KR20060033919A - 포지티브형 감광성 수지 조성물 - Google Patents
포지티브형 감광성 수지 조성물 Download PDFInfo
- Publication number
- KR20060033919A KR20060033919A KR1020067001993A KR20067001993A KR20060033919A KR 20060033919 A KR20060033919 A KR 20060033919A KR 1020067001993 A KR1020067001993 A KR 1020067001993A KR 20067001993 A KR20067001993 A KR 20067001993A KR 20060033919 A KR20060033919 A KR 20060033919A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- photosensitive resin
- resin composition
- formula
- relief pattern
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
Claims (4)
- 하기 화학식 1로 표시되는 반복 단위를 갖는 히드록시폴리아미드 100 질량부, 하기 화학식 2로 표시되는 페놀 화합물 1 내지 30 질량부 및 감광성 디아조퀴논 화합물 1 내지 100 질량부를 포함하여 이루어지는 포지티브형 감광성 수지 조성물.<화학식 1>(식 중, X1은 2개 이상의 탄소 원자를 갖는 4가 유기기이고, X2, Y1 및 Y2는 2개 이상의 탄소 원자를 갖는 2가 유기기이며, m은 2 내지 1000의 정수, n은 0 내지 500의 정수이며, m/(m+n)>0.5이되, X1 및 Y1을 포함하는 m개의 디히드록시디아미드 단위, 및 X2 및 Y2를 포함하는 n개의 디아미드 단위의 배열 순서는 상관없다.)<화학식 2>(식 중, R1은 수소 원자, 알킬기, 할로겐 원자, 수산기, 알콕실기, 알킬카르보닐기, 알킬카르보닐옥시기 및 우레아기로 이루어지는 군으로부터 선택되는 기 또 는 원자를 나타내고, R1이 복수개 있는 경우에는 각각 상이할 수도 있으며, a는 0 내지 5의 정수이다.)
- 1) 제1항 또는 제2항에 기재된 포지티브형 감광성 수지 조성물을 층 또는 필름의 형태로 기판 상에 형성하고,2) 마스크를 통해 화학선으로 노광하거나, 광선, 전자선 또는 이온선을 직접 조사하고,3) 노광부 또는 조사부를 용출 또는 제거하고,4) 얻어진 릴리프 패턴을 가열 처리하는 것을 포함하는,경화 릴리프 패턴의 제조 방법.
- 제3항에 기재된 제조 방법에 의해 얻어지는 경화 릴리프 패턴층을 갖는 반도체 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2003-00282213 | 2003-07-29 | ||
JP2003282213A JP4128116B2 (ja) | 2003-07-29 | 2003-07-29 | ポジ型感光性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060033919A true KR20060033919A (ko) | 2006-04-20 |
KR100676360B1 KR100676360B1 (ko) | 2007-02-01 |
Family
ID=34101002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20067001993A KR100676360B1 (ko) | 2003-07-29 | 2004-07-29 | 포지티브형 감광성 수지 조성물 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4128116B2 (ko) |
KR (1) | KR100676360B1 (ko) |
CN (1) | CN100549828C (ko) |
WO (1) | WO2005010616A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014104491A1 (ko) * | 2012-12-26 | 2014-07-03 | 제일모직 주식회사 | 표시장치 절연막용 감광성 수지 조성물, 및 이를 이용한 표시장치 절연막 및 표시장치 |
US9040213B2 (en) | 2011-12-23 | 2015-05-26 | Cheil Industries Inc. | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007049524A1 (ja) | 2005-10-26 | 2007-05-03 | Asahi Kasei Emd Corporation | ポジ型感光性樹脂組成物 |
JP4804329B2 (ja) * | 2005-12-22 | 2011-11-02 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
JP4918312B2 (ja) * | 2006-09-01 | 2012-04-18 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
US20100119969A1 (en) * | 2007-06-05 | 2010-05-13 | Nissan Chemical Industries Ltd. | Positive photosensitive resin composition and dpolyhydroxyamide resin |
TWI459141B (zh) * | 2008-10-20 | 2014-11-01 | Cheil Ind Inc | 正型光敏性樹脂組成物 |
KR101333698B1 (ko) * | 2009-11-10 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
EP2520977B1 (en) * | 2009-12-28 | 2017-11-22 | Toray Industries, Inc. | Positive-type photosensitive resin composition |
JP6086115B2 (ja) * | 2012-03-28 | 2017-03-01 | 日産化学工業株式会社 | 硬化膜形成組成物、配向材および位相差材 |
CN104402751B (zh) * | 2014-10-17 | 2016-07-06 | 威海经济技术开发区天成化工有限公司 | 含酰胺酚类化合物或其低聚物的感光成像组合物 |
KR102337564B1 (ko) * | 2018-09-28 | 2021-12-13 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 전자 소자 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2931297A1 (de) * | 1979-08-01 | 1981-02-19 | Siemens Ag | Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen |
EP0291779B1 (de) * | 1987-05-18 | 1994-07-27 | Siemens Aktiengesellschaft | Wärmebeständige Positivresists und Verfahren zur Herstellung wärmebeständiger Reliefstrukturen |
JPH0213953A (ja) * | 1988-07-01 | 1990-01-18 | Mitsubishi Kasei Corp | ポジ型フォトレジスト組成物 |
DE59010552D1 (de) * | 1990-03-29 | 1996-12-05 | Siemens Ag | Hochwärmebeständige Negativresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen |
JPH09281702A (ja) * | 1996-04-16 | 1997-10-31 | Nippon Zeon Co Ltd | ポジ型レジスト組成物 |
JP3207352B2 (ja) * | 1996-05-13 | 2001-09-10 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物 |
JPH1138625A (ja) * | 1997-07-16 | 1999-02-12 | Hitachi Chem Co Ltd | ポジ型化学増幅系感光性樹脂組成物及びレジスト像の製造法 |
WO1999054787A1 (fr) * | 1998-04-15 | 1999-10-28 | Asahi Kasei Kogyo Kabushiki Kaisha | Composition de resine photosensible positive |
JP4314335B2 (ja) * | 1999-04-02 | 2009-08-12 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
JP4408984B2 (ja) * | 1999-04-21 | 2010-02-03 | 旭化成イーマテリアルズ株式会社 | 芳香族ポリヒドロキシアミド |
JP3460679B2 (ja) * | 1999-12-17 | 2003-10-27 | 東レ株式会社 | ポジ型感光性樹脂前駆体組成物 |
JP3636059B2 (ja) * | 2000-10-19 | 2005-04-06 | 東レ株式会社 | ポジ型感光性樹脂前駆体組成物 |
-
2003
- 2003-07-29 JP JP2003282213A patent/JP4128116B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-29 KR KR20067001993A patent/KR100676360B1/ko active IP Right Grant
- 2004-07-29 WO PCT/JP2004/011198 patent/WO2005010616A1/ja active Application Filing
- 2004-07-29 CN CNB2004800174046A patent/CN100549828C/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9040213B2 (en) | 2011-12-23 | 2015-05-26 | Cheil Industries Inc. | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film |
WO2014104491A1 (ko) * | 2012-12-26 | 2014-07-03 | 제일모직 주식회사 | 표시장치 절연막용 감광성 수지 조성물, 및 이를 이용한 표시장치 절연막 및 표시장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2005049661A (ja) | 2005-02-24 |
KR100676360B1 (ko) | 2007-02-01 |
JP4128116B2 (ja) | 2008-07-30 |
WO2005010616A1 (ja) | 2005-02-03 |
CN100549828C (zh) | 2009-10-14 |
CN1820228A (zh) | 2006-08-16 |
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