KR20100041751A - 반송방법 및 반송장치 - Google Patents

반송방법 및 반송장치 Download PDF

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Publication number
KR20100041751A
KR20100041751A KR1020107000302A KR20107000302A KR20100041751A KR 20100041751 A KR20100041751 A KR 20100041751A KR 1020107000302 A KR1020107000302 A KR 1020107000302A KR 20107000302 A KR20107000302 A KR 20107000302A KR 20100041751 A KR20100041751 A KR 20100041751A
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KR
South Korea
Prior art keywords
possibility
pair
acceleration
conveyance
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107000302A
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English (en)
Korean (ko)
Inventor
히데히로 마에다
가즈야 오카모토
야스아키 다나카
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20100041751A publication Critical patent/KR20100041751A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1694—Program controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Control Of Conveyors (AREA)
KR1020107000302A 2007-06-21 2008-06-19 반송방법 및 반송장치 Ceased KR20100041751A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-164081 2007-06-21
JP2007164081 2007-06-21

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020157014268A Division KR20150067393A (ko) 2007-06-21 2008-06-19 웨이퍼 접합방법, 웨이퍼 접합장치 및 웨이퍼 홀더

Publications (1)

Publication Number Publication Date
KR20100041751A true KR20100041751A (ko) 2010-04-22

Family

ID=40156310

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020107000302A Ceased KR20100041751A (ko) 2007-06-21 2008-06-19 반송방법 및 반송장치
KR1020157014268A Ceased KR20150067393A (ko) 2007-06-21 2008-06-19 웨이퍼 접합방법, 웨이퍼 접합장치 및 웨이퍼 홀더

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020157014268A Ceased KR20150067393A (ko) 2007-06-21 2008-06-19 웨이퍼 접합방법, 웨이퍼 접합장치 및 웨이퍼 홀더

Country Status (5)

Country Link
US (3) US8244399B2 (https=)
JP (2) JP5375607B2 (https=)
KR (2) KR20100041751A (https=)
TW (1) TWI533394B (https=)
WO (1) WO2008156152A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114121716A (zh) * 2020-08-27 2022-03-01 东京毅力科创株式会社 基板处理装置和基板处理方法

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EP2004366A2 (en) * 2006-01-27 2008-12-24 Camtek Ltd. Diced wafer adaptor and a method for transferring a diced wafer
TWI478272B (zh) * 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
JP5732631B2 (ja) 2009-09-18 2015-06-10 ボンドテック株式会社 接合装置および接合方法
JP5549339B2 (ja) * 2010-04-12 2014-07-16 株式会社ニコン 基板相対位置検出方法、積層デバイス製造方法および検出装置
DE102010048043A1 (de) * 2010-10-15 2012-04-19 Ev Group Gmbh Vorrichtung und Verfahren zur Prozessierung von Wafern
JP5854375B2 (ja) * 2010-12-24 2016-02-09 ボンドテック株式会社 接合装置および接合方法
JP6031754B2 (ja) * 2011-12-12 2016-11-24 株式会社ニコン 基板重ね合わせ方法、積層半導体装置の製造方法、及び、基板重ね合わせ装置
JP5696076B2 (ja) * 2012-03-21 2015-04-08 株式会社東芝 半導体装置の検査装置及び半導体装置の検査方法
JP6105982B2 (ja) * 2012-09-21 2017-03-29 株式会社Ｓｃｒｅｅｎホールディングス スケジュール作成装置、基板処理装置、スケジュール作成プログラム、スケジュール作成方法、および基板処理方法
WO2014064944A1 (ja) * 2012-10-26 2014-05-01 株式会社ニコン 基板貼り合わせ装置、位置合わせ装置、基板貼り合わせ方法、位置合わせ方法、及び、積層半導体装置の製造方法
EP2832675B1 (en) * 2013-07-29 2018-07-04 Siemens Aktiengesellschaft Blade gripping device
JP6363854B2 (ja) * 2014-03-11 2018-07-25 キヤノン株式会社 形成方法、および物品の製造方法
JP6305887B2 (ja) * 2014-09-16 2018-04-04 東芝メモリ株式会社 半導体装置の製造方法及び半導体製造装置
CN104362107B (zh) * 2014-10-23 2017-03-01 浙江中纳晶微电子科技有限公司 晶圆真空键合机及键合方法
US9640418B2 (en) * 2015-05-15 2017-05-02 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
FR3039926A1 (fr) * 2015-08-04 2017-02-10 Commissariat Energie Atomique Procede d'assemblage de dispositifs electroniques
JP6874692B2 (ja) 2015-12-28 2021-05-19 株式会社ニコン 基板貼り合わせ装置および基板貼り合わせ方法
JP6670185B2 (ja) 2016-06-15 2020-03-18 東京応化工業株式会社 重ね合わせ装置、貼付装置、重ね合わせ方法および貼付方法
JP6727048B2 (ja) * 2016-07-12 2020-07-22 東京エレクトロン株式会社 基板搬送装置および接合システム
JP6473116B2 (ja) * 2016-09-30 2019-02-20 ボンドテック株式会社 アライメント装置およびアライメント方法
US10410892B2 (en) * 2016-11-18 2019-09-10 Taiwan Semiconductor Manufacturing Company Ltd. Method of semiconductor wafer bonding and system thereof
JP6574410B2 (ja) * 2016-12-07 2019-09-11 日本電信電話株式会社 半導体デバイスのウェハ接合方法
US10497667B2 (en) * 2017-09-26 2019-12-03 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for bond wave propagation control
EP3833164A1 (en) * 2019-12-05 2021-06-09 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Compensating misalignment of component carrier feature by modifying target design concerning correlated component carrier feature
NL1043633B1 (nl) * 2020-04-14 2021-10-26 Integrated Mech Solutions B V Inrichting en werkwijze voor het vervaardigen van voortbrengsels
CN114793466A (zh) * 2021-10-25 2022-07-26 长江存储科技有限责任公司 晶圆键合设备及方法
US12431378B2 (en) * 2022-11-08 2025-09-30 Canon Kabushiki Kaisha Chip chuck and a method of using the same
KR20250153361A (ko) * 2024-04-17 2025-10-27 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114121716A (zh) * 2020-08-27 2022-03-01 东京毅力科创株式会社 基板处理装置和基板处理方法
KR20220027766A (ko) * 2020-08-27 2022-03-08 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법

Also Published As

Publication number Publication date
JP2014057070A (ja) 2014-03-27
US20100168908A1 (en) 2010-07-01
JPWO2008156152A1 (ja) 2010-08-26
US8244399B2 (en) 2012-08-14
US20130274915A1 (en) 2013-10-17
US8489227B2 (en) 2013-07-16
TWI533394B (zh) 2016-05-11
US20120330459A1 (en) 2012-12-27
KR20150067393A (ko) 2015-06-17
JP5729440B2 (ja) 2015-06-03
JP5375607B2 (ja) 2013-12-25
TW200913120A (en) 2009-03-16
WO2008156152A1 (ja) 2008-12-24

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