjusting device 110 and the driving mechanisms 105a and 105b, even if the substrate 100 bends on the substrate surface due to the suction holding method, the same deflection can be obtained in shot units. The correction can be made by bending the reticle 103 according to the deflection. The pattern to be exposed and transferred to the substrate 100 is
When the pattern is drawn on 3, the coordinates of the pattern drawing and the pattern shape can be corrected in advance in consideration of the surface deformation of the substrate.

Reference numeral 108 denotes an alignment scope for measuring the positional relationship between the exposure apparatus and the substrate and between the substrate and the chuck.
Reference numeral 109 denotes a drive control device that controls and drives the substrate 100, the chuck stage 107 that holds the chuck 1, and the reticle stage 106 that supports the reticle 103 so as to scan at a predetermined speed, respectively, and 111
Is a projection optical system.

The substrate 100 is sucked and held by the chuck 1 mounted on a chuck stage 107 movable in a horizontal plane (xy plane). Exposure light transmitted through the reticle 103 is reduced by the projection optical system 111 and is irradiated onto the substrate 100 held by the chuck 1. Also,
A thin resist material, which is a photosensitive agent that causes a chemical reaction effectively by exposure light, is applied on the substrate 100 in advance, and functions as an etching mask in the next step.

When exposing while scanning the chuck stage 107 holding the substrate 100 and the chuck 1 and the reticle stage 106 supporting the reticle 103 at a predetermined speed by the drive control unit 109, a method of holding the reticle 103 and the substrate 100 is used. The drive control device 109 calculates the coordinate error in the shot of the alignment mark between the projection image generated by the deflection caused by the projection and the projection image provided on the substrate 100.
Can be reduced by performing exposure while adjusting by the control of.
Also, the exposure apparatus as shown in FIG. 16 usually has a function of adjusting the magnification of the projected image of the projection optical system 111. If this function is used, the pattern of the pattern caused by the substrate support as shown in FIG. Coordinate errors can also be corrected.

The allowable value of the alignment between the processing area such as the shot or the die of the substrate and the arrangement of the convex portions of the chuck can be estimated by approximate calculation using the following model. In FIG. 17, (a) is a diagram illustrating the deflection of the substrate sucked and held by the projection supporting the substrate,
(B) is a model diagram of a beam fixed at both ends that receives an evenly distributed load, and (c) is a diagram illustrating a relationship between a neutral surface and a substrate surface that are not deformed by substrate deflection.

The deflection of the substrate when the interval between the projections 2 is 1 is as shown in FIG. 17 (a), and a material dynamic model in this case is shown in FIG. 17 (b). A model of a beam fixed at both ends that receives a distributed load is applied. According to the “Mechanical Engineering Handbook” (edited by Maruzen), edited by the Japan Society of Mechanical Engineers, etc., the load per unit length determined by the vacuum pressure p, etc. is w, the moment of inertia of area Where I is the distance between the ends of the projections, and E is the longitudinal elastic modulus, the deflection v of the substrate and the inclination i of the substrate at the position of x in the direction of the adjacent projections with the projection end as the origin are become that way.

[0061]

(Equation 1) Here, if the thickness h of the substrate and the width b shown in FIG.

(Equation 2) There is a relationship. In FIG. 3C, a dashed line passing substantially the center of the thickness h indicates a neutral plane which does not expand and contract in the x direction at any x position. The substrate surface expands and contracts in the x direction depending on the location due to the deflection of the substrate surface with respect to the neutral plane. Since the distance from the neutral plane to the substrate surface is affected by the processing state and the suction state on the substrate, the neutral plane correction coefficient is k, and the coordinate error d on the substrate surface is as follows.

[0062]

(Equation 3) Therefore,

(Equation 4) Further, v is obtained from the equations (5), (7) and (8).

(Equation 5) Becomes

According to the equations (10) and (11), the allowable value of the alignment error between the substrate and the chuck (difference between the ideal x value xo and the actually shifted x value xa) has an influence on the processing. By setting the deflection amount of the substrate and the allowable value of the coordinate error, the values p, h, and
Since E and I are known, they can be obtained. Assuming that the allowable value of the coordinate error is dc and the allowable value of the deflection is vc, the allowable value xc of the alignment error can be determined so as to satisfy the following equations (12) and (13).

