KR20110058690A - 마운팅 장치 및 마운팅 방법 - Google Patents

마운팅 장치 및 마운팅 방법 Download PDF

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Publication number
KR20110058690A
KR20110058690A KR1020100116704A KR20100116704A KR20110058690A KR 20110058690 A KR20110058690 A KR 20110058690A KR 1020100116704 A KR1020100116704 A KR 1020100116704A KR 20100116704 A KR20100116704 A KR 20100116704A KR 20110058690 A KR20110058690 A KR 20110058690A
Authority
KR
South Korea
Prior art keywords
mounting
preform
correspond
line
workpiece
Prior art date
Application number
KR1020100116704A
Other languages
English (en)
Korean (ko)
Inventor
히로시 하야시
Original Assignee
캐논 머시너리 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 머시너리 가부시키가이샤 filed Critical 캐논 머시너리 가부시키가이샤
Publication of KR20110058690A publication Critical patent/KR20110058690A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
KR1020100116704A 2009-11-26 2010-11-23 마운팅 장치 및 마운팅 방법 KR20110058690A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009268899A JP2011114143A (ja) 2009-11-26 2009-11-26 マウント装置及びマウント方法
JPJP-P-2009-268899 2009-11-26

Publications (1)

Publication Number Publication Date
KR20110058690A true KR20110058690A (ko) 2011-06-01

Family

ID=44087961

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100116704A KR20110058690A (ko) 2009-11-26 2010-11-23 마운팅 장치 및 마운팅 방법

Country Status (4)

Country Link
JP (1) JP2011114143A (zh)
KR (1) KR20110058690A (zh)
CN (1) CN102082076A (zh)
TW (1) TWI502658B (zh)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3163881B2 (ja) * 1993-12-17 2001-05-08 松下電器産業株式会社 ダイボンディング装置およびダイボンディング方法
US6605315B1 (en) * 1999-11-05 2003-08-12 Matsushita Electric Industrial Co., Ltd. Bonding paste applicator and method of using it
JP2005311013A (ja) * 2004-04-21 2005-11-04 Nidec Tosok Corp ダイボンディング装置
JP4907233B2 (ja) * 2006-06-12 2012-03-28 キヤノンマシナリー株式会社 基板搬送方法および基板搬送装置

Also Published As

Publication number Publication date
CN102082076A (zh) 2011-06-01
TW201133659A (en) 2011-10-01
JP2011114143A (ja) 2011-06-09
TWI502658B (zh) 2015-10-01

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