KR20080109002A - 원자층 침착 방법 - Google Patents
원자층 침착 방법 Download PDFInfo
- Publication number
- KR20080109002A KR20080109002A KR1020087023813A KR20087023813A KR20080109002A KR 20080109002 A KR20080109002 A KR 20080109002A KR 1020087023813 A KR1020087023813 A KR 1020087023813A KR 20087023813 A KR20087023813 A KR 20087023813A KR 20080109002 A KR20080109002 A KR 20080109002A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- flow
- gas
- gaseous
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/45504—Laminar flow
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45519—Inert gas curtains
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
- C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45587—Mechanical means for changing the gas flow
- C23C16/45591—Fixed means, e.g. wings, baffles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Fluid Mechanics (AREA)
- Physics & Mathematics (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/392,007 | 2006-03-29 | ||
| US11/392,007 US7413982B2 (en) | 2006-03-29 | 2006-03-29 | Process for atomic layer deposition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080109002A true KR20080109002A (ko) | 2008-12-16 |
Family
ID=38233069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087023813A Ceased KR20080109002A (ko) | 2006-03-29 | 2007-03-14 | 원자층 침착 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7413982B2 (https=) |
| EP (1) | EP1999295B1 (https=) |
| JP (1) | JP5149272B2 (https=) |
| KR (1) | KR20080109002A (https=) |
| CN (1) | CN101415860A (https=) |
| TW (1) | TWI396768B (https=) |
| WO (1) | WO2007126585A2 (https=) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8697198B2 (en) | 2011-03-31 | 2014-04-15 | Veeco Ald Inc. | Magnetic field assisted deposition |
| KR101463105B1 (ko) * | 2014-01-02 | 2014-12-04 | 연세대학교 산학협력단 | 황화 텅스텐층 형성 방법 및 황화 텅스텐층 형성 장치 |
| KR101503031B1 (ko) * | 2013-04-25 | 2015-03-18 | 한국화학연구원 | 아미노싸이올레이트를 이용한 납 전구체, 이의 제조방법, 및 이를 이용하여 박막을 형성하는 방법 |
| US9412961B2 (en) | 2012-11-13 | 2016-08-09 | Samsung Display Co., Ltd. | Method of manufacturing organic light-emitting display apparatus |
| US9481929B2 (en) | 2013-09-10 | 2016-11-01 | Samsung Display Co., Ltd. | Vapor deposition apparatus, vapor deposition method and method of manufacturing organic light emitting display apparatus |
| US11320393B1 (en) | 2021-08-03 | 2022-05-03 | King Abdulaziz University | Gas sensor for detection of toxic gases |
Families Citing this family (172)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090110892A1 (en) * | 2004-06-30 | 2009-04-30 | General Electric Company | System and method for making a graded barrier coating |
| US8034419B2 (en) | 2004-06-30 | 2011-10-11 | General Electric Company | Method for making a graded barrier coating |
| US20070151842A1 (en) * | 2005-12-15 | 2007-07-05 | Fluens Corporation | Apparatus for reactive sputtering |
| EP2000008B1 (en) | 2006-03-26 | 2011-04-27 | Lotus Applied Technology, Llc | Atomic layer deposition system and method for coating flexible substrates |
| US20070281089A1 (en) * | 2006-06-05 | 2007-12-06 | General Electric Company | Systems and methods for roll-to-roll atomic layer deposition on continuously fed objects |
| US7573420B2 (en) * | 2007-05-14 | 2009-08-11 | Infineon Technologies Ag | RF front-end for a radar system |
| US11136667B2 (en) | 2007-01-08 | 2021-10-05 | Eastman Kodak Company | Deposition system and method using a delivery head separated from a substrate by gas pressure |
| US20080166880A1 (en) * | 2007-01-08 | 2008-07-10 | Levy David H | Delivery device for deposition |
| US8207063B2 (en) * | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| JP2008270670A (ja) * | 2007-04-24 | 2008-11-06 | Oki Electric Ind Co Ltd | 薄膜形成装置及び薄膜形成方法 |
| US20080299771A1 (en) * | 2007-06-04 | 2008-12-04 | Irving Lyn M | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US8398770B2 (en) * | 2007-09-26 | 2013-03-19 | Eastman Kodak Company | Deposition system for thin film formation |
| GB0718841D0 (en) * | 2007-09-26 | 2007-11-07 | Eastman Kodak Co | Method of making a colour filter array |
| GB0718840D0 (en) * | 2007-09-26 | 2007-11-07 | Eastman Kodak Co | Method of patterning vapour deposition by printing |
| US7972898B2 (en) * | 2007-09-26 | 2011-07-05 | Eastman Kodak Company | Process for making doped zinc oxide |
| GB0718839D0 (en) * | 2007-09-26 | 2007-11-07 | Eastman Kodak Co | method of patterning a mesoporous nano particulate layer |
| US7572686B2 (en) * | 2007-09-26 | 2009-08-11 | Eastman Kodak Company | System for thin film deposition utilizing compensating forces |
| US8182608B2 (en) * | 2007-09-26 | 2012-05-22 | Eastman Kodak Company | Deposition system for thin film formation |
| US8153352B2 (en) | 2007-11-20 | 2012-04-10 | Eastman Kodak Company | Multicolored mask process for making display circuitry |
| WO2009075585A1 (en) * | 2007-12-10 | 2009-06-18 | Universitetet I Oslo | Method of depositing a doped zinc oxide film, a conductive zinc oxide film and use of the doped zinc oxide film |
| US20090291209A1 (en) | 2008-05-20 | 2009-11-26 | Asm International N.V. | Apparatus and method for high-throughput atomic layer deposition |
| US9238867B2 (en) | 2008-05-20 | 2016-01-19 | Asm International N.V. | Apparatus and method for high-throughput atomic layer deposition |
| IT1393401B1 (it) * | 2008-07-28 | 2012-04-20 | Enea Ente Per Le Nuova Tecnologie L En E L Ambiente | Metodo per la fabbricazione in linea di strati sottili di zno b trasparente conduttivo e testurizzato su larga area e relativo apparato |
| EP2159304A1 (en) | 2008-08-27 | 2010-03-03 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Apparatus and method for atomic layer deposition |
| TW201014926A (en) * | 2008-10-15 | 2010-04-16 | Nat Univ Tsing Hua | Method for producing metallic oxide film having high dielectric constant |
| CN103352206B (zh) | 2008-12-04 | 2015-09-16 | 威科仪器有限公司 | 用于化学气相沉积的进气口元件及其制造方法 |
| GB0822985D0 (en) * | 2008-12-18 | 2009-01-28 | Eastman Kodak Co | Vapour deposited planar pv cell |
| US8102114B2 (en) * | 2009-02-27 | 2012-01-24 | Global Oled Technology, Llc. | Method of manufacturing an inverted bottom-emitting OLED device |
| US20100221426A1 (en) * | 2009-03-02 | 2010-09-02 | Fluens Corporation | Web Substrate Deposition System |
| US8657959B2 (en) * | 2009-07-31 | 2014-02-25 | E I Du Pont De Nemours And Company | Apparatus for atomic layer deposition on a moving substrate |
| US20110023775A1 (en) * | 2009-07-31 | 2011-02-03 | E.I. Du Pont De Nemours And Company | Apparatus for atomic layer deposition |
| US8900674B2 (en) * | 2009-10-06 | 2014-12-02 | Tel Solar Ag | Method of coating a substrate |
| US8637117B2 (en) | 2009-10-14 | 2014-01-28 | Lotus Applied Technology, Llc | Inhibiting excess precursor transport between separate precursor zones in an atomic layer deposition system |
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| US20110120544A1 (en) | 2009-11-20 | 2011-05-26 | Levy David H | Deposition inhibitor composition and method of use |
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| EP2360293A1 (en) | 2010-02-11 | 2011-08-24 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for depositing atomic layers on a substrate |
| US20110207301A1 (en) * | 2010-02-19 | 2011-08-25 | Kormanyos Kenneth R | Atmospheric pressure chemical vapor deposition with saturation control |
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| FI124414B (fi) | 2010-04-30 | 2014-08-29 | Beneq Oy | Lähde ja järjestely substraatin käsittelemiseksi |