[0064]

(Equation 6)

In practice, it is more accurate to use a developed version of the equations (10) and (11) in consideration of the arrangement of the two-dimensional projections.

Next, an apparatus for replacing a substrate and a chuck according to the present invention will be described with reference to FIG.

When the processing region of the substrate changes, the chuck in the present invention must be replaced with a chuck provided corresponding to the processing region. Thus, FIG. 18 shows an apparatus capable of performing chuck replacement without lowering the throughput.

In FIG. 18, reference numeral 116 denotes a chuck cassette in which chucks 1a, 1b,... In which convex portions for supporting the substrates are arranged in accordance with the shape of the processing area of each substrate are stored. , Chuck 1a, 1
b ... a predetermined chuck is inserted into the chuck cassette 116.
And a transfer robot for setting the chuck 1 on a chuck stage 117 for performing processing such as exposure. Reference numeral 123 denotes a substrate cassette that stores the substrate 100 to be processed, and 124 denotes a substrate cassette from the substrate cassette 123.
A transfer robot 127 for taking out the substrate 0 and transferring the substrate 100 to the pre-alignment stage 125. The transfer robot 127 mounts the substrate pre-aligned by the pre-alignment stage 125 on the chuck 1 installed on the chuck stage 107. Be a robot.

In the apparatus configured as described above, the substrate 100 to be processed is taken out of the substrate cassette 123 by the transfer robot 124 and projected on the pre-alignment stage 125 provided with the sensor 126 for detecting the external shape of the substrate. It is common practice to perform rough alignment with respect to. During this pre-alignment, the required chuck 1 is exchanged between the chuck stage 107 and the chuck cassette 116 by the chuck transfer robot 117 so that the throughput can be adjusted to the substrate without greatly reducing the throughput. The use of a chuck becomes possible.

The substrate suction holding method and the substrate suction holding apparatus of the present invention are not limited to use in an exposure apparatus, but include a liquid crystal substrate manufacturing apparatus, a magnetic head manufacturing apparatus, various inspection apparatuses for semiconductors, and a micromachine. Needless to say, it can also be used in the production and the like of.

Next, an embodiment of a device manufacturing method using the above-described exposure apparatus of the present invention will be described.

FIG. 19 shows the flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a preprocess, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 20 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. Step 14 (ion implantation) implants ions into the wafer. In step 15 (resist processing), a resist is applied to the wafer. Step 16 (exposure) uses the projection exposure apparatus described above to align and print the circuit pattern of the mask on a plurality of shot areas of the wafer. Step 17 (development)
Then, the exposed wafer is developed. In step 18 (etching), portions other than the developed resist image are removed.
In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

By using such a device manufacturing method, it is possible to stably manufacture a highly integrated device which was conventionally difficult to manufacture at low cost.

[0075]

As described above, according to the present invention,
The deflection of the surface of the substrate held by suction can be made the same in the unit of the shot or die or slit area of the scanning exposure, and the coordinate error of the pattern caused by the deflection of the substrate surface can be shot, die, or scanning exposure The reproducibility can be improved in units of slits. Therefore, the occurrence of pattern shape errors can be corrected by aligning the pattern coordinate error and the exposure image surface of the exposure apparatus with the substrate surface, and the occurrence of defects such as semiconductor elements due to the substrate surface shape can be eliminated. it can.

[Brief description of the drawings]

FIG. 1 is a diagram best showing the features of a substrate suction and holding method of the present invention, and FIG. 1 (a) is a plan view showing an embodiment of a substrate suction and holding device configured based on the substrate suction and holding method of the present invention; And (b) is a plan view of the substrate showing an example of an arrangement of shots or dies on the substrate.

FIG. 2 is a partial cross-sectional view illustrating the substrate suction holding device of the present invention in a state where the substrate is suction-held.

FIG. 3 is a diagram illustrating an example of a coordinate error of a pattern in units of shots generated due to suction holding of a substrate.

FIG. 4 is a view for explaining a mode for correcting a coordinate error of a pattern generated due to substrate suction holding when exposing and transferring a pattern on a reticle onto a substrate sucked and held on a substrate suction holding device. It is.

FIG. 5 is a plan view showing another embodiment of the substrate suction holding device of the present invention.

FIG. 6 is a plan view showing another embodiment of the substrate suction holding device of the present invention.

FIG. 7 is a plan view showing another embodiment of the substrate suction holding device of the present invention.

FIGS. 8 (a) to 8 (f) show still another embodiment of the substrate suction and holding apparatus of the present invention, and are diagrams each showing an arrangement of projections in shot units.

FIGS. 9A and 9B are diagrams showing still another embodiment of the substrate suction and holding apparatus of the present invention, each showing an arrangement of projections in shot units.

FIG. 10 is a plan view showing another embodiment of the substrate suction holding device of the present invention.

FIG. 11 is a plan view showing still another embodiment of the substrate suction holding device of the present invention.

12 is a partial cross-sectional view illustrating the substrate suction holding device illustrated in FIG. 11 in a state where the substrate is suction-held.

FIG. 13 is a partial cross-sectional view illustrating another embodiment of the substrate suction holding device of the present invention in a state where the substrate is suction-held.

FIG. 14A is a plan view showing another embodiment of the substrate suction and holding apparatus of the present invention, and FIG. 14B is a plan view of the substrate showing an example of a shot or die arrangement of the substrate.

FIG. 15A is a plan view showing another embodiment of the substrate suction and holding apparatus of the present invention, and FIG. 15B is a plan view of the substrate showing an example of a shot or die arrangement of the substrate;
(C) shows a pattern example of the alignment mark.

FIG. 16 is a schematic diagram illustrating a configuration of an exposure apparatus.

FIG. 17A is a diagram illustrating the deflection of a substrate sucked and held by a convex portion supporting the substrate, and FIG. 17B is a model diagram of a beam fixed at both ends that receives a uniformly distributed load; (C)
FIG. 4 is a diagram for explaining a relationship between a neutral surface that is not deformed by substrate deflection and a substrate surface.

FIG. 18 is a schematic diagram illustrating a configuration of an apparatus for exchanging a substrate and a chuck.

FIG. 19 is a flowchart showing a semiconductor device manufacturing process.

FIG. 20 is a flowchart showing a wafer process.

FIG. 21 is a plan view of a conventional substrate suction holding device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate adsorption | suction holding apparatus (chuck) 2 (Substrate support) convex part 2a Edge ridge type convex part 2b Pin contact type convex part 2c Edge ridge convex part 3 (Substrate peripheral support) Edge levee convex part 3a (Substrate peripheral support) edge Embankment 5 Suction hole 6 Opening hole 7 Vacuum suction device 8 Pressure adjustment device 9 Positioning mark setting position (of chuck) 10, 11 Positioning mark setting position (of substrate) 12, 13 Positioning mark 100 Substrate 101 Scribe line 103 Reticle 104 Reticle Holder 106 Reticle Stage 107 Chuck Stage 108 Alignment Scope 109 Drive Controller 110 Deflection Adjuster 111 Projection Optical System 116 Chuck Cassette 117 Chuck Transfer Robot 123 Substrate Cassette 125 Prealignment Stage 126 Substrate Shape Detection Sensor

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) The inventor Yukio Takabayashi 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) The inventor Itaru Fujita 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon F term in reference (reference) 3C016 DA02 5F031 CA02 CA05 FA05 HA08 HA14 HA53 JA01 JA14 JA27 JA38 KA06 MA27 PA13 5F046 BA03 CC01 CC11 DA14

Claims (19)

[Claims] 1. A substrate suction holding method comprising: a mounting table having a convex portion for supporting a substrate, wherein the convex portion holds a substrate by suction, wherein the convex portion has a specific shape according to a shape of a region where the substrate is processed. A method for holding a substrate by suction, comprising arranging the substrates in a positional relationship and holding the substrate by suction. 2. The substrate according to claim 1, wherein the substrate has a plurality of processing regions, and the projections are formed so as to have the same arrangement in each of the processing regions on the substrate. 2. The method for adsorbing and holding a substrate according to 1. 3. The substrate suction and holding method according to claim 1, wherein the convex portion is at least one of an edge type convex portion and a pin contact type convex portion. 4. A substrate suction and holding device comprising a mounting table having a convex portion for supporting a substrate, wherein the convex portion holds the substrate by suction, wherein the convex portion has a specific shape in accordance with a shape of a region where the substrate is processed. A substrate suction holding device, which is arranged in a positional relationship. 5. The substrate has a plurality of processing regions, and the projections are formed so as to have the same arrangement in each of the processing regions on the substrate. 5. The substrate suction holding device according to 4. 6. The substrate suction and holding apparatus according to claim 4, wherein the projection is at least one of an edge bank type projection and a pin contact type projection. 7. The substrate suction holding apparatus according to claim 4, wherein the projections are arranged along a boundary line that defines a processing region of the substrate. 8. The substrate suction holding apparatus according to claim 4, wherein the projections are arranged symmetrically in each processing region of the substrate. 9. A vacuum suction means for sucking and holding the substrate on the mounting table by reducing the pressure between the mounting table and the substrate mounted on the mounting table, and / or mounting the substrate in each processing area. The substrate suction holding device according to any one of claims 4 to 8, further comprising a pressure adjusting unit capable of adjusting a pressure in a space between the mounting table and the substrate. 10. The substrate suction holding device according to claim 9, wherein the pressure adjusting means is configured to make the substrate suction force in each processing region of the substrate uniform over the entire substrate. apparatus. 11. A substrate suction and holding device comprising a mounting table having a convex portion for supporting a substrate, wherein the substrate is attracted and held by the convex portion, wherein at least a region of the convex portion for processing a substrate is supported. X-direction period Fx (m ^-1 ) and Y of the array
The cycle Fy (m ^-1 ) in the direction is the cycle Cx (m ^-1 ) in the X direction and the cycle Cy in the Y direction of the array of the regions to be processed on the substrate.
(M ⁻¹ ), Fx = m · Cx Fy = n · Cy (where m and n are arbitrary natural numbers (1, 2, 3,...))
It is. The substrate suction and holding device, wherein the projections are arranged so as to have a relationship of (1). 12. The substrate according to claim 4, further comprising a mechanism capable of adjusting the position of the substrate and the projection of the mounting table so that the two have a specific positional relationship. Suction holding device. 13. A substrate suction holding device according to claim 4, further comprising: an exposure unit for exposing and transferring a pattern of an original onto a substrate sucked and held by the substrate suction holding device. An exposure apparatus. 14. The exposure apparatus according to claim 13, wherein a coordinate error of a transfer pattern and a shape error of the pattern caused by deformation of a processing surface of the substrate due to suction holding of the substrate are corrected by an original. 15. A drive adjusting means for bending the original according to a coordinate error of a transfer pattern and a shape error of a pattern caused by deformation of a processing surface of the substrate caused by suction holding of the substrate. Claim 13
Or the exposure apparatus according to 14. 16. A method according to claim 1, wherein a defocus caused by a difference between a deformation of a processing surface of the substrate caused by suction holding of the substrate and a shape of a projection image plane of the projection optical system is corrected by bending the original. Any one of claims 13 to 15
Exposure apparatus according to Item. 17. A projection optical system for correcting a defocus caused by a difference between a deformation of a processing surface of a substrate caused by suction and holding of the substrate, a shape of a projection image plane of a projection optical system, a holding deformation of an original, and a shape deformed by its own weight. The exposure apparatus according to claim 13, wherein the exposure is performed. 18. A process according to claim 13, wherein the deformation of the processed surface of the substrate caused by the suction and holding of the substrate is controlled in accordance with the shape of the projection image plane of the projection optical system and the shape of the original held or deformed by its own weight. 18. The exposure apparatus according to any one of items 17 to 17, 19. A device manufacturing method, wherein a device is manufactured by a manufacturing process including a step of exposing a substrate using the exposure apparatus according to claim 13. Description: