CN106024688A - 基板保持方法及基板处理装置 - Google Patents
基板保持方法及基板处理装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 231
- 238000000034 method Methods 0.000 title claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 60
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- 230000009471 action Effects 0.000 claims description 7
- 230000008520 organization Effects 0.000 description 25
- 239000012530 fluid Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 5
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- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
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- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Abstract
基板保持方法,用于使基板保持水平,包括:载置工序,将基板载置在基板搬运机构上;第一准备工序,在旋转底座的上表面周缘部的第一区域中,将沿周向配置的多个定位销变为关闭状态;第二准备工序,在旋转底座的上表面周缘部的与第一区域在周向上不重叠的第二区域中,将沿周向配置的多个把持用销变为打开状态;定位工序,在载置工序、第一准备工序及第二准备工序之后,通过使基板搬运机构移动并使基板的周缘部与多个定位销抵接,来对基板定位;基板把持工序,在定位工序之后,将多个把持用销变为关闭状态,由此,通过多个定位销和多个把持用销来保持基板;搬运机构退避工序,在基板把持工序之后,使基板搬运机构从旋转底座的上方退避。
Description
技术领域
本发明涉及在具有旋转底座的基板保持旋转装置上保持基板的方法,以及包括该基板保持旋转装置和基板搬运机构的基板处理装置。作为处理对象的基板,包括半导体晶片、液晶显示装置用玻璃基板、等离子显示器用玻璃基板、光掩模用基板、光盘用基板、磁盘用基板、磁光盘用基板、FED(FieldEmission Display)用基板、陶瓷基板、太阳能电池用基板等各种基板。
背景技术
对如同半导体晶片的基板进行处理的基板处理装置大致分为对多个基板一并处理的批量型处理装置和在处理室内对作为处理对象的基板,一次处理一片的单张式处理装置。在普通的单张式处理装置中,处理室内一片基板保持为水平,根据处理的内容,进行基板的旋转或者向基板供给处理液。
单张式处理装置具有旋转卡盘。在旋转卡盘的旋转底座的上表面,多个卡盘销以等间隔的方式沿周向配置。各卡盘销设置为:能够对与基板的周缘部接触的关闭状态和与基板的周缘部不接触的打开状态的两种动作状态进行切换。通过由多个卡盘销沿水平方向夹持基板,使得基板保持在旋转卡盘上。
就基板保持在旋转卡盘上而言,通过卡盘销与水平支撑销之间的协作动作来进行。在日本特开2014-45028号公报中公开了利用旋转卡盘的基板保持动作的一例。在日本特开2014-45028号公报中,基板处理装置的旋转卡盘具有:圆盘状的旋转底座;多个保持基座,在旋转底座的上表面周缘部上,沿与基板的外周形状相对应的圆周隔开间隔地配置;旋转电机,使旋转底座围绕通过旋转底座的中心的垂直的旋转轴线旋转。保持基座具有:水平支撑销,从基板的下表面支撑基板;卡盘销,其从基板的侧面方向夹持基板。
发明内容
但是,在日本特开2014-45028号公报中,为了从基板的侧面夹持基板,需要通过水平支撑销从下面支撑基板的下部的动作。为此,需要水平支撑销及用于使其移动的机构,从而基板处理装置的小型化变得困难。另外,在夹持基板之前,需要将基板下部载置在水平支撑销的工序,因此,难以在短时间内执行从搬运基板之后到从侧面夹持基板为止的工序。
优选地,不设置上述水平支撑销或者其移动机构,在基板保持在基板保持旋转机构(旋转卡盘)中,以简单的结构从水平方向夹持基板。
因此,本发明的目的在于,提供基板保持方法及基板处理装置,在基板保持在基板保持旋转机构中,既能够确保高定位精度,又能够以简单的结构从水平方向夹持基板。
本发明的第一技术方案,基板保持方法,用于使基板保持水平,其特征在于,
包括:
载置工序,将基板载置在基板搬运机构上,
第一准备工序,在旋转底座的上表面周缘部的第一区域中,将沿周向配置的多个定位销变为关闭状态,
第二准备工序,在所述旋转底座的上表面周缘部的与所述第一区域在周向上不重叠的第二区域中,将沿周向配置的多个把持用销变为打开状态,
定位工序,在所述载置工序、所述第一准备工序及所述第二准备工序之后,通过使所述基板搬运机构移动并使所述基板的周缘部与所述多个定位销抵接,来对所述基板定位,
基板把持工序,在所述定位工序之后,将所述多个把持用销变为关闭状态,由此,通过所述多个定位销和所述多个把持用销来保持所述基板,
搬运机构退避工序,在所述基板把持工序之后,使所述基板搬运机构从所述旋转底座的上方退避。
根据该方法,能够省略将基板从基板搬运机构暂时载置在水平支撑销等上的工序。另外,将定位销预先置为关闭状态,该关闭状态的定位销的位置是相对旋转底座的基板的定位基准,因此,能够确保定位精度。即,通过旋转卡盘来保持基板,既能够确保基板的定位精度,又能够进行工序的削减。
另外,在本发明的一个实施方式中,所述多个定位销配置在分开角度为180度以内的所述第一区域。
在定位销的分开角度超过180度的情况下,在本发明中,定位销处于关闭状态,因此,与把持用销是打开状态还是关闭状态无关,使基板与定位销抵接实质上是困难的。因此,通过该方法,多个定位销配置在分开角度为180度以内的范围,从而能够回避这样的问题。
另外,所述多个定位销在所述第二准备工序、所述定位工序、所述基板把持工序及所述搬运机构退避工序期间,始终保持关闭状态。
根据该方法,在定位销是在打开状态和关闭状态之间能够开闭的结构的情况下,能够省略使定位销的开关闭状态变化的工序。
本发明的第二技术方案,提供基板处理装置,包括用于使基板水平地保持旋转的基板保持旋转装置和用于搬运所述基板的基板搬运机构,该基板处理装置用于对所述基板进行处理,其特征在于,
所述基板保持旋转装置包括:
旋转底座,以旋转轴为中心能够旋转,
旋转驱动机构,使所述旋转底座旋转,
多个定位销,在所述旋转底座的上表面周缘部的第一区域中,沿周向配置,
多个把持用销,在所述旋转底座的上表面周缘部的与所述第一区域在周向上不重叠的第二区域中,沿周向配置,
把持用销开闭机构,用于使所述多个把持用销在关闭状态和打开状态之间切换,
该基板处理装置还具有控制单元,该控制单元用于控制所述基板搬运机构、所述旋转驱动机构、所述把持用销开闭机构的动作。
根据该结构,能够从基板保持旋转装置的结构省略用于暂时载置基板的水平支撑销等机构。另外,将定位销预先置为关闭状态,该关闭状态的定位销的位置是相对旋转底座的基板的定位基准,因此,能够确保定位精度。即,通过旋转卡盘来保持基板,既能够确保基板的定位精度,又能够消减水平支撑销等的机构。
另外,在本发明的一个实施方式中,所述多个定位销配置在分开角度为180度以内的所述第一区域。
在定位销的分开角度超过180度的情况下,在本发明中,定位销处于关闭状态,因此,与把持用销是打开状态还是关闭状态无关,使基板与定位销抵接实质上是困难的。因此,通过该方法,多个定位销配置在分开角度为180度以内的范围,从而能够回避这样的问题。
所述多个定位销也可以始终固定在关闭状态。根据该结构,定位销也可以维持关闭状态,因此,例如能够省略切换打开状态和关闭状态的机构。
本发明的上述或者其他目的、特征及效果,根据参照附图进行说明的实施方式会更加清楚。
附图说明
图1是示出本发明的一个实施方式的基板处理装置的概要结构的图。
图2A是示出所述基板处理装置的旋转卡盘的俯视图。
图2B是示出所述基板处理装置的旋转卡盘的俯视图。
图3A是用于说明基板处理装置的主要部分的电器结构的框图。
图3B是示出所述基板处理装置所执行的基板搬入搬出动作的流程的流程图。
图4A是用于说明所述流程图的步骤S1的基板处理装置的图。
图4B是用于说明所述流程图的步骤S2的基板处理装置的图。
图4C是用于说明所述流程图的步骤S3的基板处理装置的图。
图4D是用于说明所述流程图的步骤S4的基板处理装置的图。
图4E是用于说明所述流程图的步骤S5的基板处理装置的图。
图4F是用于说明所述流程图的步骤S6的基板处理装置的图。
图4G是用于说明所述流程图的步骤S7的基板处理装置的图。
图4H是用于说明所述流程图的步骤S8的基板处理装置的图。
图4I是用于说明所述流程图的步骤S9的基板处理装置的图。
图4J是用于说明所述流程图的步骤S10的基板处理装置的图。
图5是用于说明基板搬运机构的结构示意性的立体图。
图6是其他方式的基板处理装置的示意性的侧视图。
具体实施方式
图1是示出本发明的一个实施方式的基板处理装置1的概要结构的侧视图。基板处理装置1具有由腔室壁11包围的处理室10。处理室10具有旋转卡盘(基板保持旋转装置)2。在腔室壁11的侧面设置有能够开闭开口的挡板部11A。能够使图5所示的基板搬运机构5的手部机构6通过该开口来进行进退。
基板处理装置1还具有处理液喷嘴15和/或气体喷嘴16。处理液喷嘴15或气体喷嘴16除了进行基板处理时,通常退避至退避位置,在进行基板处理时,通过未图示的移动机构移动至基板W上方的规定位置。
旋转卡盘2具有圆盘状的旋转底座21和使旋转底座21旋转的旋转电机(旋转驱动机构)22。旋转电机22配置于旋转底座21的下方。多个定位销基座部51A、51B、51C沿周向大致等间隔地配置于旋转底座21的上表面的周缘部。多个定位销基座部51A、51B、51C配置于由旋转底座21的上表面周缘部的约120度(180度以内的规定角度)的范围形成的第一区域21B(参照图2A)。即,定位销基座部51A、51B、51C以隔着约60度间隔的方式配置。即,多个定位销基座部51A、51B、51C(后述的定位销50A、50B、50C)的分开角度约为120度(180度以内的规定角度)。
在定位销基座部51A、51B、51C的各上部设置有相对所述定位销基座部51A、51B、51C能够在径向上移动(或者能够旋转)的定位销50A、50B、50C。各定位销50A、50B、50C连接有第一卡盘开闭单元91。作为第一卡盘开闭单元91的动力源,可适用利用电动马达、电磁铁等各种形式的动力源。定位销50A、50B、50C通过第一卡盘开闭单元91可以在与基板W的周缘部接触的接触位置和比接触位置更远离旋转轴线L1的开放位置之间移动。将定位销50A、50B、50C处于接触位置的状态称为定位销50A、50B、50C的关闭位置,将定位销50A、50B、50C处于开放位置的状态称为定位销50A、50B、50C的打开位置。
多个把持用销基座部61A、61B、61C沿周向大致等间隔地配置在旋转底座21的上表面的周缘部。多个把持用销基座部61A、61B、61C配置于由旋转底座21的上表面周缘部的约120度(180度以内的规定角度)的范围形成的第二区域21C(参照图2A)。在旋转底座21的上表面周缘部上,第二区域21C与第一区域21B在周向上不重叠。
即,把持用销基座部61A、61B、61C以隔着约60度间隔的方式配置。即,多个把持用销基座部61A、61B、61C(后述的把持用销60A、60B、60C)的分开角度约为120度(180度以内的规定角度)。
