KR20070028611A - 접촉 하중 측정 장치 및 검사 장치 - Google Patents

접촉 하중 측정 장치 및 검사 장치 Download PDF

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Publication number
KR20070028611A
KR20070028611A KR1020077002635A KR20077002635A KR20070028611A KR 20070028611 A KR20070028611 A KR 20070028611A KR 1020077002635 A KR1020077002635 A KR 1020077002635A KR 20077002635 A KR20077002635 A KR 20077002635A KR 20070028611 A KR20070028611 A KR 20070028611A
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KR
South Korea
Prior art keywords
load
probe
contact load
mounting table
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020077002635A
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English (en)
Korean (ko)
Inventor
이사무 이노마타
Original Assignee
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동경 엘렉트론 주식회사 filed Critical 동경 엘렉트론 주식회사
Publication of KR20070028611A publication Critical patent/KR20070028611A/ko
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
KR1020077002635A 2004-08-02 2005-07-28 접촉 하중 측정 장치 및 검사 장치 Ceased KR20070028611A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004226149A JP4809594B2 (ja) 2004-08-02 2004-08-02 検査装置
JPJP-P-2004-00226149 2004-08-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020087017213A Division KR20080081041A (ko) 2004-08-02 2005-07-28 접촉 하중 측정 장치 및 검사 장치

Publications (1)

Publication Number Publication Date
KR20070028611A true KR20070028611A (ko) 2007-03-12

Family

ID=35787061

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020077002635A Ceased KR20070028611A (ko) 2004-08-02 2005-07-28 접촉 하중 측정 장치 및 검사 장치
KR1020087017213A Ceased KR20080081041A (ko) 2004-08-02 2005-07-28 접촉 하중 측정 장치 및 검사 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020087017213A Ceased KR20080081041A (ko) 2004-08-02 2005-07-28 접촉 하중 측정 장치 및 검사 장치

Country Status (5)

Country Link
US (1) US7688096B2 (https=)
JP (1) JP4809594B2 (https=)
KR (2) KR20070028611A (https=)
TW (1) TWI394955B (https=)
WO (1) WO2006013773A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009066852A1 (en) * 2007-11-22 2009-05-28 Semics Inc. Method and apparatus for controlling position of z-axis for wafer prober
KR100901982B1 (ko) * 2007-07-12 2009-06-08 주식회사 실트론 접착강도 시험장치
KR20130141631A (ko) * 2011-01-13 2013-12-26 도쿄엘렉트론가부시키가이샤 프로브 카드의 열적 안정화 방법 및 검사 장치

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK2302070T3 (da) 2005-06-23 2012-11-26 Keygene Nv Strategier til identifikation og detektion af polymorfismer med højt gennemløb
WO2007037678A2 (en) 2005-09-29 2007-04-05 Keygene N.V. High throughput screening of mutagenized populations
CN103937899B (zh) 2005-12-22 2017-09-08 凯津公司 用于基于aflp的高通量多态性检测的方法
TWI490513B (zh) * 2006-12-29 2015-07-01 Intest Corp 用於使負載沿平移軸線平移之負載定位系統以及使負載達到平衡之方法
WO2008085463A1 (en) * 2006-12-29 2008-07-17 In Test Corporation Test head positioning system and method
JP4605232B2 (ja) * 2008-02-21 2011-01-05 株式会社デンソー 荷重センサ及びその製造方法
JP4577585B2 (ja) * 2008-03-22 2010-11-10 株式会社デンソー 荷重センサの製造方法
US8519728B2 (en) * 2008-12-12 2013-08-27 Formfactor, Inc. Compliance control methods and apparatuses
JP5083339B2 (ja) * 2010-02-04 2012-11-28 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法並びに記憶媒体
US8963567B2 (en) 2011-10-31 2015-02-24 International Business Machines Corporation Pressure sensing and control for semiconductor wafer probing
US8901947B2 (en) 2012-09-28 2014-12-02 Electro Scientific Industries, Inc. Probe out-of-position sensing for automated test equipment
JP6137994B2 (ja) * 2013-08-28 2017-05-31 東京エレクトロン株式会社 デバイス検査方法
CN103745943B (zh) * 2014-01-29 2016-05-25 上海华力微电子有限公司 表面颗粒检测仪量测平台
KR101975386B1 (ko) 2018-01-08 2019-09-10 주식회사 한화 관성 이동체를 구비한 제품용 검사 장치 및 이를 이용한 관성 이동체를 구비한 제품의 검사 방법
JP7374682B2 (ja) * 2019-09-17 2023-11-07 株式会社国際電気セミコンダクターサービス 抵抗率測定器、半導体装置の製造方法および抵抗率測定方法
CN113624605B (zh) * 2021-08-16 2024-06-11 陕西大工旭航电磁科技有限公司 基于电磁力加载的中应变率实验装置
CN121430880A (zh) * 2024-07-30 2026-01-30 合肥京东方星宇科技有限公司 测试装置及电子元件的转移设备
CN119043561A (zh) * 2024-09-26 2024-11-29 宸光(常州)新材料科技有限公司 水压检测装置及检测方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328148B2 (ja) * 1996-11-15 2002-09-24 株式会社東京精密 プロービング方法およびプローバ
JP4009801B2 (ja) * 1998-11-09 2007-11-21 日本精工株式会社 転がり軸受の予圧量測定装置
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
US6650135B1 (en) * 2000-06-29 2003-11-18 Motorola, Inc. Measurement chuck having piezoelectric elements and method
JP2001358204A (ja) * 2000-06-15 2001-12-26 Tokyo Electron Ltd 検査ステージ
JP4782953B2 (ja) 2001-08-06 2011-09-28 東京エレクトロン株式会社 プローブカード特性測定装置、プローブ装置及びプローブ方法
JP4827339B2 (ja) * 2001-08-29 2011-11-30 帝国ピストンリング株式会社 摩擦力測定装置
JP2003168707A (ja) * 2001-11-30 2003-06-13 Tokyo Electron Ltd プローブ装置
JP2003185704A (ja) * 2001-12-17 2003-07-03 Seiko Epson Corp 電極検査装置
JP4357813B2 (ja) * 2002-08-23 2009-11-04 東京エレクトロン株式会社 プローブ装置及びプローブ方法
US7068056B1 (en) * 2005-07-18 2006-06-27 Texas Instruments Incorporated System and method for the probing of a wafer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100901982B1 (ko) * 2007-07-12 2009-06-08 주식회사 실트론 접착강도 시험장치
WO2009066852A1 (en) * 2007-11-22 2009-05-28 Semics Inc. Method and apparatus for controlling position of z-axis for wafer prober
KR100936631B1 (ko) * 2007-11-22 2010-01-14 주식회사 쎄믹스 웨이퍼 프로버의 ｚ축 위치 제어 장치 및 방법
US8368414B2 (en) 2007-11-22 2013-02-05 Semics Inc. Method and apparatus for controlling position of Z-axis for wafer prober
KR20130141631A (ko) * 2011-01-13 2013-12-26 도쿄엘렉트론가부시키가이샤 프로브 카드의 열적 안정화 방법 및 검사 장치

Also Published As

Publication number Publication date
KR20080081041A (ko) 2008-09-05
US7688096B2 (en) 2010-03-30
JP4809594B2 (ja) 2011-11-09
TWI394955B (zh) 2013-05-01
JP2006047025A (ja) 2006-02-16
US20090039903A1 (en) 2009-02-12
TW200606439A (en) 2006-02-16
WO2006013773A1 (ja) 2006-02-09

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