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| EP2661776A2 (en) | 2011-01-07 | 2013-11-13 | Eastman Kodak Company | Transistor including multiple reentrant profiles |
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| US8847226B2 (en) | 2011-01-07 | 2014-09-30 | Eastman Kodak Company | Transistor including multiple reentrant profiles |
| US8409937B2 (en) | 2011-01-07 | 2013-04-02 | Eastman Kodak Company | Producing transistor including multi-layer reentrant profile |
| US8304347B2 (en) | 2011-01-07 | 2012-11-06 | Eastman Kodak Company | Actuating transistor including multiple reentrant profiles |
| US8383469B2 (en) | 2011-01-07 | 2013-02-26 | Eastman Kodak Company | Producing transistor including reduced channel length |
| US7985684B1 (en) | 2011-01-07 | 2011-07-26 | Eastman Kodak Company | Actuating transistor including reduced channel length |
| US8338291B2 (en) | 2011-01-07 | 2012-12-25 | Eastman Kodak Company | Producing transistor including multiple reentrant profiles |
| WO2012094109A1 (en) | 2011-01-07 | 2012-07-12 | Eastman Kodak Company | Transistor including reduced channel length |
| US20120222620A1 (en) | 2011-03-01 | 2012-09-06 | Applied Materials, Inc. | Atomic Layer Deposition Carousel with Continuous Rotation and Methods of Use |
| DE102011077833A1 (de) * | 2011-06-20 | 2012-12-20 | Gebr. Schmid Gmbh | Verfahren zur Bearbeitung von Substraten und Vorrichtung dazu |
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| US9000453B2 (en) | 2011-06-28 | 2015-04-07 | Osram Sylvania Inc. | Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same |
| EP2557198A1 (en) | 2011-08-10 | 2013-02-13 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for depositing atomic layers on a substrate |
| EP2743092A4 (en) * | 2011-08-10 | 2015-04-01 | Taiyo Chemical Industry Co Ltd | STRUCTURE WITH A PRIMER THIN FILM AND METHOD FOR THE PRODUCTION THEREOF |
| US8637355B2 (en) | 2011-08-26 | 2014-01-28 | Eastman Kodak Company | Actuating transistor including single layer reentrant profile |
| US8617942B2 (en) | 2011-08-26 | 2013-12-31 | Eastman Kodak Company | Producing transistor including single layer reentrant profile |
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- 2007-03-14 KR KR1020087023813A patent/KR20080109002A/ko not_active Ceased
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| US8697198B2 (en) | 2011-03-31 | 2014-04-15 | Veeco Ald Inc. | Magnetic field assisted deposition |
| KR101394820B1 (ko) * | 2011-03-31 | 2014-05-14 | 비코 에이엘디 인코포레이티드 | 자기장 보조 증착법 |
| US9412961B2 (en) | 2012-11-13 | 2016-08-09 | Samsung Display Co., Ltd. | Method of manufacturing organic light-emitting display apparatus |
| KR101503031B1 (ko) * | 2013-04-25 | 2015-03-18 | 한국화학연구원 | 아미노싸이올레이트를 이용한 납 전구체, 이의 제조방법, 및 이를 이용하여 박막을 형성하는 방법 |
| US9481929B2 (en) | 2013-09-10 | 2016-11-01 | Samsung Display Co., Ltd. | Vapor deposition apparatus, vapor deposition method and method of manufacturing organic light emitting display apparatus |
| KR101463105B1 (ko) * | 2014-01-02 | 2014-12-04 | 연세대학교 산학협력단 | 황화 텅스텐층 형성 방법 및 황화 텅스텐층 형성 장치 |
| US11320393B1 (en) | 2021-08-03 | 2022-05-03 | King Abdulaziz University | Gas sensor for detection of toxic gases |
Also Published As
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|---|---|
| TWI396768B (zh) | 2013-05-21 |
| WO2007126585A3 (en) | 2008-04-24 |
| EP1999295A2 (en) | 2008-12-10 |
| WO2007126585A2 (en) | 2007-11-08 |
| US7413982B2 (en) | 2008-08-19 |
| JP5149272B2 (ja) | 2013-02-20 |
| EP1999295B1 (en) | 2013-08-07 |
| CN101415860A (zh) | 2009-04-22 |
| JP2009531549A (ja) | 2009-09-03 |
| US20070238311A1 (en) | 2007-10-11 |
| TW200808997A (en) | 2008-02-16 |
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