在把持用销基座部61A、61B、61C的各上部设置有相对所述把持用销基座部61A、61B、61C能够在径向上移动的把持用销60A、60B、60C。各把持用销60A、60B、60C连接有第二卡盘开闭单元(把持用销开闭机构)92。作为第二卡盘开闭单元92的动力源,可适用利用电动马达、电磁铁等的各种形式的动力源。把持用销60A、60B、60C通过第二卡盘开闭单元92可以在与基板W的周缘部接触的接触位置和比接触位置更远离旋转轴线L1的开放位置之间移动。在本实施方式中,把持用销60A、60B、60C的开放位置和定位销50A、50B、50C的开放位置位于以旋转轴线L1为中心的圆周上。将把持用销60A、60B、60C处于接触位置的状态称为把持用销60A、60B、60C的关闭位置,将把持用销60A、60B、60C处于开放位置的状态称为把持用销60A、60B、60C的打开位置。
此外,在图1中,为了容易理解附图,没有图示定位销基座部、定位销、把持用销基座部、把持用销的全部,而仅图示定位销50B及与其对应的定位销基座部51B、把持用销60B及与其对应的把持用销基座部61B。在后述的图4A~图4J中也进行同样的省略。
各定位销50A、50B、50C具有:抵接部53A、53B、53C,以与基板W的周缘部(周端面)抵接的方式形成为圆柱状,并且在俯视时呈圆弧状;引导部52A、52B、52C,向所述抵接部53A、53B、53C的下部倾斜的方向延伸。在本实施方式中,与基板W的处理状态无关,定位销50A、50B、50C相对旋转底座21总是设置成关闭状态。
各把持用销60A、60B、60C基本上具有与定位销50A、50B、50C相同的形状。即,与定位销50A、50B、50C相同,各把持用销60A、60B、60C具有:抵接部63A、63B、63C,以与基板W的周缘部(周端面)抵接的方式形成为圆柱状,并且在俯视时呈圆弧状;引导部62A、62B、62C,向所述抵接部的下部倾斜方向延伸。把持用销60A、60B、60C通过销驱动机构64,在把持用销60A、60B、60C的把持用销基座部61A、61B、61C上,相对旋转底座21的上表面在径向上水平移动。在打开状态下,相对旋转底座21的上表面向外周侧方向水平移动,在关闭状态下,相对旋转底座21的上表面稍微向内周侧方向水平移动(或者旋转)。
图2A及图2B是本发明的一个实施方式的基板处理装置1的旋转卡盘2的俯视图。图2A示出多个定位销50A、50B、50C全部是关闭状态,且多个把持用销60A、60B、60C全部是打开状态的状态。图2B示出多个定位销50A、50B、50C全部是关闭状态,且多个把持用销60A、60B、60C也全部是关闭状态的状态。这样,本发明的一个实施方式的旋转卡盘2具有定位销50A、50B、50C和把持用销60A、60B、60C共两种销,在本实施方式的工序中,仅把持用销60A、60B、60C移动至打开状态的位置和关闭状态的位置。
图3A是用于说明基板处理装置1的主要部分的电器结构的框图。
基板处理装置1具有用于控制基板处理装置1的动作的控制部(控制单元)70。控制部70例如利用微型计算机来构成。控制部70具有CPU等运算单元、固定存储设备、硬盘驱动器等存储部80、及输入输出单元。存储单元存储有供运算单元执行的程序。
控制部70通过预定的程序来控制旋转电机22、第一卡盘开闭单元91及第二卡盘开闭单元92、基板搬运机构5等的动作。
图3B是表示本发明的实施方式的基板处理装置1将基板W搬入处理室10之后到搬出为止的工序的流程图。以下,一边参照图1~图3B,一边对本发明实施方式的工序进行说明。
首先,对基板W搬入处理室10之后到变为能够进行处理室中的各种处理的状态为止的各工序(S1~S6)。
[步骤S1]
图4A是用于说明步骤S1中旋转卡盘2与基板W之间的关系的旋转卡盘2的侧视图。
图5示出基板搬运机构5的装置结构。基板搬运机构5具有:臂部68,以关节部67为轴在水平方向上能够自由屈曲;手部机构6,与臂部68连结并将基板W载置于该手部机构6的上部;上下驱动机构66,使关节部52、臂部53及手部机构6在垂直方向上下移动。控制部70(参照图3A)控制基板搬运机构5并使其向垂直方向(即垂直方向)移动,并且使手部机构6移动。上述移动中的手部机构6的位置提前利用模拟晶片等,通过所谓教学(示教)来决定,并作为基板处理装置1的一连串的处理工序参数存储在存储部80(参照图3A)内。
