KR20080055670A - 차폐케이스를 구비한 패키지 - Google Patents

차폐케이스를 구비한 패키지 Download PDF

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Publication number
KR20080055670A
KR20080055670A KR1020070129090A KR20070129090A KR20080055670A KR 20080055670 A KR20080055670 A KR 20080055670A KR 1020070129090 A KR1020070129090 A KR 1020070129090A KR 20070129090 A KR20070129090 A KR 20070129090A KR 20080055670 A KR20080055670 A KR 20080055670A
Authority
KR
South Korea
Prior art keywords
substrate
shielding case
package
electronic component
bent portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020070129090A
Other languages
English (en)
Korean (ko)
Inventor
유야 요시노
아키노부 이노우에
아츠노리 가지키
사다카즈 아카이케
노리오 야마니시
다카시 츠보타
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20080055670A publication Critical patent/KR20080055670A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B1/00—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020070129090A 2006-12-13 2007-12-12 차폐케이스를 구비한 패키지 Withdrawn KR20080055670A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00335958 2006-12-13
JP2006335958A JP4972391B2 (ja) 2006-12-13 2006-12-13 シールドケース付パッケージおよびシールドケース付パッケージの製造方法

Publications (1)

Publication Number Publication Date
KR20080055670A true KR20080055670A (ko) 2008-06-19

Family

ID=39517334

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070129090A Withdrawn KR20080055670A (ko) 2006-12-13 2007-12-12 차폐케이스를 구비한 패키지

Country Status (5)

Country Link
US (1) US7911042B2 (https=)
JP (1) JP4972391B2 (https=)
KR (1) KR20080055670A (https=)
CN (1) CN101202275A (https=)
TW (1) TW200828531A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101247719B1 (ko) * 2011-06-03 2013-03-26 에스티에스반도체통신 주식회사 전자파 차단형 반도체 패키지 장치 및 이의 제조방법
KR20140136743A (ko) * 2013-05-21 2014-12-01 삼성전기주식회사 고주파 모듈

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5391747B2 (ja) * 2009-03-10 2014-01-15 パナソニック株式会社 モジュール部品とモジュール部品の製造方法と、これを用いた電子機器
WO2010103756A1 (ja) * 2009-03-10 2010-09-16 パナソニック株式会社 モジュール部品とその製造方法と、およびそのモジュール部品を用いた電子機器
DE102009014435A1 (de) * 2009-03-26 2010-10-14 J. Eberspächer GmbH & Co. KG Abgasbehandlungseinrichtung
JP2011035058A (ja) * 2009-07-30 2011-02-17 Sharp Corp 高周波モジュールおよび高周波モジュールが実装されたプリント配線基板
JP2011171656A (ja) * 2010-02-22 2011-09-01 Renesas Electronics Corp 半導体パッケージおよびその製造方法
KR101711045B1 (ko) 2010-12-02 2017-03-02 삼성전자 주식회사 적층 패키지 구조물
DE112014007248T5 (de) * 2014-12-12 2017-08-31 Meiko Electronics Co., Ltd. Gekapseltes Schaltungsmodul und Herstellungsverfahren dafür
CN106028627A (zh) * 2016-07-26 2016-10-12 深圳天珑无线科技有限公司 一种电路板总成
US10388611B2 (en) * 2017-03-13 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming magnetic field shielding with ferromagnetic material
WO2018198856A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 回路モジュールおよびその製造方法
CN107278025B (zh) * 2017-08-09 2019-10-25 中国电子科技集团公司第二十九研究所 一种薄膜电路电磁屏蔽封装方法
CN107623160A (zh) * 2017-10-17 2018-01-23 上海馥莱电子有限公司 一种宽带隔离器
CN107864551B (zh) * 2017-10-31 2019-11-12 中国电子科技集团公司第二十九研究所 一种点预固定薄膜电路电磁屏蔽封装方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3085865B2 (ja) * 1994-11-08 2000-09-11 松下電器産業株式会社 回路ユニットのシールド装置
JPH10284935A (ja) 1997-04-09 1998-10-23 Murata Mfg Co Ltd 電圧制御発振器およびその製造方法
JPH10294585A (ja) * 1997-04-22 1998-11-04 Kokusai Electric Co Ltd プリント基板用シールドケース
JP2002534933A (ja) * 1999-01-07 2002-10-15 サーノフ コーポレイション プリント回路基板を有する大型ダイアフラムマイクロフォン素子を備えた補聴器
JP2001148594A (ja) * 1999-11-19 2001-05-29 Murata Mfg Co Ltd シールドケース付き電子部品
JP3793421B2 (ja) * 2001-04-10 2006-07-05 アルプス電気株式会社 面実装型電子回路ユニット及び面実装型電子回路ユニットの製造方法
JP2004128334A (ja) * 2002-10-04 2004-04-22 Hitachi Metals Ltd 高周波電子部品
JP4020795B2 (ja) * 2003-02-14 2007-12-12 三菱電機株式会社 半導体装置
JP2005101365A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 電子装置
JP2006252390A (ja) * 2005-03-14 2006-09-21 Renesas Technology Corp Ｉｃカードの製造方法およびｉｃカード

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101247719B1 (ko) * 2011-06-03 2013-03-26 에스티에스반도체통신 주식회사 전자파 차단형 반도체 패키지 장치 및 이의 제조방법
KR20140136743A (ko) * 2013-05-21 2014-12-01 삼성전기주식회사 고주파 모듈

Also Published As

Publication number Publication date
TW200828531A (en) 2008-07-01
CN101202275A (zh) 2008-06-18
JP4972391B2 (ja) 2012-07-11
US20080157296A1 (en) 2008-07-03
JP2008147572A (ja) 2008-06-26
US7911042B2 (en) 2011-03-22

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000