KR102684845B1 - 실리카 분말, 수지 조성물 및 분산체 - Google Patents

실리카 분말, 수지 조성물 및 분산체 Download PDF

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KR102684845B1
KR102684845B1 KR1020217023323A KR20217023323A KR102684845B1 KR 102684845 B1 KR102684845 B1 KR 102684845B1 KR 1020217023323 A KR1020217023323 A KR 1020217023323A KR 20217023323 A KR20217023323 A KR 20217023323A KR 102684845 B1 KR102684845 B1 KR 102684845B1
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silica powder
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mass
particle size
silica
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KR20210130138A (ko
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게이지 사이키
마사유키 누마타
텟페이 우에노
히로오 아오키
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가부시끼가이샤 도꾸야마
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L87/00—Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Dental Preparations (AREA)
KR1020217023323A 2019-02-28 2020-02-13 실리카 분말, 수지 조성물 및 분산체 Active KR102684845B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019035109 2019-02-28
JPJP-P-2019-035109 2019-02-28
PCT/JP2020/005618 WO2020175160A1 (ja) 2019-02-28 2020-02-13 シリカ粉末、樹脂組成物および分散体

Publications (2)

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KR20210130138A KR20210130138A (ko) 2021-10-29
KR102684845B1 true KR102684845B1 (ko) 2024-07-16

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US (1) US12098076B2 (https=)
JP (1) JP7430700B2 (https=)
KR (1) KR102684845B1 (https=)
CN (1) CN113365943B (https=)
TW (1) TWI816978B (https=)
WO (1) WO2020175160A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240254313A1 (en) * 2021-05-13 2024-08-01 Denka Company Limited Silica powder in which aggregation is reduced, resin composition, and semiconductor sealing material
CN113604182B (zh) * 2021-08-16 2022-11-29 广东生益科技股份有限公司 一种树脂组合物及其应用
JP7829300B2 (ja) * 2021-10-27 2026-03-13 株式会社トクヤマ 樹脂組成物及び半導体封止剤
JP2024064289A (ja) * 2022-10-27 2024-05-14 株式会社トクヤマ 樹脂組成物、半導体封止剤、及び予測装置
WO2025022810A1 (ja) * 2023-07-25 2025-01-30 株式会社トクヤマ 光カチオン硬化性接着剤、カメラモジュールまたは車載用光センサー及びその製造方法
US20260008681A1 (en) * 2023-10-03 2026-01-08 Tokuyama Corporation Silica powder, resin composition, and dispersion thereof
JP2025089862A (ja) * 2023-12-04 2025-06-16 株式会社トクヤマ シリカ粉末、樹脂組成物、及び基板。

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018145953A1 (en) 2017-02-13 2018-08-16 Sibelco Nederland N.V. Grains comprising silica and methods of forming grains comprising silica
US20190127228A1 (en) 2017-10-27 2019-05-02 Heraeus Quarzglas Gmbh & Co. Kg Production of a porous product including post-adapting a pore structure
US20210061992A1 (en) 2018-01-31 2021-03-04 Sumitomo Chemical Company, Limited Resin composition

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JP3891740B2 (ja) * 1999-09-14 2007-03-14 電気化学工業株式会社 微細球状シリカ質粉末の製造方法
US7083770B2 (en) 2000-06-20 2006-08-01 Nippon Aerosil Co., Ltd. Amorphous, fine silica particles, and method for their production and their use
JP4789080B2 (ja) 2000-06-20 2011-10-05 日本アエロジル株式会社 非晶質微細シリカ粒子の製造方法
JP2003171117A (ja) * 2001-11-30 2003-06-17 Shin Etsu Chem Co Ltd 疎水性シリカ微粉末及びその製造方法
JP4060241B2 (ja) 2003-06-24 2008-03-12 信越化学工業株式会社 疎水性球状シリカ系微粒子、その製造方法、および、それを用いた静電荷像現像用トナー外添剤
JP4145855B2 (ja) 2004-09-29 2008-09-03 電気化学工業株式会社 球状溶融シリカ粉末の製造方法
EP1787957A1 (de) * 2005-11-16 2007-05-23 Degussa GmbH Trockene Flüssigkeiten, Verfahren und Vorrichtung zu ihrer Herstellung
JP5008460B2 (ja) 2006-06-09 2012-08-22 株式会社トクヤマ 乾式シリカ微粒子
CN104649282B (zh) 2006-06-09 2017-06-13 株式会社德山 干式二氧化硅微粒
US7985292B2 (en) 2007-11-26 2011-07-26 Evonik Degussa Corporation Precipitated silica for thickening and creating thixotropic behavior in liquid systems
JP6091301B2 (ja) 2012-06-27 2017-03-08 株式会社トクヤマ 乾式シリカ微粒子
JP6112888B2 (ja) 2013-02-05 2017-04-12 株式会社トクヤマ 乾式シリカ微粒子
JP6043992B2 (ja) 2013-04-02 2016-12-14 株式会社トクヤマ 疎水化乾式シリカ微粒子
JP2017041471A (ja) 2015-08-17 2017-02-23 信越化学工業株式会社 太陽電池セル電極の製造方法及び太陽電池セル電極作成用導電性ペースト組成物の製造方法
JP6901853B2 (ja) * 2015-12-25 2021-07-14 株式会社トクヤマ 親水性乾式シリカ粉末
KR20170119621A (ko) 2016-04-19 2017-10-27 김상철 계좌인출 관리시스템 및 관리방법
JP6878829B2 (ja) 2016-10-26 2021-06-02 東ソー株式会社 シリカ粉末及び高流動性シリカ造粒粉末並びにその製造方法
JP6778662B2 (ja) 2017-08-01 2020-11-04 信越化学工業株式会社 造粒処理シリカの製造方法
WO2021215285A1 (ja) 2020-04-24 2021-10-28 株式会社トクヤマ 表面処理シリカ粉末の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018145953A1 (en) 2017-02-13 2018-08-16 Sibelco Nederland N.V. Grains comprising silica and methods of forming grains comprising silica
US20190127228A1 (en) 2017-10-27 2019-05-02 Heraeus Quarzglas Gmbh & Co. Kg Production of a porous product including post-adapting a pore structure
US20210061992A1 (en) 2018-01-31 2021-03-04 Sumitomo Chemical Company, Limited Resin composition

Also Published As

Publication number Publication date
WO2020175160A1 (ja) 2020-09-03
CN113365943A (zh) 2021-09-07
JP7430700B2 (ja) 2024-02-13
US20220002165A1 (en) 2022-01-06
TWI816978B (zh) 2023-10-01
CN113365943B (zh) 2023-06-09
KR20210130138A (ko) 2021-10-29
JPWO2020175160A1 (https=) 2020-09-03
US12098076B2 (en) 2024-09-24
TW202035286A (zh) 2020-10-01

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