KR20090025154A - 확장 방법 및 확장 장치 - Google Patents

확장 방법 및 확장 장치 Download PDF

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Publication number
KR20090025154A
KR20090025154A KR1020080086188A KR20080086188A KR20090025154A KR 20090025154 A KR20090025154 A KR 20090025154A KR 1020080086188 A KR1020080086188 A KR 1020080086188A KR 20080086188 A KR20080086188 A KR 20080086188A KR 20090025154 A KR20090025154 A KR 20090025154A
Authority
KR
South Korea
Prior art keywords
workpiece
adhesive film
imaging
stage
expansion
Prior art date
Application number
KR1020080086188A
Other languages
English (en)
Korean (ko)
Inventor
가츠유키 이소하타
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20090025154A publication Critical patent/KR20090025154A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
KR1020080086188A 2007-09-05 2008-09-02 확장 방법 및 확장 장치 KR20090025154A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00230416 2007-09-05
JP2007230416A JP2009064905A (ja) 2007-09-05 2007-09-05 拡張方法および拡張装置

Publications (1)

Publication Number Publication Date
KR20090025154A true KR20090025154A (ko) 2009-03-10

Family

ID=40463037

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080086188A KR20090025154A (ko) 2007-09-05 2008-09-02 확장 방법 및 확장 장치

Country Status (4)

Country Link
JP (1) JP2009064905A (zh)
KR (1) KR20090025154A (zh)
CN (1) CN101383277B (zh)
TW (1) TWI445067B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160001666A (ko) * 2014-06-27 2016-01-06 가부시기가이샤 디스코 테이프 확장 장치
KR20180108457A (ko) * 2017-03-24 2018-10-04 가부시기가이샤 디스코 시트 확장 장치

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5313036B2 (ja) * 2009-05-11 2013-10-09 株式会社ディスコ 粘着テープの拡張方法
JP5013148B1 (ja) * 2011-02-16 2012-08-29 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP5472275B2 (ja) * 2011-12-14 2014-04-16 株式会社村田製作所 エキスパンド装置及び部品の製造方法
JP5988599B2 (ja) * 2012-02-09 2016-09-07 株式会社ディスコ 被加工物の分割方法
JP5975767B2 (ja) * 2012-07-18 2016-08-23 株式会社ディスコ 加工装置
JP6110136B2 (ja) * 2012-12-28 2017-04-05 株式会社ディスコ ウエーハのレーザー加工方法およびレーザー加工装置
CN103066001B (zh) * 2012-12-28 2015-04-22 无锡中微高科电子有限公司 共晶焊机拾取芯片用的万向调平吸嘴
JP6202984B2 (ja) * 2013-10-24 2017-09-27 オリンパス株式会社 細胞分取方法
JP6255219B2 (ja) * 2013-11-14 2017-12-27 株式会社ディスコ 冷却機構
JP6425435B2 (ja) * 2014-07-01 2018-11-21 株式会社ディスコ チップ間隔維持装置
CN106653657B (zh) * 2016-12-21 2019-06-07 海宁定美电子智能设备有限公司 半导体处理装置
JP2018152380A (ja) * 2017-03-09 2018-09-27 株式会社ディスコ パッケージデバイスチップの製造方法
JP6941022B2 (ja) * 2017-10-06 2021-09-29 株式会社ディスコ 拡張方法及び拡張装置
CN108389826A (zh) * 2018-02-11 2018-08-10 安徽三安光电有限公司 用于晶粒扩膜的薄膜及其制作方法
JP7030006B2 (ja) 2018-04-12 2022-03-04 株式会社ディスコ 拡張方法及び拡張装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4471565B2 (ja) * 2002-12-10 2010-06-02 株式会社ディスコ 半導体ウエーハの分割方法
CN1758993B (zh) * 2003-01-29 2012-03-21 三星宝石工业株式会社 基板切割设备和基板切割方法
KR20060055457A (ko) * 2003-05-22 2006-05-23 가부시키가이샤 토쿄 세이미쯔 다이싱장치
CN100428418C (zh) * 2004-02-09 2008-10-22 株式会社迪斯科 晶片的分割方法
JP2005251986A (ja) * 2004-03-04 2005-09-15 Disco Abrasive Syst Ltd ウエーハの分離検出方法および分離検出装置
JP4444085B2 (ja) * 2004-11-30 2010-03-31 キヤノンマシナリー株式会社 ウェーハリング移送システム
JP4694845B2 (ja) * 2005-01-05 2011-06-08 株式会社ディスコ ウエーハの分割方法
JP2007036143A (ja) * 2005-07-29 2007-02-08 Disco Abrasive Syst Ltd 半導体ウエーハの加工方法
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160001666A (ko) * 2014-06-27 2016-01-06 가부시기가이샤 디스코 테이프 확장 장치
KR20180108457A (ko) * 2017-03-24 2018-10-04 가부시기가이샤 디스코 시트 확장 장치

Also Published As

Publication number Publication date
CN101383277A (zh) 2009-03-11
JP2009064905A (ja) 2009-03-26
TWI445067B (zh) 2014-07-11
TW200913030A (en) 2009-03-16
CN101383277B (zh) 2012-08-22

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