控制部70(参照图3A)根据各工序,将关于合适的手部机构6的位置的指示从存储部80传递给基板搬运机构5。在步骤S1中,基板搬运机构5从处理室10外的未图示的加载/卸载部接收基板W,并将基板W载置在手部机构6的上部(基板载置工序)。在该状态下,向旋转卡盘2的上方移动,在俯视时,在载置的基板W的中心比旋转卡盘2的中心部稍微靠近把持用销60B的位置,使手部机构6停止。
[步骤S2]
图4B是用于说明步骤S2中的旋转卡盘2与基板W之间的关系的旋转卡盘2的侧视图。在步骤S2中,把持用销60A、60B、60C全部为打开状态。在基板处理装置1中,在基板W到目前为止没有被处理的情况下,通过开闭传感器(未图示)来检测把持用销60A、60B、60C是否位于旋转底座21的径向的外周侧。并且,当把持用销60A、60B、60C位于旋转底座21的径向的内周侧(即把持用销60A、60B、60C为关闭状态的情况下)的情况下,控制部70控制第二卡盘开闭单元92,使把持用销60A、60B、60C变成打开状态(第二准备工序)。在基板处理装置1中,在基板W到目前为止已被处理的情况下,从该处理的前一个基板W被搬出到下一个基板W被搬入为止,把持用销60A、60B、60C维持在搬出前一个基板W时所设定的打开状态,因此,不需要重新设定打开状态。
[步骤S3]
图4C是用于说明步骤S3中旋转卡盘2与基板W之间的关系的旋转卡盘2的侧视图。在步骤S3中,控制部70控制第一卡盘开闭单元91,使定位销50A、50B、50C的位置变为关闭状态(第一准备工序)。关闭状态下的定位销50A、50B、50C相对于旋转底座21的位置设定为:当后述的步骤S6中基板W由把持用销60A、60B、60C把持时,基板W的中心位置与旋转底座21的旋转轴线相交。在该基板处理例中,此后,定位销50A、50B、50C相对于旋转底座21的位置在基板W的搬出的之前为止不移动。此外,在本基板处理例中,由于不需要使定位销50A、50B、50C相对于旋转底座21移动,因此,可以利用省略定位销驱动机构54A、54B、54C的装置结构。此外,在本基板处理例中,在步骤S1的阶段中,定位销50A、50B、50C的位置已经变成关闭状态,因此,从步骤S1到步骤S2,定位销50A、50B、50C的位置无变化。
[步骤S4]
图4D是用于说明步骤S4中的旋转卡盘2与基板W之间的关系的旋转卡盘2的侧视图。在步骤S4中,使基板W抵接于定位销50A、50B、50C。更详细地说,控制部70控制基板搬运机构5使手部机构6下降,由此,使载置于手部机构6上的基板W的周缘部(周端面)抵接于定位销50A、50B、50C的引导部52A、52B、52C及把持用销的引导部62A、62B、62C。由此,能够对基板W的周缘部(周端面)定位(定位工序)。
[步骤S5]
图4E是用于说明步骤S5中的旋转卡盘2与基板W之间的关系的旋转卡盘2的侧视图。在步骤S5中,把持用销60A、60B、60C全部从打开状态向关闭状态移动。换言之,把持用销60A、60B、60C全部在朝向旋转底座21的中心的径向上移动规定距离。根据该移动,基板W的周缘部沿定位销50A、50B、50C的引导部52A、52B、52C及把持用销60A、60B、60C的引导部62A、62B、62C的倾斜面移动。该移动持续至基板W与定位销50A、50B、50C的抵接部53A、53B、53C及把持用销60A、60B、60C的抵接部63A、63B、63C相碰为止。其结果,在旋转卡盘2上,通过定位销50A、50B、50C及把持用销60A、60B、60C来夹持基板W。
