KR19980703643A - 고순도 경질화 금합금 및 그의 제조방법 - Google Patents
고순도 경질화 금합금 및 그의 제조방법 Download PDFInfo
- Publication number
- KR19980703643A KR19980703643A KR1019970707042A KR19970707042A KR19980703643A KR 19980703643 A KR19980703643 A KR 19980703643A KR 1019970707042 A KR1019970707042 A KR 1019970707042A KR 19970707042 A KR19970707042 A KR 19970707042A KR 19980703643 A KR19980703643 A KR 19980703643A
- Authority
- KR
- South Korea
- Prior art keywords
- high purity
- purity
- hardened
- gold alloy
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 229910001020 Au alloy Inorganic materials 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000003353 gold alloy Substances 0.000 title abstract description 16
- 238000005266 casting Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 5
- 230000032683 aging Effects 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 2
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 150000002910 rare earth metals Chemical class 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 22
- 238000012545 processing Methods 0.000 abstract description 16
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 14
- 229910052737 gold Inorganic materials 0.000 description 14
- 239000010931 gold Substances 0.000 description 14
- 239000000654 additive Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 238000003483 aging Methods 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C27/00—Making jewellery or other personal adornments
- A44C27/001—Materials for manufacturing jewellery
- A44C27/002—Metallic materials
- A44C27/003—Metallic alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Adornments (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (6)
- 순도 99.7 중량% 이상인 Au에 Gd를 50ppm 이상 첨가하고 다른 원소를 1 종류 이상 복합 첨가하여 누계량 100ppm ~ 3000ppm 함유하는 것을 특징으로 하는 Au 고순도 경질 합금 장식부재.
- Gd와 Ca, 또는 Gd와 Al을 함유하는 복합원소(Gd 10% 이상)를 100ppm ~ 3000ppm 첨가하는 것을 특징으로 하는 Au 고순도 경질 합금부재.
- Gd와 Si를 함유하는 복합원소(Gd 50% 이상)를 100ppm ~ 3000ppm 첨가하는 것을 특징으로 하는 Au 고순도 경질 합금부재.
- 순도 99.7 중량% 이상인 고순도 Au 합금부재의 제조에 있어서, ① 주조후 700℃ 이상에서 용체화처리하고, 후공정에서 150℃ ~ 350℃ 에서 시효처리하는 것, 또는 ② 이 시효처리만을 행하는 것을 특징으로 하는 Au 고순도 경질 합금부재의 제조 방법.
- 순도 99.7 중량% 이상인 Au에 Gd를 50ppm 이상 첨가하여 주조후 700℃ 이상에서 용체화 처리하고 후공정에서 50℃ ~ 350℃ 에서 시효처리하는 것, 또는 이 시효처리만을 행하는 것을 특징으로 하는 Au 고순도 경질 합금부재의 제조 방법.
- 순도 99.7 중량% 이상인 고순도 Au 합금부재에 희토류, 또는 알칼리토류금속, 또는 양자 복합 금속의 어느 하나늘 100ppm 이상 첨가하여 상기의 용체화 처리나 시효처리를 행하는 것을 특징으로 하는 제조 방법.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11758795 | 1995-04-07 | ||
JP95/117587 | 1995-04-07 | ||
JP95/117588 | 1995-04-07 | ||
JP11758895 | 1995-04-07 | ||
PCT/JP1996/000510 WO1996031632A1 (fr) | 1995-04-07 | 1996-03-04 | Alliage d'or a haute purete et dur, et procede de production |
Publications (1)
Publication Number | Publication Date |
---|---|
KR19980703643A true KR19980703643A (ko) | 1998-12-05 |
Family
ID=26455683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970707042A Ceased KR19980703643A (ko) | 1995-04-07 | 1996-03-04 | 고순도 경질화 금합금 및 그의 제조방법 |
Country Status (10)
Country | Link |
---|---|
US (2) | US6077366A (ko) |
EP (1) | EP0819773B1 (ko) |
KR (1) | KR19980703643A (ko) |
CN (1) | CN1084795C (ko) |
AT (1) | ATE212679T1 (ko) |
AU (1) | AU717376B2 (ko) |
BR (1) | BR9604819A (ko) |
DE (1) | DE69618944T2 (ko) |
ES (1) | ES2170850T3 (ko) |
WO (1) | WO1996031632A1 (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4319965C3 (de) * | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung |
JP3317434B2 (ja) | 1995-12-01 | 2002-08-26 | 住友金属鉱山株式会社 | 金合金およびその製造方法 |
EP0922780B1 (en) * | 1996-06-12 | 2002-09-25 | Kazuo Ogasa | Method of manufacturing a high purity hard gold alloy |
JP2002004150A (ja) * | 2000-06-16 | 2002-01-09 | Naagetto:Kk | 貴金属線を用いた織布及びその製造装置及び方法 |
JP2001049364A (ja) * | 2000-07-03 | 2001-02-20 | Kazuo Ogasa | 硬質貴金属合金部材とその製造方法 |
JP4417115B2 (ja) * | 2002-03-01 | 2010-02-17 | 和男 小笠 | 硬質金属合金部材とその製造方法 |
US20060260778A1 (en) * | 2005-05-19 | 2006-11-23 | Stern Leach Company, A Corporation Of The State Of Delaware | Method for adding boron to metal alloys |
US20060231171A1 (en) * | 2005-04-19 | 2006-10-19 | Davis Samuel A | Method for adding boron to metal alloys |
