KR20080044332A - 도전성 접촉자 및 도전성 접촉자의 제조방법 - Google Patents
도전성 접촉자 및 도전성 접촉자의 제조방법 Download PDFInfo
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- KR20080044332A KR20080044332A KR1020087008358A KR20087008358A KR20080044332A KR 20080044332 A KR20080044332 A KR 20080044332A KR 1020087008358 A KR1020087008358 A KR 1020087008358A KR 20087008358 A KR20087008358 A KR 20087008358A KR 20080044332 A KR20080044332 A KR 20080044332A
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Classifications
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
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- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
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- G01R1/067—Measuring probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (11)
- 복수의 접속단자를 구비한 회로구조에 대하여, 상기 복수의 접속단자 중의 어느 하나와 물리적으로 접촉함으로써 전기적인 접속을 확립하는 도전성 접촉자에 있어서,상기 도전성 접촉자의 본체부의 길이방향에 수직한 단면의 형상이 이방성을 가지는 것을 특징으로 하는 도전성 접촉자.
- 제 1항에 있어서,상기 본체부의 길이방향에 수직한 단면은, 상기 단면을 통과함과 동시에 서로 직교하는 2개의 축의 각각에 대하여 대칭인 형상을 이루는 것을 특징으로 하는 도전성 접촉자.
- 제 1항에 있어서,상기 본체부에 적층되고, 상기 본체부와는 다른 재료로 이루어지는 적층부를더 구비한 것을 특징으로 하는 도전성 접촉자.
- 제 1항 내지 제 3항 중 어느 한 항에 있어서,상기 본체부의 길이방향의 중심 부근을 포함하는 영역으로서, 상기 본체부의 양쪽 끝부를 포함하지 않는 영역의 표면을 피복하는 절연층을 더 구비한 것을 특징 으로 하는 도전성 접촉자.
- 제 1항 내지 제 3항 중 어느 한 항에 있어서,상기 본체부는, 하나 또는 복수의 관통 구멍부가 설치되어 있는 것을 특징으로 하는 도전성 접촉자.
- 제 1항 내지 제 3항 중 어느 한 항에 있어서,상기 본체부의 길이방향의 끝부 중 적어도 한쪽의 끝부는 첨예화되어 있는 것을 특징으로 하는 도전성 접촉자.
- 제 1항 내지 제 3항 중 어느 한 항에 있어서,상기 본체부의 길이방향의 측면의 일부가 노치(notch)되어 이루어지는 잘록함부를 가지는 것을 특징으로 하는 도전성 접촉자.
- 제 7항에 있어서,상기 잘록함부는, 상기 본체부의 길이방향의 중심 부근에 설치된 것을 특징으로 하는 도전성 접촉자.
- 복수의 접속단자를 구비한 회로구조에 대하여, 상기 복수의 접속단자 중의 어느 하나와 물리적으로 접촉함으로써 전기적인 접속을 확립하는 도전성 접촉자를 제조하는 도전성 접촉자의 제조방법에 있어서,금속을 사용함으로써, 서로 동일한 형상을 이루는 복수의 도전성 접촉자의 본체부가 병진 대칭(Translation Symmetry)인 위치관계를 이루어 연결되는 본체부군(群)을 성형하는 성형공정과,상기 성형공정에서 성형한 본체부군이 구비하는 각 본체부의 길이방향의 중심 부근을 포함하는 영역으로서, 각 본체부의 양쪽 끝부를 포함하지 않는 영역의 표면에 절연층을 형성하는 절연층 형성공정을 가지고,상기 성형공정에서 성형된 상기 복수의 도전성 접촉자의 본체부의 각각은, 길이방향에 수직한 단면의 형상이 이방성을 가짐과 동시에, 상기 길이방향의 측면의 일부가 노치(notch)되어 이루어지는 잘록함부를 구비하고, 인접하는 상기 본체부의 잘록함부끼리가 연결되어 이루어지는 것을 특징으로 하는 도전성 접촉자의 제조방법.
- 제 9항에 있어서,서로 인접하는 상기 잘록함부를 연결하는 연결부의 길이방향에 수직한 단면의 면적은, 상기 잘록함부에서의 상기 본체부의 길이방향에 수직한 단면의 면적보다 작은 것을 특징으로 하는 도전성 접촉자의 제조방법.