在此,定位销50A、50B、50C的关闭状态的旋转底座21上的位置以使旋转底座21上的基板W正确定位为目的而进行调整。换言之,在基板W的周面部(周端面)与定位销50A、50B、50C的抵接部53A、53B、53C抵接的状态下,以使基板W的中心与旋转底座21的中心一致的方式进行调整。定位销50A、50B、50C具有这样的目的,因此,优选为在关闭状态下旋转底座21上的相对位置不变动。换言之,优选为:定位销50A、50B、50C在关闭状态下,在旋转底座21上的所谓位置的“活动”少。
另一方面,就把持用销60A、60B、60C而言,关闭状态中的相对于旋转底座21的相对位置,通过内置有弹簧机构等,存在少许的位置的“活动”。在步骤S5结束的时刻,优选为,把持用销60A、60B、60C的抵接部63A、63B、63C处于朝向旋转卡盘2的中心的径向的规定收紧力传递给基板W的周缘部(周端面)的状态。换言之,就把持用销60A、60B、60C而言,优选为,关闭状态的位置与定位销50A、50B、50C相比,设定成稍微靠近旋转底座21的中心,并且,即便关闭状态下把持用销60A、60B、60C也能够在旋转底座21的径向上稍微移动,使得把持用销60A、60B、60C发挥把持用销的作用。
[步骤S6]
图4F是用于说明步骤S6中的旋转卡盘2与基板W之间的关系的旋转卡盘2的侧视图。在步骤S6中,控制部70控制基板搬运机构5,使手部机构6从基板W的下表面退避(搬运机构退避工序)。当手部机构6从基板W的下表面退避时,基板W在旋转底座21的上方被定位销50A、50B、50C及把持用销60A、60B、60C夹持。之后,包括手部机构6,基板搬运机构5的整体通过腔室壁11上的挡板部11A从处理室10退避。
[步骤S7]
图4G是用于说明步骤S7中的旋转卡盘2与基板W之间的关系的旋转卡盘2的侧视图。在步骤S7中,根据控制部70从存储部80读出的方法,进行基板W的各种基板处理。作为这里的基板处理的例,可以有基板W的蚀刻、清洗、干燥等。在基板处理中,控制部70基于方法从处理液喷嘴15吐出规定的处理液,从气体喷嘴16吐出规定的处理气体,且使基板W以基于方法的规定转数旋转。
接着,说明在基板W的处理结束之后,基板W从交接至基板搬运机构5的手部机构6到从处理室10搬出为止的工序(S8~S11)。
[步骤S8]
图4H是用于说明步骤S8中的旋转卡盘2与基板W之间的关系的旋转卡盘2的侧视图。在步骤S8中,控制部70控制基板搬运机构5,使没有载置基板W的手部机构6通过腔室壁11上的挡板部11A进入处理室10。
接着,控制部70控制基板搬运机构5,使手部机构6移动到由定位销50A、50B、50C及把持用销60A、60B、60C夹持的基板W的下表面与旋转底座21的上表面之间的规定位置,并使手部机构6上升到手部机构6的上表面与基板W的下表面几乎接触的位置为止。
[步骤S9]
图4I是用于说明步骤S9中的旋转卡盘2与基板W之间的关系的旋转卡盘2的侧视图。
在步骤S9中,把持用销60A、60B、60C全部为打开状态。由此,基板W通过自重,沿把持用销60A、60B、60C的引导部62A、62B、62C及定位销50A、50B、50C的引导部52A、52B、52C向下方移动。其结果,基板W的下表面与手部机构6的上表面接触。其结果,基板W的下表面由手部机构6的上表面从下面支撑。由此,基板W交接至手部机构6。
[步骤S10]
图4J是用于说明步骤S10中的旋转卡盘2与基板W之间的旋转卡盘2的侧视图。
在步骤S10中,控制部70控制基板搬运机构5,使手部机构6相对旋转卡盘2向垂直上方移动。由此,阻断基板W的下表面与定位销50A、50B、50C及把持用销60A、60B、60C之间的接触,从而实现仅由手部机构6从下面支撑的状态。手部机构6的下表面位于定位销50A、50B、50C及把持用销60A、60B、60C的上方之后,手部机构6通过水平移动从旋转底座21的上方退避。之后,手部机构6将载置的基板W交接至未图示的加载/卸载部。
本发明的实施方式的说明如上所述,但是本发明也可以以其他的方式实施。