JPWO2008072485A1 (ja) * | 2006-11-24 | 2010-03-25 | 和男 小笠 | 高性能弾性金属合金部材とその製造方法 |
US8495971B2 (en) * | 2010-12-08 | 2013-07-30 | The Clorox Company | Animal litter comprising a surfactant encapsulated fragrance nanoemulsion |
JP2012251235A (ja) * | 2011-06-06 | 2012-12-20 | Three O Co Ltd | 微細結晶子高機能金属合金部材とその製造方法 |
CN103695692B (zh) * | 2013-12-11 | 2015-11-25 | 广州番禺职业技术学院 | 一种高成色高硬度金合金材料及其制备方法 |
US20160054706A1 (en) * | 2014-08-22 | 2016-02-25 | Bulova Corporation | Watches |
CN106406070A (zh) * | 2014-10-21 | 2017-02-15 | 宝路华公司 | 表 |
CN104342571B (zh) * | 2014-10-28 | 2016-08-24 | 北海嘉华珠宝有限公司 | 一种青色k金的配方及制作方法 |
EP4303333A4 (en) * | 2021-03-29 | 2024-10-02 | Tokyo University Of Science Foundation | Gold alloy and method for producing gold alloy |
CN115011834B (zh) * | 2021-12-21 | 2023-08-29 | 昆明理工大学 | 一种耐汗液腐蚀性能的紫色18k金铝合金的制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE145183C (ko) * | ||||
US3667937A (en) * | 1970-10-07 | 1972-06-06 | John A Williams | Dental filling |
GB2116208B (en) * | 1981-12-04 | 1985-12-04 | Mitsubishi Metal Corp | Fine gold alloy wire for bonding of a semiconductor device |
JPS5896741A (ja) * | 1981-12-04 | 1983-06-08 | Mitsubishi Metal Corp | 半導体素子結線用高張力au合金細線 |
US4775512A (en) * | 1985-10-01 | 1988-10-04 | Tanaka Denshi Kogyo Kabushiki Kaisha | Gold line for bonding semiconductor element |
JPS6357753A (ja) * | 1986-08-29 | 1988-03-12 | Citizen Watch Co Ltd | 装身具の製造方法 |
JPH0830229B2 (ja) * | 1987-03-31 | 1996-03-27 | 三菱マテリアル株式会社 | 半導体装置のボンデイングワイヤ用Au合金極細線 |
JPH0686637B2 (ja) * | 1987-11-09 | 1994-11-02 | 三菱マテリアル株式会社 | ループ成形性の優れた半導体素子ボンディング用Au合金細線 |
JP2778093B2 (ja) * | 1988-09-29 | 1998-07-23 | 三菱マテリアル株式会社 | 金バンプ用金合金細線 |
US5658664A (en) * | 1993-04-08 | 1997-08-19 | Nippon Steel Corporation | Thin gold-alloy wire for semiconductor device |
JPH0790425A (ja) * | 1993-09-17 | 1995-04-04 | Tanaka Kikinzoku Kogyo Kk | 精密鋳造品用Au素材 |
JP3221178B2 (ja) * | 1993-09-06 | 2001-10-22 | 三菱マテリアル株式会社 | 硬さ安定性のすぐれた金装飾品用高硬度伸線加工ワイヤー材 |
JP2780611B2 (ja) * | 1993-09-06 | 1998-07-30 | 三菱マテリアル株式会社 | 少量成分の合金化で硬質化した金装飾品材 |
JPH08157983A (ja) * | 1994-11-30 | 1996-06-18 | Kuwayama Kikinzoku:Kk | Au高純度の硬質Au合金製装飾部材 |
JPH09143647A (ja) * | 1995-11-20 | 1997-06-03 | Kuwayama Kikinzoku:Kk | 装飾用純金素材の時効硬化処理 |
JPH09143648A (ja) * | 1995-11-20 | 1997-06-03 | Kuwayama Kikinzoku:Kk | 装飾用純金素材の時効硬化処理 |
-
1996
- 1996-03-04 KR KR1019970707042A patent/KR19980703643A/ko not_active Ceased
- 1996-03-04 US US08/953,801 patent/US6077366A/en not_active Expired - Lifetime
- 1996-03-04 CN CN96193090A patent/CN1084795C/zh not_active Expired - Fee Related
- 1996-03-04 AT AT96904315T patent/ATE212679T1/de not_active IP Right Cessation
- 1996-03-04 ES ES96904315T patent/ES2170850T3/es not_active Expired - Lifetime
- 1996-03-04 AU AU48449/96A patent/AU717376B2/en not_active Ceased
- 1996-03-04 WO PCT/JP1996/000510 patent/WO1996031632A1/ja not_active Application Discontinuation
- 1996-03-04 DE DE69618944T patent/DE69618944T2/de not_active Expired - Fee Related
- 1996-03-04 EP EP96904315A patent/EP0819773B1/en not_active Expired - Lifetime
- 1996-03-04 BR BR9604819A patent/BR9604819A/pt not_active Application Discontinuation
-
1999
- 1999-01-25 US US09/237,213 patent/US6045635A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6045635A (en) | 2000-04-04 |
AU4844996A (en) | 1996-10-23 |
BR9604819A (pt) | 1998-06-09 |
US6077366A (en) | 2000-06-20 |
AU717376B2 (en) | 2000-03-23 |
EP0819773A1 (en) | 1998-01-21 |
DE69618944T2 (de) | 2002-10-31 |
ES2170850T3 (es) | 2002-08-16 |
WO1996031632A1 (fr) | 1996-10-10 |
EP0819773A4 (en) | 1998-11-18 |
CN1180384A (zh) | 1998-04-29 |
DE69618944D1 (de) | 2002-03-14 |
CN1084795C (zh) | 2002-05-15 |
EP0819773B1 (en) | 2002-01-30 |
ATE212679T1 (de) | 2002-02-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 19971006 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20010226 Comment text: Request for Examination of Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20030215 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20030512 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20030215 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |