TWI352874B - Chucking system comprising an array of fluid chamb - Google Patents

Description

Nine, invention description: [Description of the technical field 3 invention field feifl application cross I test application for the April 3, 2006 titled "imprint method by modulating the shape of the wafer, U.S. Patent Application Serial No. 60/788,777, filed on Jan. 31, 2005, entitled <RTIgt;U.S. Patent Application Serial No. Part of the continuation case, which is a method for the purpose of holding a substrate to a wafer chuck, as described in January 31, 2005, U.S. Patent Application Serial No. 11/47,499 Patent application and the method of ''US Patent Application No. 11/108,208', the method of "separating a mold from a solidified layer on a substrate" A divisional patent application, which is hereby incorporated by reference in its entirety for all of its entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire NIST) ATp ruled by the conditions of 70NANB4H3012 BACKGROUND OF THE INVENTION The nanofabrication system comprises, for example, the manufacture of a very small structure having characteristics of several nanometers or less. - The field in which the manufacture of the towel nanometer exerts considerable influence lies in The processing of integrated circuits. As semiconductor processing continues to focus on greater production yields while increasing the number of circuits per unit area formed on a substrate, nanofabrication becomes more important. Nano fabrication provides greater Process control can also further reduce the minimum characteristic dimension of the resulting structure. Other areas of development that have been developed using nanotechnology include biotechnology, optical technology, mechanical systems, and the like. - Exemplary nanofabrication techniques are often referred to as Imprint lithography. Exemplary embossing lithography processes are detailed in a number of publications, such as the method and mold entitled "Distributing properties on a substrate to replicate characteristics with minimal dimensional variability," U.S. Patent Application Publication No. 2004/0065976, the entire disclosure of which is incorporated herein by reference. U.S. Patent Application Serial No. 10/264,926, issued to U.S. Patent Application Serial No. 10/264,926, the disclosure of which is incorporated herein by reference. Patterned materials, U.S. Patent No. 6,936,194, issued to the assignee of the present disclosure. The embossed pattern is formed in the _polymerizable layer and transfers the pattern corresponding to the embossed pattern into a lower substrate. The substrate can be placed on a first stage to obtain a desired position to facilitate its patterning. A moldable liquid is present between the mold and the substrate using a mold separate from the substrate. The liquid system is solidified to form a patterned layer in which a pattern is recorded, wherein the figure (4) conforms to a shape of the surface of the mold contacting the liquid. The mold is then separated from the patterned layer to separate the mold from the substrate. The substrate and the patterned layer are then subjected to a process of transferring the embossed pattern corresponding to the pattern in the patterned layer into the substrate. SUMMARY OF THE INVENTION In accordance with an embodiment of the present invention, a clamping system for holding a substrate is specifically provided, the system comprising: a chuck body having first and second opposing sides, the first One side includes an array of fluid chambers disposed in columns and rows, each of the fluid chambers including first and second separate recesses defining a first and second separate support regions, wherein the first support The substrate surrounds the second line region and the first and second recesses, and the second control region surrounds the sixth first recess, wherein the substrate rests against the first and second support regions, wherein the The first recess and a portion of the substrate superposed thereon define a first chamber and the second recess and a portion of the substrate superposed thereon define a second chamber that allows the rows of the first chamber and The columns of the second chambers are in fluid communication with a different fluid supply to control one of the fluid streams in the array of fluid chambers. According to an embodiment of the present invention, a clamping system for holding a substrate is specifically provided, the system comprising: a chuck body having first and second opposite sides, the first side comprising a a fluid chamber including first and second separate recesses for defining first and second separate support regions, wherein the first support region surrounds the second support region and the first and second portions a recess, and the second support region surrounds the second recess, wherein the substrate rests against the first and second branch regions, wherein the first recess and a portion of the substrate overlapped therewith define a a first chamber and the second recess and a portion of the substrate superposed thereon define a second chamber; and a pressure control system 'which is in fluid communication with the first and second chambers to control the first One of the pressures in the second chamber causes one of the first and second chambers to have a positive pressure of 1352874 and a negative pressure in the remaining chambers of the first and second chambers, wherein for the first and the first One of the two rooms is given a positive pressure and the first a negative pressure in one of the remaining chambers of the second chamber, and a ratio of an area between the first and second recesses causes the fluid chamber to apply a negative force to a portion of the substrate superposed with the fluid chamber on. In accordance with an embodiment of the present invention, a clamping system for holding a substrate is specifically provided, the system comprising: a chuck body having first and second opposing sides, the first side comprising An array of fluid chambers disposed in columns and rows - each of the fluid chambers includes first and second separate recesses defining first and second spaced apart 10 support regions, wherein the first support region is wrapped The