- 제 10항에 있어서,상기 절연층 형성공정에서 절연층이 각각 형성된 복수의 도전성 접촉자에 대 하여 각 도전성 접촉자에 연결된 상기 연결부를 회전하여, 각 도전성 접촉자를 상기 본체부군으로부터 떼는 내는 떼어냄공정을 더 가지는 것을 특징으로 하는 도전성 접촉자의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005263036A JP4823617B2 (ja) | 2005-09-09 | 2005-09-09 | 導電性接触子および導電性接触子の製造方法 |
JPJP-P-2005-00263036 | 2005-09-09 |
Publications (2)
Publication Number | Publication Date |
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KR20080044332A true KR20080044332A (ko) | 2008-05-20 |
KR101012083B1 KR101012083B1 (ko) | 2011-02-07 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020087008358A KR101012083B1 (ko) | 2005-09-09 | 2006-09-07 | 도전성 접촉자 및 도전성 접촉자의 제조방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7956288B2 (ko) |
EP (1) | EP1923708A4 (ko) |
JP (1) | JP4823617B2 (ko) |
KR (1) | KR101012083B1 (ko) |
CN (1) | CN101258409B (ko) |
TW (1) | TWI315791B (ko) |
WO (1) | WO2007029791A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102265359B1 (ko) * | 2021-01-26 | 2021-06-15 | 주식회사 메디션 | 도전성 박막을 이용한 프로브 핀 및 이를 포함하는 테스트 소켓 |
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JP2009014480A (ja) * | 2007-07-04 | 2009-01-22 | Koyo Technos:Kk | 検査冶具 |
EP2060921A1 (en) * | 2007-11-16 | 2009-05-20 | Technoprobe S.p.A | Contact probe for testing head having vertical probes and related testing head for testing microstructure electric performance |
DE102008023761B9 (de) * | 2008-05-09 | 2012-11-08 | Feinmetall Gmbh | Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung |
DE102010048189B4 (de) * | 2010-10-13 | 2012-11-15 | Heraeus Materials Technology Gmbh & Co. Kg | Edelmetallhaltiges Kontaktstück auf einem Federträger mit rotationssymmetrischem Biegemoment |
JP2014071069A (ja) * | 2012-10-01 | 2014-04-21 | Japan Electronic Materials Corp | 垂直型プローブ |
WO2014087906A1 (ja) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
TWI472772B (zh) * | 2013-01-11 | 2015-02-11 | Mpi Corp | 探針、探針卡與製作探針的方法 |
DE102013011968A1 (de) * | 2013-07-18 | 2015-02-19 | Feinmetall Gmbh | Elektrische Prüfeinrichtung für eine elektrische Berührungskontaktierung eines elektrischen Prüflings |
JP6305754B2 (ja) * | 2013-12-20 | 2018-04-04 | 東京特殊電線株式会社 | コンタクトプローブユニット |
JP1529613S (ko) * | 2014-12-19 | 2015-07-27 | ||
JP6832661B2 (ja) * | 2016-09-28 | 2021-02-24 | 株式会社日本マイクロニクス | プローブカード及び接触検査装置 |
JP6813461B2 (ja) * | 2017-09-19 | 2021-01-13 | タツタ電線株式会社 | シートセンサ |
TWI783074B (zh) * | 2017-11-09 | 2022-11-11 | 義大利商探針科技公司 | 用於測試高頻裝置的測試頭的接觸探針 |
TWI626454B (zh) * | 2017-11-20 | 2018-06-11 | Probe device and method of manufacturing same | |
JP7254450B2 (ja) * | 2018-05-16 | 2023-04-10 | 日本電産リード株式会社 | プローブ、検査治具、検査装置、及びプローブの製造方法 |
KR20210032472A (ko) * | 2018-07-18 | 2021-03-24 | 니혼덴산리드가부시키가이샤 | 프로브, 검사 지그, 검사 장치, 및 프로브의 제조 방법 |
US11973301B2 (en) | 2018-09-26 | 2024-04-30 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
US12000865B2 (en) | 2019-02-14 | 2024-06-04 | Microfabrica Inc. | Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes |
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US11867721B1 (en) | 2019-12-31 | 2024-01-09 | Microfabrica Inc. | Probes with multiple springs, methods for making, and methods for using |
US11761982B1 (en) | 2019-12-31 | 2023-09-19 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact and methods for making such probes |
TWI712802B (zh) * | 2020-01-21 | 2020-12-11 | 中華精測科技股份有限公司 | 探針卡裝置及其類頸式探針 |
TWI728665B (zh) * | 2020-01-21 | 2021-05-21 | 中華精測科技股份有限公司 | 具有指向性探針的探針卡裝置 |
US11774467B1 (en) | 2020-09-01 | 2023-10-03 | Microfabrica Inc. | Method of in situ modulation of structural material properties and/or template shape |
JP7485945B2 (ja) | 2020-09-08 | 2024-05-17 | 山一電機株式会社 | 検査用ケルビンコンタクト及び検査用ケルビンソケット並びに検査用ケルビンコンタクトの製造方法 |
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JPH06230033A (ja) * | 1993-02-04 | 1994-08-19 | Toho Denshi Kk | プローブ基板 |
US6029344A (en) * | 1993-11-16 | 2000-02-29 | Formfactor, Inc. | Composite interconnection element for microelectronic components, and method of making same |
EP0915344B1 (de) | 1997-11-05 | 2004-02-25 | Feinmetall GmbH | Prüfkopf für Mikrostrukturen mit Schnittstelle |
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US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
JP2001050982A (ja) | 1999-08-09 | 2001-02-23 | Ii S J:Kk | 垂直型プローブカードおよびその製造方法 |
JP4434371B2 (ja) * | 1999-08-31 | 2010-03-17 | 株式会社日本マイクロニクス | プローブユニット及びプローブカード |
FR2802346B1 (fr) * | 1999-12-13 | 2002-02-08 | Upsys Probe Technology Sas | Connecteur de test de haute densite d'interconnexion destine notamment a la verification de circuits integres |
JP2001337109A (ja) | 2000-05-26 | 2001-12-07 | Hioki Ee Corp | コンタクトプローブ |
JP2001356135A (ja) * | 2000-06-13 | 2001-12-26 | Sumitomo Electric Ind Ltd | プローブヘッドおよびその製造方法 |
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JP2003215161A (ja) | 2002-01-22 | 2003-07-30 | Tokyo Electron Ltd | プローブ、プローブの製造方法、プローブの取付方法、プローブの取付装置及びプローブカード |
US6945827B2 (en) * | 2002-12-23 | 2005-09-20 | Formfactor, Inc. | Microelectronic contact structure |
JP2004239667A (ja) * | 2003-02-04 | 2004-08-26 | Connect Japan Kk | ワイヤープローブユニット |
USD510043S1 (en) * | 2003-06-11 | 2005-09-27 | K&S Interconnect, Inc. | Continuously profiled probe beam |
JP2005055343A (ja) | 2003-08-06 | 2005-03-03 | Tokyo Cathode Laboratory Co Ltd | フラットパネルディスプレイ検査用プローブ装置 |
DE60312692T2 (de) * | 2003-10-13 | 2007-12-06 | Technoprobe S.P.A, Cernusco Lombardone | Prüfkopf mit vertikalen Prüfnadeln für integrierte Halbleitergeräte |
JP2005172509A (ja) * | 2003-12-09 | 2005-06-30 | Jsr Corp | シート状プローブおよびその製造方法並びにその応用 |
US7476800B2 (en) * | 2005-06-01 | 2009-01-13 | Outokumpu Copper Neumayer Gmbh | Electric connection element |
-
2005
- 2005-09-09 JP JP2005263036A patent/JP4823617B2/ja active Active
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2006
- 2006-09-07 EP EP06797646A patent/EP1923708A4/en not_active Withdrawn
- 2006-09-07 WO PCT/JP2006/317789 patent/WO2007029791A1/ja active Application Filing
- 2006-09-07 US US11/991,560 patent/US7956288B2/en active Active
- 2006-09-07 KR KR1020087008358A patent/KR101012083B1/ko active IP Right Grant
- 2006-09-07 CN CN2006800328537A patent/CN101258409B/zh not_active Expired - Fee Related
- 2006-09-08 TW TW095133225A patent/TWI315791B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102265359B1 (ko) * | 2021-01-26 | 2021-06-15 | 주식회사 메디션 | 도전성 박막을 이용한 프로브 핀 및 이를 포함하는 테스트 소켓 |
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TW200716988A (en) | 2007-05-01 |
US20090183898A1 (en) | 2009-07-23 |
US7956288B2 (en) | 2011-06-07 |
TWI315791B (en) | 2009-10-11 |
JP2007078371A (ja) | 2007-03-29 |
EP1923708A1 (en) | 2008-05-21 |
JP4823617B2 (ja) | 2011-11-24 |
KR101012083B1 (ko) | 2011-02-07 |
WO2007029791A1 (ja) | 2007-03-15 |
EP1923708A4 (en) | 2012-05-09 |
CN101258409B (zh) | 2012-10-10 |
CN101258409A (zh) | 2008-09-03 |
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