KR20010033886A - 웨이퍼검사장치 및 웨이퍼검사방법 - Google Patents
웨이퍼검사장치 및 웨이퍼검사방법 Download PDFInfo
- Publication number
- KR20010033886A KR20010033886A KR1020007007458A KR20007007458A KR20010033886A KR 20010033886 A KR20010033886 A KR 20010033886A KR 1020007007458 A KR1020007007458 A KR 1020007007458A KR 20007007458 A KR20007007458 A KR 20007007458A KR 20010033886 A KR20010033886 A KR 20010033886A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- holding
- center table
- held
- placing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
Claims (6)
- 복수의 웨이퍼를 홀딩한 웨이퍼홀딩체로부터 소망하는 웨이퍼를 꺼내기 위한 웨이퍼반송수단과,상기 웨이퍼반송수단에 의해 꺼내어진 웨이퍼를 재치하고, 이 재치된 웨이퍼를 적어도 소정각도 회전하기 위한 웨이퍼재치수단과,상기 웨이퍼의 중심방향으로 연장하는 복수의 웨이퍼홀딩부를 가지며, 상기 웨이퍼를 상기 복수의 웨이퍼홀딩부에 의해 상기 웨이퍼재치수단에 재치된 웨이퍼의 한쪽면에 접촉하여 홀딩하고, 이 홀딩된 웨이퍼를 한쪽면을 관찰하기 위하여 반전하는 웨이퍼홀딩수단과,상기 웨이퍼홀딩수단에 의해 웨이퍼가 반전된 후에 재차 웨이퍼를 상기 웨이퍼재치수단에 재치시키고, 해당 웨이퍼를 상기 웨이퍼재치수단에 위해 소정각도 회전시키는 동시에 상기 웨이퍼홀딩수단을 반전시키는 제어수단을 구비한 것을 특징으로 하는 웨이퍼검사장치.
- 제 1 항에 있어서,상기 웨이퍼홀딩수단의 복수의 웨이퍼홀딩부는 상기 웨이퍼를 흡착함으로써 홀딩하는 것을 특징으로 하는 웨이퍼검사장치.
- 제 1 항에 있어서,상기 제어수단은 상기 웨이퍼재치수단에 재치된 웨이퍼를 상기 웨이퍼홀딩부의 폭 치수보다 큰 이동량이 얻어지는 회전각도로 회전시키는 것을 특징으로 하는 웨이퍼검사장치.
- 제 1 항에 있어서,상기 제어수단은 상기 웨이퍼재치수단에 재치된 웨이퍼를 상기 한쪽면의 관찰 때에 상기 복수의 웨이퍼홀딩부에 의해 숨겨진 영역을 관찰할 수 있도록 회전시키는 것을 특징으로 하는 웨이퍼검사장치.
- 제 1 항에 있어서,상기 웨이퍼재치수단은 웨이퍼검사장치의 센터테이블이고, 상기 제어수단은 상기 센터테이블의 회전각도를 제어하는 것을 특징으로 하는 웨이퍼검사장치.
- 복수의 웨이퍼를 홀딩한 웨이퍼홀딩체로부터 소망하는 웨이퍼를 꺼내고,상기 꺼내어진 웨이퍼를 센터테이블로 받아넘기며,상기 센터테이블에 받아넘겨진 웨이퍼를 복수의 웨이퍼홀딩부에 의해 상기 웨이퍼의 이면에 접촉하여 홀딩하고, 이 홀딩된 웨이퍼를 이면을 관찰하기 위하여 반전하며,상기 반전된 웨이퍼를 표면으로 되돌린 상태에서 상기 센터테이블로 받아넘기고,상기 센터테이블을 회전함으로써 상기 센터테이블에 받아넘겨진 웨이퍼를 소정각도 회전하며,상기 소정각도 회전된 웨이퍼를 상기 복수의 웨이퍼홀딩부에 의해 상기 웨이퍼의 이면에 접촉하여 홀딩하고, 이 홀딩된 웨이퍼의 이면을 관찰하기 위하여 재차 반전하는 것을 특징으로 하는 웨이퍼검사방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP98-339331 | 1998-11-30 | ||
JP33933198A JP3929189B2 (ja) | 1998-11-30 | 1998-11-30 | ウェハ検査装置 |
PCT/JP1999/006661 WO2000033056A1 (fr) | 1998-11-30 | 1999-11-29 | Procede et appareil d'inspection de plaquettes |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010033886A true KR20010033886A (ko) | 2001-04-25 |
KR100342661B1 KR100342661B1 (ko) | 2002-07-03 |
Family
ID=18326448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020007007458A KR100342661B1 (ko) | 1998-11-30 | 1999-11-29 | 웨이퍼검사장치 및 웨이퍼검사방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6241456B1 (ko) |
JP (1) | JP3929189B2 (ko) |
KR (1) | KR100342661B1 (ko) |
AU (1) | AU1411900A (ko) |
TW (1) | TW465006B (ko) |
WO (1) | WO2000033056A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100445457B1 (ko) * | 2002-02-25 | 2004-08-21 | 삼성전자주식회사 | 웨이퍼 후면 검사 장치 및 검사 방법 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020032057A (ko) * | 2000-10-25 | 2002-05-03 | 고석태 | 기판 반송/반전 장치, 이 장치를 이용한 기판 반전/반송시스템 및 기판 반송/반전 방법 |