second support region and the first and second recesses surround the second recess, wherein the substrate rests against the first and second support regions, wherein the first recess and a portion of the substrate superposed thereon defines a first chamber and the second recess and a portion of the substrate 15 overlapping the substrate define a second chamber; and a pressure control system having a plurality of fluids for a source, wherein each of the rows of the first chambers and the columns of the second chambers are in fluid communication with a different fluid supply source of the plurality of 々IL body sources, the pressure control system controlling the first and the first One of the two indoor pressures makes the first and second to one Having a positive pressure and having a negative pressure in the remaining chambers 20 of the first and second chambers, wherein a positive pressure is given for one of the first and second chambers and the first And a negative pressure of one of the remaining chambers of the second chamber, wherein a ratio of an area between the first and second recesses causes the fluid chamber to apply a negative force to the substrate overlapping the fluid chamber Part of it. BRIEF DESCRIPTION OF THE DRAWINGS 8 1352874 Figure 1 is a simplified side view of a lithography system having a mold separate from a substrate, the substrate being placed on a substrate chuck; Figure 2 is shown in Figure 1 A top view of an array of embossed material droplets on a region of the substrate; 5 Figure 3 is a simplified side view of the substrate of Figure 1, having a patterned layer thereon; Figure 4 a side view of the substrate chuck shown in Figure 1;

Figure 5 is a top plan view of the substrate chuck shown in Figure 1 showing a plurality of rows of pump systems in fluid communication with the plurality of fluid chambers of the substrate chuck; 10 Figure 6 is shown in Figure 1 A top view of a substrate chuck showing a plurality of columns of pump systems in fluid communication with a plurality of fluid chambers of the substrate; Figure 7 is a substrate and substrate chuck both shown in Figure 1 An exploded view of a portion; Fig. 8 is a flow chart showing a method for patterning a region of the substrate shown in Fig. 1; and Fig. 9 is a side view of the substrate and the mold shown in Fig. 1. Wherein the shape of the substrate is modified; Fig. 10 is a side view of the substrate and the mold shown in Fig. 9, the mold is in contact with one portion of the embossing material of Fig. 2; 20 Figures 11 to 13 show 2 is a top view of the compression of the droplets, using the modified shape of the substrate shown in Fig. 9; Fig. 14 is a side view of the substrate and the mold shown in Fig. 10, the substrate is positioned on the substrate holder Fig. 15 is a plan view showing the compression of the droplets in Fig. 2, which is carried out in a step by step in a first embodiment of 9 1352874. Change the shape of the substrate through; and graph shown in FIG. 16 is a side view of a first substrate and a mold, the mold material is separated from the base part. C. Embodiment 3 5 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to Fig. 1, a system 10 for forming a relief pattern on a substrate 12 is shown. Substrate 12 can be joined to a substrate chuck 14, as further described below. Substrate 12 and substrate chuck 14 can be supported on first stage stage 16. Also, the substrate 12 and the substrate chuck 14 can be positioned on a substrate (not shown). Stage 16 10 provides motion along the X and y axes. Separate from the substrate 12 is a template 18 having a face 20 extending therefrom to the substrate 12 and having a patterned surface 22 thereon. Also, the table top 20 may be referred to as a mold 20. The mold 20 can also be referred to as a nanoimprint mold 2〇. In a further embodiment, the template 18 can be substantially free of the mold 2〇. Template 18 and / or 15 molds may include but are not limited to dazzling stone, quartz, stone, organic polymer, siloxane polymer, borosilicate glass, fluorocarbon polymer, metal, and hardened sapphire These materials are formed. As shown, the patterned surface 22 includes properties defined by a plurality of separate recesses 24 and protrusions 26. However, in a further embodiment, the patterned surface 22 can be substantially flat and/or 20 planar. The patterned surface 22 can define an original pattern that forms the basis of a pattern to be formed on the substrate 12. The template 18 can be lightly coupled to a template plate 28 'template chuck 28 is any chuck including, but not limited to, vacuum, pin, groove, or electromagnetic, as described in the heading "for embossing lithography processes The high-precision directional alignment and the gap control are described in U.S. Patent No. 6,873, the entire disclosure of which is incorporated herein by reference. 30 to facilitate movement of the template 18 and thus the mold 2. The system 10 further includes a fluid dispensing system 32. The fluid dispensing system 32 can be in fluid communication with the substrate 12 to deposit polymeric material 34 thereon. Any number of fluid dispensers are included, and a plurality of dispensing units can be included in the fluid dispensing system 32. The polymeric material 34 can be positioned on the substrate 12 using any known technique, such as, for example, drip dispensing, spin coating, dip coating, Chemical vapor deposition (CVD), physical vapor deposition (PVD), thin film deposition, thick film deposition, and the like. As shown in FIG. 2, the polymeric material 34 may be deposited on a substrate by a plurality of 10 separate droplets 36. Defining a matrix Column %. In one example, 'each droplet 36 may have a unit volume of approximately 1 to 1 〇 liter. The droplets 36 of the matrix array 38 may be disposed in five rows of Cl-C5 and five columns Γι·^. 36 can be disposed in any two-dimensional configuration on substrate 12. Typically, polymeric material 154 is disposed on substrate 12 prior to defining the desired volume between mold 20 and substrate 12. However, 'polymerization The material 34 can be filled with the volume after the desired volume has been obtained. Referring to Figures 1 to 3, the system 10 further includes a source 42 coupled to the direct energy 42 along the path material to supply the source 4 (^press head 3 And the step is configured such that the mold 20 and the substrate 12 can be disposed to be stacked and disposed in the path 44 2 . The stamping head 30 , the step 16 , or both change the mold 20 and the substrate 12 . The distance between the distances is defined to define the desired volume of the material to be filled 34. More precisely, the 'droplet 36 can enter and fill the recess 24. The time required for the droplets to fill the pattern defined by the patterned surface 22 It can be defined as the "filling time" of the mold 2〇. The alpha polymer material 34 is filled with the desired volume. After the ', 11, 1352874 source 40 generates energy 42 such as broadband ultraviolet radiation, which causes the polymeric material 34 to conform to the shape of a surface 46 of the substrate 12 and the patterned surface 22 to cause solidification and/or cross-linking, and is defined A patterned layer 48 on the substrate 12. The patterned layer 48 may comprise a residual layer 50 and a plurality of features shown as protrusions 52 and recesses 54. System 10 may be stamped by a stage 16 'imprint head 30 The fluid distribution system 32, and the processor 40, which is powered by the data source 40, is operated by a computer readable program stored in the memory 58. Referring to Figures 1 and 4 to 6, as described above, the system 10 includes a substrate chuck 14. The substrate chuck 14 is adapted to hold the substrate I] by vacuum technology. The substrate slab 14 10 includes a chuck body 6 具有 having opposite sides of the first 62 and the second 64. One side, or edge surface 66, extends between the opposite sides of the first 62 and second 64. The first side 62 includes a plurality of fluid chambers 68. As shown, the substrate chuck 14 includes fluid chambers 68a-68u; however, in a further embodiment, the substrate chuck 14 can include any number of fluid chambers. As shown, the fluid chambers 68a-68u can be positioned 15 to be arranged in one of five rows and five columns b|_b5. However, the fluid chamber 68 can be disposed in any two-dimensional configuration in the chuck body 6〇. For the sake of simplicity, the rows a|_a5 and the column bi_b2 are separately displayed in the fifth and sixth figures. Referring to Figures 4 through 6, each fluid chamber 68 includes a first recess 7a and a second recess 72 spaced apart from the first recess 70 to define a support region 74 and a 20th support region 76. The second support zone 76 surrounds the second recess 72. The first support region 743a surrounds the second support region 76 and the first and second recesses 7 and 72. A plurality of passages 78 and 80 are formed in the chuck body 6'' to place the fluid chambers 68 in fluid communication with a pump system 82 and 84, respectively. More specifically, each of the first recesses 70 of the fluid chamber 68 can be in fluid communication with the pump system 82 via passages 78, and each of the 12 1352874 second recesses 72 can be in fluid communication with the pump system 84 via passages 80. One or more pumps may be included in each of the pump systems 82 and 84. Referring to Figures 4 and 5, each of the first recesses 70 of the fluid chamber 68 in one row ai_a5 of the fluid chamber 68 can be in fluid communication with the system 82 via passage 78. Further, the first recess 70 of the fluid chambers 68d, 68i, and 68n in the row Ai can be fluidly connected to a pump system 8 2 a via a passage 7 8 a; the fluid in row a 2 to 68a, The first recess 7〇 of 68e, 68j, 68〇, and 68s may be in fluid communication with a pump system 82b via a passage 78b; the first recess 70 of the fluid chambers 68b, 68f, 68k, 68p, and 68t in row as The fluid can be in fluid communication with a pump system 108c via a passage 78c; the first recess 7b of the fluid chambers 68c, 68g, 681, 68q, and 68u in row a4 can be in fluid communication with a pump system 82d via a passage 78d. The first recess 70 of the fluid chambers 68h, 68m, and 68i in the row as can be in fluid communication with a pump system 82e via a passage 78e. Referring to Figures 4 and 6, still, each of the 15th recesses 72 of the fluid chamber 68 in a row b-b5 can be in fluid communication with the pump system 84 via the passage 8〇. More specifically, the second recess 72 of the fluid chambers 68a, 08b, and 68c in column b can be in fluid communication with a pump system 84a via a passage 80a; fluid chambers 68d, 68e, 68f, 68g in the train And the second recess 72 of 68h can be in fluid communication with a pump system 84b via a passage 80b; the second recess 72 of the fluid chambers 68i, 68j, 68k, 20 681, and 68m in the row b3 can be connected via a passage 8 c is in fluid communication with a pump system 84c; the second recess 72 of the fluid chambers 68n, 68〇, 68p, 68q, and 68r in column h can be fluidly coupled to a pump system 84d via a passage 80d and in column bs The second recess 72 of the fluid chambers 68s, 68t, and 68u can be in fluid communication with a pump system 84e via a passage 80e. 13 1352874

Ίο Referring to Figures 1 and 4 to 6, when the substrate 12 is positioned on the substrate plate, the substrate 12 rests against the first surface 62' of the chuck body 6〇 to cover the body to 68. 'More specifically, the first and second recesses 70 and 72 of each fluid chamber 68 are covered. More precisely, each of the first recess (four) of the fluid (4) and the portion of the substrate overlapped with the first chamber 86, the second recess 72 of the fluid chamber and the substrate portion overlapped therewith are defined - second chamber 88. Still, the pump system 82 is operative to control one of the first chambers/the vacuum and the pump system 84 is operated to control the pressure/vacuum within the second chamber 88. The pressure/vacuum in the first and second chambers 86 and 88 can be established to maintain the substrate_ position to avoid or reduce the separation of the substrate 12 from the substrate chuck 14 while changing the shape of the substrate 12 as follows. description. The pump system is expected to be in communication with the device 56 and is controlled by a computer readable private memory stored on the memory 58 to control the system systems 82 and 84.

