JP2004043814A - シリコーン系接着性シート、半導体チップと該チップ取付部の接着方法、および半導体装置 - Google Patents

シリコーン系接着性シート、半導体チップと該チップ取付部の接着方法、および半導体装置 Download PDF

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Publication number
JP2004043814A
JP2004043814A JP2003272095A JP2003272095A JP2004043814A JP 2004043814 A JP2004043814 A JP 2004043814A JP 2003272095 A JP2003272095 A JP 2003272095A JP 2003272095 A JP2003272095 A JP 2003272095A JP 2004043814 A JP2004043814 A JP 2004043814A
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composition
layer
clay
curable silicone
silicone
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JP2003272095A
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Japanese (ja)
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JP2004043814A5 (enExample
Inventor
Manabu Sudo
須藤　学
Yoshito Ushio
潮　嘉人
Toyohiko Fujisawa
藤澤　豊彦
Katsutoshi Mine
峰　勝利
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Silicone Co Ltd
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Priority to JP2003272095A priority Critical patent/JP2004043814A/ja
Publication of JP2004043814A publication Critical patent/JP2004043814A/ja
Publication of JP2004043814A5 publication Critical patent/JP2004043814A5/ja
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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JP2005183855A (ja) * 2003-12-24 2005-07-07 Dow Corning Toray Silicone Co Ltd ダイシングダイボンディング用シート及びその製造方法
JP2006005159A (ja) * 2004-06-17 2006-01-05 Shin Etsu Chem Co Ltd ダイシング・ダイボンド用接着テープ
US7651887B2 (en) 2004-09-22 2010-01-26 Dow Corning Toray Company, Ltd. Optical semiconductor device and method of manufacturing thereof
JP2010205493A (ja) * 2009-03-02 2010-09-16 Honda Motor Co Ltd 燃料電池用接着剤及びこれを用いた膜電極構造体
US7915439B2 (en) 2004-10-13 2011-03-29 Dow Corning Toray Company, Ltd. Method of producing silylalkoxymethyl halide
US8093331B2 (en) 2005-03-30 2012-01-10 Dow Corning Toray Company, Ltd. Thermally conductive silicone rubber composition
US8093333B2 (en) 2005-03-29 2012-01-10 Dow Corning Toray Company, Ltd. Hot-melt silicone adhesive
US8138254B2 (en) 2005-03-30 2012-03-20 Dow Corning Toray Company, Ltd. Thermally conductive silicone rubber composition
US8273815B2 (en) 2006-09-11 2012-09-25 Dow Corning Toray Company, Ltd. Curable silicone composition and electronic component
US8309652B2 (en) 2005-04-27 2012-11-13 Dow Corning Toray Company, Ltd. Curable silicone composition and cured product therefrom
US8338527B2 (en) 2005-04-27 2012-12-25 Dow Corning Toray Company, Ltd. Curable silicone composition and electronic components
JP2017050322A (ja) * 2015-08-31 2017-03-09 Jsr株式会社 基材の処理方法、半導体装置およびその製造方法
WO2019003995A1 (ja) * 2017-06-26 2019-01-03 東レ・ダウコーニング株式会社 ダイボンディング用硬化性シリコーン組成物
US12134697B2 (en) 2019-12-27 2024-11-05 Dow Toray Co., Ltd. Curable hot-melt silicone composition, cured material thereof, and laminate containing curable hot-melt silicone composition or cured material thereof
US12173202B2 (en) 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Curable silicone composition, cured product thereof, and method for producing same
US12172357B2 (en) 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Method for producing curable silicone sheet having hot melt properties
US12173157B2 (en) 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Curable silicone composition, cured product thereof, and method for producing same
US12215226B2 (en) 2018-10-30 2025-02-04 Dow Toray Co., Ltd. Curable reactive silicone composition, cured product thereof and uses of composition and cured product
US12258496B2 (en) 2019-03-29 2025-03-25 Dow Toray Co., Ltd. Curable silicone composition, cured product of same and method for producing same
US12384941B2 (en) 2019-03-29 2025-08-12 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for manufacturing same
US12480027B2 (en) 2019-03-29 2025-11-25 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for producing same

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TWI409309B (zh) * 2005-10-04 2013-09-21 Dow Corning Taiwan Inc 供織物塗佈之液體聚矽氧橡膠組合物
DE102006009394B4 (de) * 2006-03-01 2025-07-31 Nissan Chemical Industries, Ltd. Mehrlagenschichtsystem mit einer Schicht als Trennschicht zum Trägern von dünnen Wafern bei der Halbleiterherstellung, Verwendung des Schichtsystems beim und Verfahren zum Abdünnen eines Wafers
KR101458143B1 (ko) * 2006-03-01 2014-11-05 씬 머티리얼즈 아게 처리방법, 특히, 웨이퍼의 얇은 배면 처리방법, 웨이퍼-캐리어 배열 및 상기 타입의 웨이퍼-캐리어 배열의 제조방법
WO2008056810A1 (en) * 2006-11-08 2008-05-15 Dow Corning Toray Co., Ltd. Three-dimentional molded article, manufacturing method thereof and use thereof
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TW200405492A (en) 2004-04-01
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