DE10102542B4 (de) * | 2001-01-19 | 2009-01-15 | Vistec Semiconductor Systems Jena Gmbh | Anordnung zur visuellen Inspektion von Substraten |
US6899273B2 (en) | 2001-05-02 | 2005-05-31 | Hand Held Products, Inc. | Optical reader comprising soft key including permanent graphic indicia |
SG129992A1 (en) * | 2001-08-13 | 2007-03-20 | Micron Technology Inc | Method and apparatus for detecting topographical features of microelectronic substrates |
DE10308258A1 (de) * | 2003-02-25 | 2004-09-02 | Leica Microsystems Jena Gmbh | Vorrichtung und Verfahren zur Dünnschichtmetrologie |
US7268574B2 (en) * | 2005-09-01 | 2007-09-11 | Micron Technology, Inc. | Systems and methods for sensing obstructions associated with electrical testing of microfeature workpieces |
JP5753516B2 (ja) * | 2011-11-28 | 2015-07-22 | 東京エレクトロン株式会社 | 基板撮像装置及び基板撮像方法 |
TWI751613B (zh) * | 2020-07-17 | 2022-01-01 | 倍利科技股份有限公司 | 半導體元件的檢測方法及其裝置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4917556A (en) * | 1986-04-28 | 1990-04-17 | Varian Associates, Inc. | Modular wafer transport and processing system |
JP2659384B2 (ja) * | 1988-02-16 | 1997-09-30 | オリンパス光学工業株式会社 | ウエハ検査装置 |
US5317778A (en) * | 1991-07-31 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Automatic cleaning apparatus for wafers |
JPH06160292A (ja) * | 1992-11-18 | 1994-06-07 | Toshiba Ceramics Co Ltd | 薄板検査装置 |
JP3791698B2 (ja) * | 1994-09-30 | 2006-06-28 | オリンパス株式会社 | ウエハ検査装置 |
-
1998
- 1998-11-30 JP JP33933198A patent/JP3929189B2/ja not_active Expired - Fee Related
-
1999
- 1999-11-29 WO PCT/JP1999/006661 patent/WO2000033056A1/ja active IP Right Grant
- 1999-11-29 TW TW088120787A patent/TW465006B/zh not_active IP Right Cessation
- 1999-11-29 KR KR1020007007458A patent/KR100342661B1/ko active IP Right Grant
- 1999-11-29 AU AU14119/00A patent/AU1411900A/en not_active Abandoned
-
2000
- 2000-05-11 US US09/569,262 patent/US6241456B1/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100445457B1 (ko) * | 2002-02-25 | 2004-08-21 | 삼성전자주식회사 | 웨이퍼 후면 검사 장치 및 검사 방법 |
US6923077B2 (en) | 2002-02-25 | 2005-08-02 | Samsung Electronics Co., Ltd. | Apparatus and method for wafer backside inspection |
Also Published As
Publication number | Publication date |
---|---|
TW465006B (en) | 2001-11-21 |
AU1411900A (en) | 2000-06-19 |
WO2000033056A1 (fr) | 2000-06-08 |
JP2000162142A (ja) | 2000-06-16 |
JP3929189B2 (ja) | 2007-06-13 |
KR100342661B1 (ko) | 2002-07-03 |
US6241456B1 (en) | 2001-06-05 |
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