Referring to Figures 4 and 5, more specifically, the pump system is operated to control the pressure/vacuum in one of the fluid chambers 68d, he, and the first chamber of 68n; the pump system 88b is operated. To control one of the pressure/vacuum in the first chamber 86 of the fluid chambers 68a, 68e, 6, 68, and 68s in the phantom; the system is operated to control the fluid chambers 68b, 68f, 68k in row seven. , 68p, and one of his first chambers 8 6 pressure/vacuum; the pump system 8 8 d is operated to control the first chamber 86 of the flow 20 of the body chambers 68c, 68g, 68b 68q, and 68u One of the pressures/vacuum is internal; and the pump system 88e is operated to control one of the pressures/vacuum in the first chamber 86 of the fluid chambers 68h '68m, and 68r in row as. Referring to Figures 4 and 6, the pump system 84a is operative to control one of the pressures/vacuum in the second chamber 88 of the fluid chambers 68a, 68b, and 68c in the column. The pump 14 1352874 system 84b operates to control the column. a pressure/vacuum in the second chamber 88 of the fluid chambers 68d, 68e, 68f, 68g, and 68h in b2; the spring system 8 operates to control the fluid chambers 68i, 68j, 68k, 681 in column b3, and The pressure/vacuum in the second chamber 88 of the crucible; the pump system 84d is operated to control the fluid chambers 5 68n, 68〇, 68p, 68q in the column, and the pressure/vacuum in the second second; The millet system is operated to control one of the first to 88 pressure/vacuum of the fluid chambers 68s, 68t, and 68u in column b5. Referring to Figures 4 through 7, each of the fluid chambers 68 may have one of its associated clamping states or 2) associated with it - non-clamping/arching, depending on the desired application - as follows - Step description. More specifically, the first and the first to 86 and 88 are associated with the first and second recesses 7A and 72, respectively. Therefore, a force applied to a portion of the substrate 12 may be in particular based on one of the areas of the first and second recesses 7 and 72 partially overlapping the substrate 12 and stacked on the substrate 12 portion. The pressure/15 vacuum in the first and second chambers 86 and 88 depends on the magnitude of the pressure. More specifically, for a portion 9 of the substrate 12 stacked in the fluid chamber 68 of the primary group, the force applied to the portion 9 is applied to the first recess 70/first chamber 86. A force F! on the primary portion 92 of the portion 90 and a combination of forces F2 applied to the primary portion 94 of the portion 90 of the second recess 72/second chamber 88. As shown, both the force and the weir 20 are located in a direction away from the substrate 12. However, the forces F and F2 may be in a direction toward the substrate 12. Also, the force & and can be in the opposite direction. Therefore, the force applied to the secondary portion 92 can be defined as follows:

Fi = Αι X p, (1) where A is the area of the first recess 70 and 匕 is the pressure/vacuum associated with the first chamber 86 15 1352874; and the force F2 applied to the secondary portion 94 can be defined as follows: F2 = A2 X P2 (2) where A2 is the area of the second recess 72? 2 is the pressure/vacuum associated with the second chamber 88. The forces F, & F2 associated with the fluid chamber 68 may be collectively referred to as the clamping force Fc applied to the substrate 12 by the substrate chuck 14. Referring to Figures 1 and 4 to 6, it is therefore possible to have a different fluid chamber 68 having a different state depending on the spatial relationship between the droplets 36, the substrate 12, and the mold 20. The state of the first and second chambers 86 and 88 depends in particular on the direction of the force. More specifically, for a force F in a direction toward the substrate 10 12, the first chamber 86 is in a pressurized state; for a force F in a direction away from the substrate 12, the first chamber 86 is in a vacuum State; for a force F2 in a direction toward the substrate 12, the second chamber 88 is in a pressurized state; and for a force F2 in a direction away from the substrate 12, the second chamber 88 is in a vacuum state. Thus, fluid chamber 68 may have one of four combinations associated therewith, as first and second chambers 86 and 88 each have the possibility of two different states associated therewith. Table 1 below shows the four combinations of vacuum/pressure in the first and second chambers 86 and 88 and the resulting fluid chamber 68. 20 Table 1 Combination first chamber 86 second chamber 88 fluid chamber 68 state 1 vacuum vacuum clamping 2 vacuum pressure clamping 3 pressure vacuum clamping 4 pressure pressure non-clamping / bowing first and fourth combination, first And the second chambers 86 and 88 have the same state associated with their phase 16 1352874. More specifically, in the first combination, the first chamber 86 is in a vacuum state and the second chamber 88 is in a vacuum state, and therefore, the fluid chamber 68 has a cool state associated therewith. Also, in the fourth combination, the first chamber 86 is in a pressurized state and the second chamber 88 is in a pressurized state, and therefore, the 5 fluid chamber 68 has a non-clamping/arcing state associated therewith. In the second and third combinations, the first and second chambers 86 and 88 have different states associated therewith. However, fluid chamber 68 has a clamped state associated therewith. Thus, the ratio of the area A! & A2 of the first and second recesses 70 and 72 is such that for a given pressure of 10 KP and a given vacuum Kv associated with the first and second chambers 86 and 88 The force value of one of the forces F! & F2 associated with the vacuum states of the first and second chambers 86 and 88 is greater than the retained force associated with the pressure states of the first and second chambers 86 and 88 and ^ One of the strength values. Therefore, in the second combination described above, the first chamber 86 is in a vacuum state and the second chamber 88 is in a pressurized state. 