JP4128116B2 - ポジ型感光性樹脂組成物 - Google Patents

ポジ型感光性樹脂組成物 Download PDF

Info

Publication number
JP4128116B2
JP4128116B2 JP2003282213A JP2003282213A JP4128116B2 JP 4128116 B2 JP4128116 B2 JP 4128116B2 JP 2003282213 A JP2003282213 A JP 2003282213A JP 2003282213 A JP2003282213 A JP 2003282213A JP 4128116 B2 JP4128116 B2 JP 4128116B2
Authority
JP
Japan
Prior art keywords
photosensitive resin
group
resin composition
positive photosensitive
relief pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003282213A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005049661A (ja
Inventor
隆弘 佐々木
英之 藤山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei EMD Corp filed Critical Asahi Kasei EMD Corp
Priority to JP2003282213A priority Critical patent/JP4128116B2/ja
Priority to CNB2004800174046A priority patent/CN100549828C/zh
Priority to PCT/JP2004/011198 priority patent/WO2005010616A1/ja
Priority to KR20067001993A priority patent/KR100676360B1/ko
Publication of JP2005049661A publication Critical patent/JP2005049661A/ja
Application granted granted Critical
Publication of JP4128116B2 publication Critical patent/JP4128116B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2003282213A 2003-07-29 2003-07-29 ポジ型感光性樹脂組成物 Expired - Lifetime JP4128116B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003282213A JP4128116B2 (ja) 2003-07-29 2003-07-29 ポジ型感光性樹脂組成物
CNB2004800174046A CN100549828C (zh) 2003-07-29 2004-07-29 正型感光性树脂组合物
PCT/JP2004/011198 WO2005010616A1 (ja) 2003-07-29 2004-07-29 ポジ型感光性樹脂組成物
KR20067001993A KR100676360B1 (ko) 2003-07-29 2004-07-29 포지티브형 감광성 수지 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003282213A JP4128116B2 (ja) 2003-07-29 2003-07-29 ポジ型感光性樹脂組成物

Publications (2)

Publication Number Publication Date
JP2005049661A JP2005049661A (ja) 2005-02-24
JP4128116B2 true JP4128116B2 (ja) 2008-07-30

Family

ID=34101002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003282213A Expired - Lifetime JP4128116B2 (ja) 2003-07-29 2003-07-29 ポジ型感光性樹脂組成物

Country Status (4)

Country Link
JP (1) JP4128116B2 (ko)
KR (1) KR100676360B1 (ko)
CN (1) CN100549828C (ko)
WO (1) WO2005010616A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007049524A1 (ja) 2005-10-26 2007-05-03 Asahi Kasei Emd Corporation ポジ型感光性樹脂組成物
JP4804329B2 (ja) * 2005-12-22 2011-11-02 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
JP4918312B2 (ja) * 2006-09-01 2012-04-18 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
US20100119969A1 (en) * 2007-06-05 2010-05-13 Nissan Chemical Industries Ltd. Positive photosensitive resin composition and dpolyhydroxyamide resin
TWI459141B (zh) * 2008-10-20 2014-11-01 Cheil Ind Inc 正型光敏性樹脂組成物
KR101333698B1 (ko) * 2009-11-10 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
EP2520977B1 (en) * 2009-12-28 2017-11-22 Toray Industries, Inc. Positive-type photosensitive resin composition
KR101413076B1 (ko) 2011-12-23 2014-06-30 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
JP6086115B2 (ja) * 2012-03-28 2017-03-01 日産化学工業株式会社 硬化膜形成組成物、配向材および位相差材
KR20140083693A (ko) * 2012-12-26 2014-07-04 제일모직주식회사 표시장치 절연막용 감광성 수지 조성물, 및 이를 이용한 표시장치 절연막 및 표시장치
CN104402751B (zh) * 2014-10-17 2016-07-06 威海经济技术开发区天成化工有限公司 含酰胺酚类化合物或其低聚物的感光成像组合物
KR102337564B1 (ko) * 2018-09-28 2021-12-13 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 전자 소자

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2931297A1 (de) * 1979-08-01 1981-02-19 Siemens Ag Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen
EP0291779B1 (de) * 1987-05-18 1994-07-27 Siemens Aktiengesellschaft Wärmebeständige Positivresists und Verfahren zur Herstellung wärmebeständiger Reliefstrukturen
JPH0213953A (ja) * 1988-07-01 1990-01-18 Mitsubishi Kasei Corp ポジ型フォトレジスト組成物
DE59010552D1 (de) * 1990-03-29 1996-12-05 Siemens Ag Hochwärmebeständige Negativresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen
JPH09281702A (ja) * 1996-04-16 1997-10-31 Nippon Zeon Co Ltd ポジ型レジスト組成物
JP3207352B2 (ja) * 1996-05-13 2001-09-10 住友ベークライト株式会社 ポジ型感光性樹脂組成物
JPH1138625A (ja) * 1997-07-16 1999-02-12 Hitachi Chem Co Ltd ポジ型化学増幅系感光性樹脂組成物及びレジスト像の製造法
WO1999054787A1 (fr) * 1998-04-15 1999-10-28 Asahi Kasei Kogyo Kabushiki Kaisha Composition de resine photosensible positive
JP4314335B2 (ja) * 1999-04-02 2009-08-12 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
JP4408984B2 (ja) * 1999-04-21 2010-02-03 旭化成イーマテリアルズ株式会社 芳香族ポリヒドロキシアミド
JP3460679B2 (ja) * 1999-12-17 2003-10-27 東レ株式会社 ポジ型感光性樹脂前駆体組成物
JP3636059B2 (ja) * 2000-10-19 2005-04-06 東レ株式会社 ポジ型感光性樹脂前駆体組成物

Also Published As

Publication number Publication date
JP2005049661A (ja) 2005-02-24
KR100676360B1 (ko) 2007-02-01
WO2005010616A1 (ja) 2005-02-03
CN100549828C (zh) 2009-10-14
CN1820228A (zh) 2006-08-16
KR20060033919A (ko) 2006-04-20

Similar Documents

Publication Publication Date Title
JP4925732B2 (ja) ポジ型感光性樹脂組成物
JP5185999B2 (ja) 感光性樹脂組成物
JP4128116B2 (ja) ポジ型感光性樹脂組成物
JP5120539B2 (ja) 耐熱性樹脂組成物
JP4804312B2 (ja) ポジ型感光性樹脂組成物
JP4027076B2 (ja) ポジ型感光性樹脂組成物
JP5486201B2 (ja) 感光性樹脂組成物
JP4518627B2 (ja) ヒドロキシポリアミド
JP2005338481A (ja) ポジ型感光性樹脂組成物
JP4558976B2 (ja) ポジ型感光性樹脂組成物
JP4627030B2 (ja) ポジ型感光性樹脂組成物
JP5514336B2 (ja) 耐熱性樹脂組成物
JP4726730B2 (ja) ポジ型感光性樹脂組成物
JP4969333B2 (ja) ポジ型感光性樹脂組成物
JP5139886B2 (ja) 感光性樹脂組成物
JP4488611B2 (ja) ポジ型感光性樹脂組成物
JP5167352B2 (ja) 感光性樹脂組成物
JP2001092138A (ja) ポジ型感光性樹脂組成物
JP4836607B2 (ja) ポジ型感光性樹脂組成物
JP4578369B2 (ja) ポジ型感光性樹脂組成物
JP2011100097A (ja) 感光性樹脂組成物、硬化レリーフパターン及び半導体装置
JP5241142B2 (ja) ポジ型感光性樹脂組成物
JP5213518B2 (ja) 耐熱性樹脂組成物
JP2004347902A (ja) ポジ型感光性樹脂組成物
JP4744318B2 (ja) ポジ型感光性樹脂組成物

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060707

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080404

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080507

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080513

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4128116

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120523

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120523

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130523

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130523

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140523

Year of fee payment: 6

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term