KR20010030703A - 반도체 패키지 및 그에 있어서의 플립 칩 접합 방법 - Google Patents

반도체 패키지 및 그에 있어서의 플립 칩 접합 방법 Download PDF

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Publication number
KR20010030703A
KR20010030703A KR1020007003151A KR20007003151A KR20010030703A KR 20010030703 A KR20010030703 A KR 20010030703A KR 1020007003151 A KR1020007003151 A KR 1020007003151A KR 20007003151 A KR20007003151 A KR 20007003151A KR 20010030703 A KR20010030703 A KR 20010030703A
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South Korea
Prior art keywords
chip
substrate
bonding
bumps
semiconductor chip
Prior art date
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KR1020007003151A
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English (en)
Korean (ko)
Inventor
가지와라류이찌
고이즈미마사히로
모리따도시아끼
다까하시가즈야
니시무라아사오
쯔보사끼구니히로
Original Assignee
가나이 쓰토무
가부시키가이샤 히타치세이사쿠쇼
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Publication of KR20010030703A publication Critical patent/KR20010030703A/ko

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    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR1020007003151A 1998-09-28 1998-09-28 반도체 패키지 및 그에 있어서의 플립 칩 접합 방법 KR20010030703A (ko)

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PCT/JP1998/004337 WO2000019514A1 (fr) 1998-09-28 1998-09-28 Boitier de semiconducteur et procede correspondant de soudage de puce

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KR100691443B1 (ko) * 2005-11-16 2007-03-09 삼성전기주식회사 플립칩 패키지 및 그 제조방법
KR100731459B1 (ko) * 2003-02-10 2007-06-21 스카이워크스 솔루션즈, 인코포레이티드 반도체 다이 패키지

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WO2009009566A2 (fr) * 2007-07-09 2009-01-15 Texas Instruments Incorporated Procédé de fabrication d'un dispositif à semi-conducteurs
US8387674B2 (en) 2007-11-30 2013-03-05 Taiwan Semiconductor Manufacturing Comany, Ltd. Chip on wafer bonder
US8084853B2 (en) * 2009-09-25 2011-12-27 Mediatek Inc. Semiconductor flip chip package utilizing wire bonding for net switching
CN102237285B (zh) * 2010-04-20 2016-05-18 台湾积体电路制造股份有限公司 晶片接合机
US8901736B2 (en) * 2010-05-28 2014-12-02 Taiwan Semiconductor Manufacturing Company, Ltd. Strength of micro-bump joints
JP5643036B2 (ja) * 2010-09-14 2014-12-17 株式会社ディスコ 光デバイスウエーハの加工方法
US20130119532A1 (en) * 2011-11-11 2013-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Bumps for Chip Scale Packaging
US8975117B2 (en) * 2012-02-08 2015-03-10 Infineon Technologies Ag Semiconductor device using diffusion soldering
US9560771B2 (en) * 2012-11-27 2017-01-31 Omnivision Technologies, Inc. Ball grid array and land grid array having modified footprint
US10037941B2 (en) * 2014-12-12 2018-07-31 Qualcomm Incorporated Integrated device package comprising photo sensitive fill between a substrate and a die
JP6538596B2 (ja) 2016-03-14 2019-07-03 東芝メモリ株式会社 電子部品の製造方法及び電子部品の製造装置
CN114184939B (zh) * 2021-12-30 2024-06-11 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种适于超低温环境的芯片夹持装置
CN118070749B (zh) * 2024-04-17 2024-07-23 淄博芯材集成电路有限责任公司 一种基板收缩方法

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KR100731459B1 (ko) * 2003-02-10 2007-06-21 스카이워크스 솔루션즈, 인코포레이티드 반도체 다이 패키지
KR100691443B1 (ko) * 2005-11-16 2007-03-09 삼성전기주식회사 플립칩 패키지 및 그 제조방법

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WO2000019514A1 (fr) 2000-04-06

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