15 In order to bring the fluid chamber 68 into a vacuum state: 1 F, 1 > 1 F2 I (3) and thus, using the above equations (1) and (2): | Α, χΚν | > | Α2χΚρ 1 (4) And thus the area ratio of the first and second recesses 70 and 72 is divided into two: Ai/A2> I Kp/Kv 1 (5) In the third combination described above, the first chamber 86 is in a pressure state and the second chamber 88 In a vacuum state. Therefore, in order to bring the fluid chamber 68 into a vacuum state: I F2 I > IF, I (6) 17 1352874 and, therefore, using the above equations (1) and (7): | A2xKv | > I Α, χΚρ I (7) and thus The ratios of the areas A! and A of the first and first recesses 70 and 72 are: 5 A, /A2 < I Kv / Kp I (8) Therefore, it is apparent that when the first and second chambers 86 and 88 are The fluid chamber 68 has a vacuum state associated with it in different states, and the areas of the first and second recesses 70 and 72, eight and eight, can be defined as follows: I Kp / Kv I < Aj / A2 < I Ky /Kp I (9) 10 In one example, KP can be approximated to 40 kPa and Kv can be approximated to -80 kPa, and thus the ratio of gossip to 八 2 can be defined as follows: 〇.5 <A, /A2<2 (1〇 Still, a magnitude of pressure within one of the fluid chambers 68 in the non-clamped/arched state can vary. More specifically, the processor 56, which is operated by an electric 15 brain readable program stored in the memory 58, is electrically connected to the pump systems 8 2 and 8 4 and can be respectively connected via the pump systems 82 and 88. The pressure magnitude of one of the first and second chambers 86 and 88 is varied. Referring to Figures 1 through 3, as described above, a distance between the mold 2 and the substrate 12 is varied to define a desired volume of 20 filled with the polymeric material 34 therebetween. Still, after solidification, the polymeric material 34 conforms to the shape of the surface 46 of the substrate 12 and the patterned surface 22 to define the patterned layer 48 on the substrate 12. Thus, in the volume 96 defined between the droplets 36 of the matrix array 38, a gas is present. The gas and/or gas capsules may be such gases as, but not limited to, air, nitrogen, carbon dioxide, and helium. 18 1352874 between the substrate 12 and the mold 2 is specifically due to the plurality of substrates 12 and the mold 20. Therefore, it is possible to fill the time of the 2G material 12 2 Γ Γ 2G. The filling time is particularly dependent on the base material; = and the gas and/or gas capsules in the patterned layer 48 are evacuated and/or dissolved into the polymeric material 34 from the diffusion H U2G and/or expanded into the polymeric material 34. It depends on the time required. Accordingly, a method and system for preventing or minimizing gas trapping between the mold 2G and the substrate 12 will be described below. Referring to Figures 1 and 8, there is shown a method for driving a gas between the substrate 12 and the mold 2〇. More specifically, in the step, as described above, the polymeric material 34 can be dropped by 8 & spin, spin coating, (iv), chemical vapor deposition (cvd physical vapor deposition (PVD), thin film deposition, thick film deposition and A similar manner is positioned on the substrate 12. In a further embodiment, the 'polymeric material 34 can be positioned on the mold 20. Referring to Figures 5, 6, 8 and 9', in step 1〇2, the substrate 12 can be modified. The shape of a 15 is such that a distance defined between the mold 20 and the substrate 12 at a central portion of the substrate 12 is less than a distance defined between the mold 2 and the substrate 12 at the remainder of the substrate 12. In one example, the distance mountain is less than 4 and the distance d2 is defined at an edge of the substrate 12. In a further embodiment, the distance 叱 can be defined at any desired location of the substrate 12. A pressure/vacuum of a plurality of fluid chambers 68 is applied to modify the shape of the substrate 12. More specifically, the fluid chamber 68 overlying a portion 98 of the substrate 12 is in a non-clamping/bow state to The portion 98 of the material 12 is arched toward the mold 20 and away from the substrate chuck 14. The fluid chamber 68 in which a portion 98 of the substrate 12 in the holding/arching state is stacked presents the remaining fluid chamber 68 that is simultaneously stacked with a portion 99 19 1352874 of the substrate 12 in a clamped state to hold the substrate 12 On the substrate chuck 14. Referring to Figures 7, 10, and 11, in step 1 〇 4, as described above for Figure 1, the embossing head 30, the stage 16, or both shown in Figure 1 The system can be changed from 5 to the mountain, as shown in Fig. 9, so that the primary portion of the mold 20 contacts the % portion of the drop. As shown, before the rest of the mold 20 contacts the remaining drops of the drop holder A central portion of the mold 20 is in contact with the % portion of the drop. However, in a further embodiment, any portion of the mold 2 can contact the drop 36 prior to the remainder of the mold 20. Thus, As shown, the 1 〇 mold 20 is substantially simultaneously in contact with all of the granules 36 associated with the raft, as shown in Figure 2. This causes the granules 36 to disperse and create an adjacent liquid sheet 120 of polymeric material 34. The liquid sheet 120 The edges 122a and 122b are respectively defined to be used to push the gas in the volume 96 to the edge 128a, The liquid-gas interfaces 124a and 124b of 128b, 128c, and I28d » The volume 96 of the droplets 36 in the line crC5 96 defines a gas passage through which gas can be pushed toward the edges 128a, 128b, 128c, and 128d. The liquid-gas interfaces 124a and 124b together with the gas channel prevent or reduce gas trapping in the liquid sheet 120. Referring to Figures 4 through 6 and 8, at step 106, the shape of the substrate 12 can be further modified as the distance is further reduced. The desired volume defined between the mold 20 and the substrate 12 can be filled with the polymeric material 34, as described above with reference to Figure 1. More specifically, the shape of the substrate 12 can be altered via the fluid chamber 68 along with a reduced distance mountain via the embossing head 30, the stage 16, or both. More specifically, as described above, the amount of pressure in the first and second chambers 86 and 88 of the fluid chamber 68 overlapping the portion 98 of the substrate 12 can be varied, as shown in Fig. 9 at 20 1352874. Therefore, as the distance mountain shown in FIG. 9 is reduced, the amount of pressure in the first and second chambers 86 and 88 of the fluid chamber 68 overlapping the portion 98 of the substrate 12 can be reduced as '9th The figure shows. The pressure reduction in the first and second chambers 86 5 and 88 of the fluid chamber 68 in which the distance reduction mountain and the portion 98 of the substrate 12 shown in FIG. 9 are overlapped is shown in FIG. As shown in Fig. 2, the polymeric material 34 associated with the rows (and the droplets 36 in the middle are