例如,在上述说明的实施方式中,定位销50A、50B、50C及把持用销60A、60B、60C为通过在旋转底座21的径向上移动来实现关闭状态或者打开状态的结构。但是,针对实现打开状态或者关闭状态的结构,除此之外,可以采用通过将定位销50A、50B、50C及把持用销60A、60B、60C在沿垂直方向立接的状态与沿垂直倾斜方向立接的状态切换来切换开闭状态的方式,或者通过使定位销50A、50B、50C及把持用销60A、60B、60C自转而使与基板W抵接的状态变化来切换开闭状态的方式。
图6示出其他方式的基板处理装置101的示意性的侧视图。基板处理装置101具有由腔室壁111包围的处理空间,所述处理空间具有用于使未图示的基板搬运机构的未图示的手部机构进退的挡板部111A。该收容空间收容有旋转卡盘102、用于供给处理液的处理液喷嘴115、用于供气的气体喷嘴116等。旋转底座121具有圆盘状的上部板121A。上部板121A的周缘部大致等角度间隔地配置有多个卡盘销130。各卡盘销130具有:基座部131,固定在旋转底座121的上部板121A上;引导部132,与基座部131的上方连接并在卡盘销130的垂直倾斜上方向延伸;抵接部133,与引导部132连接并垂直地形成;未图示的卡盘销驱动机构,通过使引导部132及抵接部133相对于基座部131移动,将卡盘销130切换为打开状态或关闭状态。多个水平支撑销140以大致等角度间隔地配置在上部板121A的内周部侧。上述水平支撑销140可通过水平支撑销驱动机构141相对于上部板121A在垂直方向上下移动。
对本发明的实施方式进行了说明,但这些不过是为了使本发明的技术内容清楚所使用的具体例,本发明不限于这些具体例,本发明的范围仅由权利要求书的范围进行限定。
本申请与2015年3月27日向日本特许厅提出的发明专利申请2015-066241号和2016年1月25日向日本专利厅提出的发明专利申请2016-11694号分别对应,上述申请的全部内容在此引入本申请作为参考。
Claims (6)
1.一种基板保持方法,用于使基板保持水平,其特征在于,
包括:
载置工序,将基板载置在基板搬运机构上,
第一准备工序,在旋转底座的上表面周缘部的第一区域中,将沿周向配置的多个定位销变为关闭状态,
第二准备工序,在所述旋转底座的上表面周缘部的与所述第一区域在周向上不重叠的第二区域中,将沿周向配置的多个把持用销变为打开状态,
定位工序,在所述载置工序、所述第一准备工序及所述第二准备工序之后,通过使所述基板搬运机构移动并使所述基板的周缘部与所述多个定位销抵接,来对所述基板定位,
基板把持工序,在所述定位工序之后,将所述多个把持用销变为关闭状态,由此,通过所述多个定位销和所述多个把持用销来保持所述基板,
搬运机构退避工序,在所述基板把持工序之后,使所述基板搬运机构从所述旋转底座的上方退避。
2.根据权利要求1所述的基板保持方法,其特征在于,
所述多个定位销配置在分开角度为180度以内的所述第一区域。
3.根据权利要求1或2所述的基板保持方法,其特征在于,
所述多个定位销在所述第二准备工序、所述定位工序、所述基板把持工序及所述搬运机构退避工序期间,始终保持关闭状态。
4.一种基板处理装置,包括用于使基板水平地保持旋转的基板保持旋转装置和用于搬运所述基板的基板搬运机构,该基板处理装置用于对所述基板进行处理,其特征在于,
所述基板保持旋转装置包括:
旋转底座,以旋转轴为中心能够旋转,
旋转驱动机构,使所述旋转底座旋转,
多个定位销,在所述旋转底座的上表面周缘部的第一区域中,沿周向配置,
多个把持用销,在所述旋转底座的上表面周缘部的与所述第一区域在周向上不重叠的第二区域中,沿周向配置,
把持用销开闭机构,用于使所述多个把持用销在关闭状态和打开状态之间切换,
该基板处理装置还具有控制单元,该控制单元用于控制所述基板搬运机构、所述旋转驱动机构、所述把持用销开闭机构的动作。
5.根据权利要求4所述的基板处理装置,其特征在于,
所述多个定位销配置在分开角度为180度以内的所述第一区域。
6.根据权利要求4或5所述的基板处理装置,其特征在于,
所述多个定位销始终保持关闭状态。
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