KR20050021485A - 실리콘계 접착 시트, 반도체 칩을 칩 결합 부재에결합시키는 방법 및 반도체 장치 - Google Patents

실리콘계 접착 시트, 반도체 칩을 칩 결합 부재에결합시키는 방법 및 반도체 장치 Download PDF

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KR20050021485A
KR20050021485A KR10-2005-7000776A KR20057000776A KR20050021485A KR 20050021485 A KR20050021485 A KR 20050021485A KR 20057000776 A KR20057000776 A KR 20057000776A KR 20050021485 A KR20050021485 A KR 20050021485A
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South Korea
Prior art keywords
layer
composition
clay
curable silicone
silicone composition
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KR10-2005-7000776A
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English (en)
Korean (ko)
Inventor
스토마나부
우시오요시토
후지사와도요히코
미네가쓰토시
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다우 코닝 도레이 실리콘 캄파니 리미티드
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Publication of KR20050021485A publication Critical patent/KR20050021485A/ko
Withdrawn legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
KR10-2005-7000776A 2002-07-15 2003-07-14 실리콘계 접착 시트, 반도체 칩을 칩 결합 부재에결합시키는 방법 및 반도체 장치 Withdrawn KR20050021485A (ko)

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PCT/JP2003/008936 WO2004007628A1 (en) 2002-07-15 2003-07-14 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

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US11384268B2 (en) 2017-06-26 2022-07-12 Dupont Toray Specialty Materials Kabushiki Kaisha Curable silicone composition for die bonding use

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