dispersed to become included in the adjacent fluid sheet 120) as shown in Fig. 12. The distance shown in Fig. 9. The mountain may be further reduced in conjunction with a decrease in the amount of pressure in the first and second chambers 86 and 88 of the fluid chamber 68 overlying the portion 98 of the substrate 12 shown in Figure 9, such that the mold 10 20 subsequently becomes contacted. The polymeric material 34 associated therewith is dispersed in association with the crucible 36 and associated with the droplets 36 to become included in the adjacent sheet 12, as shown in Figure 13. In a further embodiment, with the substrate The pressure within the first and second chambers 86 and 88 of the portion 98 of the stacked fluid chamber 68 can be lowered such that the portion 98 of the substrate 12 is positioned on the substrate chuck 14, as shown in FIG. In a further embodiment, the first and second chambers 86 and 88 of the fluid chamber 68 overlapping the portion 98 of the substrate 12 may have after the droplets 36 are dispersed. Referring to Figures 8 and 13, it can be seen that 'the interfaces 124a and 124b have been moved to the edges 128c and 128a, respectively, so that there is an unobstructed path for the gas in the remaining volume 96 to be moved, as shown in Figure 11 This allows the gas in the volume 96 of the 20 shown in Figure U to exit from the mold 20 and the substrate 12 relative to the edges 128a, 128b, 128c, and 128d. In this manner, gas and/or gas can be prevented or minimized. Or the airbag is trapped between the substrate 12 and the mold 2 and in the patterned layer 48, as shown in Fig. 3. Referring to Figures 1 and 8 'in step 108, as described above with reference to Fig. 1, 21 poly 0 Material 34 can then be solidified and/or crosslinked to define patterned layer 48, as shown in Figure 3. Subsequent to step u, mold 2 can be separated from patterned layer 48. Referring to Figures 1, 8 and 15, as described above, the shape of the substrate 12 can be modified in the first direction. However, in the embodiment, the shape of the substrate 12 can be simultaneously changed in the first and second directions, wherein the second direction Orthogonal to the first direction L. More specifically, the substrate 12 can be modified such that one of the substrates 12 Contacting the mold 20, and thus a core portion of the droplets 36 contacts the mold 2 before the remaining droplets of the droplets 36 contact the mold 30, as described above with reference to Figure 10. This causes the droplets 36 to be dispersed. And the liquid sheet 12G' of the polymeric material 34 is created to define a liquid-oxygen interface 124 that can be used to radially push the gas in the volume 96. In one example, the liquid sheet 12 can have a liquid/gas interface 124 A circular or circular expansion to push the gas in volume % outwardly toward the edges 128a, 128b, 128c, and I28d. However, in a further embodiment, the shape of the substrate 12 can be modified in any direction to produce any geometry desired to facilitate the radially outward movement of the gas in the volume 96 toward the edges KM, 128b 128c, and 128d. The liquid sheet 120 of a spherical shape, a cylindrical shape or the like prevents or minimizes the gas and/or gas capsule trapping Po between the substrate 12 and the mold 12 and in the patterned layer 48, as shown in FIG. In a further embodiment, the columns and rows of the first and second chambers 86 and 88 may each generate no pressure/vacuum. Referring to the 16th circle, in a further embodiment, the substrate chuck 14 can be further utilized to facilitate the separation between the mold 20 and the patterned layer 48 on the substrate 12. The separation of the mold 20 from the patterned layer 48 is achieved by applying a separation force Fs to the template 18 and the mold 1352874 2〇. The separating force Fs has a magnitude sufficient to overcome the adhesion between the mold 20 and the patterned layer 48 and the resistance of the substrate 12 to strain (deformation). It is believed that the deformation of the substrate 12-portion facilitates the separation of the mold 20 from the patterned layer 48. Therefore, it may be desirable to minimize the magnitude of the separation force to achieve separation of the mold 20 from the patterned layer 48. Minimizing the separation force F s value is particularly convenient for the alignment between the mold 20 and the substrate 12 to increase the ratio of the template patterned area vs. the total template area, and to minimize the template 18, the mold 20 The probability of structural compromise of the substrate 12 and the patterned layer 48. Thus, as described above, one of the pressure magnitudes within the fluid chamber 68 can be varied so that, as described above, during the separation of the mold 2 from the patterned layer 48, the fluid chamber 68 overlapping the portion 13 of the substrate 12 can be Non-clamping/arc state. As a result, the fluid chamber 68 which is overlapped with the portion 13 of the substrate 12 can apply the clamping force Fc, force 匕 and 6 as shown in Fig. 7 in the direction substantially the same as the separation force 匕 direction. As a result, the amount of separation force & required to separate the mold 20 from the patterned layer 48 can be reduced. More specifically, the amount of the gripping force FC of the portion of the substrate is established to facilitate the portion 13 of the substrate 12 in response to the strain (deformation) of the separation force =. It should be noted that the clamping force h 2 叠 overlapping with the portion 13 of the substrate 12 may have the portion of the substrate 12 located outside the portion 13 held on the substrate chuck 14 when it is subjected to the separation force Fs. Any value you want. Referring to Figure 1, in a further embodiment, the above method of folding the substrate 12f via the substrate chuck W can be similarly applied to the template 18/mold 2〇. More specifically, the template 18/mold 20 can be positioned on the substrate loss plate u in a manner substantially the same as described above for the substrate 12 to facilitate its bending. Therefore, the mold 23 plate 18 / mold 20 can have a thickness of lrnm to facilitate its bending. In another embodiment, a plurality of actuators can be utilized to modify substrate 12 in a manner that is additive or otherwise substituted for substrate chuck 14. The above described embodiments of the invention are exemplary. Many changes and modifications may be made to the above disclosure without departing from the scope of the invention. Therefore, the scope of the invention should not be limited by the above description, but should be determined by reference to the full scope of the claims and the equivalents thereof. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a simplified side view of a lithography system having a mold separate from a substrate, the substrate being placed on a substrate slab; Figure 2 is a stencil view A top view of an array of embossed material droplets on the region of the substrate shown; Figure 3 is a simplified side view of the substrate shown in Figure 1, having a patterned layer thereon; Figure 1 is a side view of the substrate chuck shown in Figure 1; Figure 5 is a top plan view of the substrate chuck shown in Figure 1, showing the pump in fluid communication with the plurality of fluid chambers of the substrate chuck a plurality of rows of the system; Figure 6 is a top plan view of the substrate chuck shown in Figure 1, showing a plurality of columns of pump systems in fluid communication with a plurality of fluid chambers of the substrate; 20 Figure 7 is two The exploded view of one part of the substrate and the substrate chuck shown in Fig. 1; Fig. 8 shows the pattern used for patterning! A flow chart of a method for forming a region of a substrate; Fig. 9 is a side view of the substrate and the mold shown in Fig. 1, wherein the substrate shape 24 1352874 is modified; FIG. 10 is a view of FIG. a side view of the substrate and the mold, the mold is in contact with one of the embossing material droplets of Fig. 2; and the 11th to 13th are top views showing the compression of the granules shown in Fig. 2, wherein 5 is taken in Fig. 9 The modified shape of the substrate is shown; Figure 14 is a side view of the substrate and the mold shown in Figure 10, the substrate is positioned on the substrate chuck; Figure 15 is a view showing the compression of the droplets in Figure 2 In a top view, in a further embodiment, the modified shape of the substrate shown in Fig. 10 is used; and 10 is a side view of the substrate and the mold shown in Fig. 1, the mold being partially separated from the substrate.

[Main component symbol description] 10...System 32...Fluid distribution system 12...New 34...Polymer material 14...Substrate chuck 36...Drops 16...Step 38...Substrate array 18...Template 40...Energy supply source 20... Countertop , nanoimprinting mold 42...direct energy 22...patterned surface 44...path 24,54···recess 46...substrate surface 26,52...projection 48...patterned layer 28···template chuck 50... Residual layer 30...imprint head 56...processor 25 1352874

58...memory 60...chuck body 62...first surface, first side 64...second side 66... side or edge surface 68, 68a-68u...fluid chamber 70...first recess 72...second recess 74· · The branch area 76...the second support area 78,78a,78b,78c,78d,78e,80,80a,80b, SOcjOd^Oe...the passages 82a, 82b, 82c, 82d, 82e, 84, 84a, 84b, 84c, 84^84^8813, 88 (:, 88^88^ pump system 86... first chamber 88... second chamber 90... part 92, 94...sub-portion 96 of the substrate stacked in the fluid chamber of the primary group ...the volume defined by the droplets of the matrix array 98,99...the portion of the substrate 100,102,104,106,108,110...^0...the liquid sheet 122aJ22b...the edge of the liquid sheet 124a424b...the liquid·gas interface 128a,128b,128c,128d·· ·^ ara5,c丨~c5...row Ar · The area of the first recess 70 Α2...the area of the second recess 72 1?1 7 5,1*1-犷5...歹lj di,d2...distance

Fi · · · Force applied to the secondary portion 92 F2 · · · Force applied to the secondary portion 94 Fc... Loss of force Fs ·.. Separation force Kp... Given pressure Κν... Given vacuum

Pr · Pressure/vacuum associated with the first chamber 86 Pr. · Force/vacuum associated with the second chamber 88 26

Claims (1)

1352874 Patent Application No. 9611034 Application for Amendment of Patent Scope This date: July 10, 100, the scope of application for patents: R5 years. ] month<? day revision | 1. A central holding system for holding a first portion of a substrate and simultaneously bending a second portion of the substrate, the system comprising a chuck body Having a first and a second opposing side, the first side comprising an array of fluid chambers disposed in five rows and rows, the fluid chamber array including a first fluid chamber overlapping the first portion of the substrate And a second fluid chamber overlapping the second portion of the substrate, each fluid chamber including first and second separate recesses defining first and second separate support regions, wherein the first support region Surrounding the second support area and the first and second recesses 10, and the second support area surrounds the second recess, wherein the substrate rests against the first and first branch areas of D Hai. The first recess and a portion of the substrate superposed therewith define a first chamber and the second recess and a portion of the substrate superposed thereon define a second chamber, wherein the 15th chamber Each of the second chambers and each of the second chambers are connected to a fluid flow with a different flow Controlling the flow of fluid in the array of fluid chambers, the first chamber of the first fluid chamber is in a vacuum state, and wherein the second chamber of the first body chamber and the first chamber of the second fluid chamber And the second chamber is in a state of pressure. 2 〇 2. The clamping system of claim i, wherein each of the first chambers of the fluid chambers is in fluid communication with a common fluid supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . • ^ Patent application scope! The clamping system of the item, wherein each of the first chambers in the row of the fluid chambers and the first common fluid source is a fluid guide 27 1352874 Patent Application No. 96110034 Patent Application Revision Date: 100 years July And wherein each of the second chambers in one of the fluid chambers is in fluid communication with a second common fluid supply source different from the first common fluid supply source. 10 15 The gripping system of claim 1, wherein one of the fluid chamber arrays is sealed relative to the remaining fluid chambers of the fluid chamber array. 6. The clamping system of claim 1, further comprising a plurality of passages, wherein each of the rows of the first chambers and the columns of the second chambers are coupled to different passages to The second chamber is placed in fluid communication with the different fluid sources. 7. A clamping system for holding a first portion of a substrate and simultaneously bending a second portion of the substrate, the system comprising a chuck body having first and second portions On the opposite side, the first side system includes an array of fluid chambers, the fluid chamber array includes a first fluid chamber and a second fluid chamber, each fluid chamber including a first to define first and second separate support regions And a second separate recess, wherein the first support region surrounds the second support region and the first and second recesses, and the second support region surrounds the second recess, wherein the substrate rests against the Waiting for the first and second support regions such that the first recess and a portion of the substrate superposed thereon define a first chamber and the second recess and a portion of the substrate superposed thereon define a second And a pressure control system in fluid communication with the first fluid chamber and the second fluid chamber, the pressure control system and the first and second chambers of the first fluid chamber and the second fluid chamber Each of them is fluidly conducting to control the first and second One of the pressures 28 1352874 Patent Application No. 9611· Patent Application Scope Correction This date is the date of July, so that the first and second chambers of the first fluid chamber have a positive pressure and the second fluid chamber The first and second chambers have a negative pressure for the (four) of the first fluid chamber and the positive pressure of the second chamber and the first and second of the second fluid chamber The indoor-negative pressure 'one of the _ areas between the first and second recesses is such that the first fluid chamber applies a negative force to a portion of the substrate that overlaps the fluid The above. 8. If the clamping system of claim 7 is applied, the further step comprises a plurality of fluid chambers arranged in columns and rows. 10. 9. If the gripping system of claim 7 is applied, the step further includes a first and second passages for respectively placing the first and second chambers in fluid communication with the force control system. The invention relates to a clamping system according to claim 7 , wherein the pressure control system comprises a plurality of fluid supply sources, wherein each row of the first chamber and each column of the first chamber and the plurality of One of the fluid supply sources is fluidly conductive with a different fluid supply to control the flow of fluid in the array of fluid chambers. = Please refer to the patent section (4) of the 1G item, where the fluid chambers of each of the fluid chambers are fluid-conducting with the common fluid supply. 20 The clamping system of claim H), wherein each of the fluid chambers 13 such as the second chamber is in fluid communication with the common fluid supply. The clamping system of the first aspect, wherein each of the first chambers of the fluid chambers of the fluid chambers is in fluid communication with the first medium of the fluid chambers The first source of a common fluid supply _ total ^ - room system - different brothers - a total of fluid source is a fluid guide 29 1352874 Patent Application No. 96110034 Patent application scope revision period: 100 years July. 14. The clamping system of claim 10, wherein one of the fluid chamber arrays is dense relative to the remaining fluid chambers of the fluid chamber array 10 15 20 seals. 15. The clamping system of claim 10, further comprising a plurality of passages, wherein each of the rows of the first chambers and the columns of the second chambers are coupled to different passages to treat the first and third The two chambers are placed in fluid communication with the different fluid sources. 16. A clamping system for holding a first portion of a substrate and simultaneously bending a second portion of the substrate, the system comprising: a chuck body having first and second relatives a first side system comprising an array of fluid chambers disposed in a row and a row, the fluid chamber array comprising a first fluid chamber and a second fluid chamber, the first fluid chamber and the second fluid chamber The first and second separate recesses for defining the first and second separate support regions, wherein the first support region surrounds the second support region and the first and second recesses, and the second The support region surrounds the second recess, wherein the substrate rests against the first and second support regions, wherein the first recess and a portion of the substrate superposed thereon define a first chamber and the second a recess and a portion of the substrate superposed thereon define a second chamber; and a pressure control system having a plurality of fluid sources, wherein each row of the first chambers and each of the second chambers One of the plurality of fluid sources is fluidly connected to one of the different fluid sources The pressure control system controls a pressure of one of the first and second chambers such that the first and second chambers of the first fluid chamber have a positive pressure and the patent application scope of the patent application No. Correcting the first and second chambers of the second fluid chamber in the first half of the year, having a negative pressure, wherein one of the first and second chambers of the first fluid chamber is given a positive a pressure and a negative pressure of the first and second chambers of the second fluid chamber, and a ratio of an area between the first and second recesses is such that the first fluid chamber will be negative A force is applied to a portion of the substrate that overlaps the first fluid chamber. 10 15 17' The gripping system of claim 16, wherein each of the first chambers in the row of the fluid chambers is in fluid communication with a common fluid supply. The clamping system of claim 16 wherein each of the second chambers of the fluid chambers is in fluid communication with a common fluid supply. The application of the patent system (4), wherein each of the first chambers of the fluid chambers and the first common fluid source are fluid guides 2 and wherein each of the fluid chambers The second chamber is different from the second common fluid source of the first common fluid source, and the fluid is guided by the fluid. 2 = 1 zhongzhongli = the sixth item of the system, the step includes a plurality of paths Each of the first chambers is coupled to a different passage to fluidly conduct the respective columns of the first and second chambers. - to the placement and the non-20 31