JP7430700B2 - シリカ粉末、樹脂組成物および分散体 - Google Patents

シリカ粉末、樹脂組成物および分散体 Download PDF

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JP7430700B2
JP7430700B2 JP2021501921A JP2021501921A JP7430700B2 JP 7430700 B2 JP7430700 B2 JP 7430700B2 JP 2021501921 A JP2021501921 A JP 2021501921A JP 2021501921 A JP2021501921 A JP 2021501921A JP 7430700 B2 JP7430700 B2 JP 7430700B2
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silica powder
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silica
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JPWO2020175160A1 (https=
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慶二 佐伯
昌之 沼田
哲平 上野
博男 青木
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Tokuyama Corp
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Tokuyama Corp
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L87/00—Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Dental Preparations (AREA)
JP2021501921A 2019-02-28 2020-02-13 シリカ粉末、樹脂組成物および分散体 Active JP7430700B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019035109 2019-02-28
JP2019035109 2019-02-28
PCT/JP2020/005618 WO2020175160A1 (ja) 2019-02-28 2020-02-13 シリカ粉末、樹脂組成物および分散体

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JPWO2020175160A1 JPWO2020175160A1 (https=) 2020-09-03
JP7430700B2 true JP7430700B2 (ja) 2024-02-13

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US (1) US12098076B2 (https=)
JP (1) JP7430700B2 (https=)
KR (1) KR102684845B1 (https=)
CN (1) CN113365943B (https=)
TW (1) TWI816978B (https=)
WO (1) WO2020175160A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240254313A1 (en) * 2021-05-13 2024-08-01 Denka Company Limited Silica powder in which aggregation is reduced, resin composition, and semiconductor sealing material
CN113604182B (zh) * 2021-08-16 2022-11-29 广东生益科技股份有限公司 一种树脂组合物及其应用
JP7829300B2 (ja) * 2021-10-27 2026-03-13 株式会社トクヤマ 樹脂組成物及び半導体封止剤
JP2024064289A (ja) * 2022-10-27 2024-05-14 株式会社トクヤマ 樹脂組成物、半導体封止剤、及び予測装置
WO2025022810A1 (ja) * 2023-07-25 2025-01-30 株式会社トクヤマ 光カチオン硬化性接着剤、カメラモジュールまたは車載用光センサー及びその製造方法
US20260008681A1 (en) * 2023-10-03 2026-01-08 Tokuyama Corporation Silica powder, resin composition, and dispersion thereof
JP2025089862A (ja) * 2023-12-04 2025-06-16 株式会社トクヤマ シリカ粉末、樹脂組成物、及び基板。

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089130A (ja) 1999-09-14 2001-04-03 Denki Kagaku Kogyo Kk 微細球状シリカ質粉末の製造方法
JP2002003213A (ja) 2000-06-20 2002-01-09 Nippon Aerosil Co Ltd 非晶質微細シリカ粒子とその製造方法および用途
JP2003171117A (ja) 2001-11-30 2003-06-17 Shin Etsu Chem Co Ltd 疎水性シリカ微粉末及びその製造方法
JP2005015251A (ja) 2003-06-24 2005-01-20 Shin Etsu Chem Co Ltd 疎水性球状シリカ系微粒子、その製造方法、および、それを用いた静電荷像現像用トナー外添剤
JP2008019157A (ja) 2006-06-09 2008-01-31 Tokuyama Corp 乾式シリカ微粒子
JP2017119621A (ja) 2015-12-25 2017-07-06 株式会社トクヤマ 親水性乾式シリカ粉末
WO2021215285A1 (ja) 2020-04-24 2021-10-28 株式会社トクヤマ 表面処理シリカ粉末の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7083770B2 (en) 2000-06-20 2006-08-01 Nippon Aerosil Co., Ltd. Amorphous, fine silica particles, and method for their production and their use
JP4145855B2 (ja) 2004-09-29 2008-09-03 電気化学工業株式会社 球状溶融シリカ粉末の製造方法
EP1787957A1 (de) * 2005-11-16 2007-05-23 Degussa GmbH Trockene Flüssigkeiten, Verfahren und Vorrichtung zu ihrer Herstellung
CN104649282B (zh) 2006-06-09 2017-06-13 株式会社德山 干式二氧化硅微粒
US7985292B2 (en) 2007-11-26 2011-07-26 Evonik Degussa Corporation Precipitated silica for thickening and creating thixotropic behavior in liquid systems
JP6091301B2 (ja) 2012-06-27 2017-03-08 株式会社トクヤマ 乾式シリカ微粒子
JP6112888B2 (ja) 2013-02-05 2017-04-12 株式会社トクヤマ 乾式シリカ微粒子
JP6043992B2 (ja) 2013-04-02 2016-12-14 株式会社トクヤマ 疎水化乾式シリカ微粒子
JP2017041471A (ja) 2015-08-17 2017-02-23 信越化学工業株式会社 太陽電池セル電極の製造方法及び太陽電池セル電極作成用導電性ペースト組成物の製造方法
KR20170119621A (ko) 2016-04-19 2017-10-27 김상철 계좌인출 관리시스템 및 관리방법
JP6878829B2 (ja) 2016-10-26 2021-06-02 東ソー株式会社 シリカ粉末及び高流動性シリカ造粒粉末並びにその製造方法
GB2559608A (en) * 2017-02-13 2018-08-15 Sibelco Nederland N V Grains comprising silica and methods of forming grains comprising silica
JP6778662B2 (ja) 2017-08-01 2020-11-04 信越化学工業株式会社 造粒処理シリカの製造方法
EP3476815B1 (en) * 2017-10-27 2023-11-29 Heraeus Quarzglas GmbH & Co. KG Production of a porous product including post-adapting a pore structure
KR102695568B1 (ko) * 2018-01-31 2024-08-14 스미또모 가가꾸 가부시끼가이샤 수지 조성물

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089130A (ja) 1999-09-14 2001-04-03 Denki Kagaku Kogyo Kk 微細球状シリカ質粉末の製造方法
JP2002003213A (ja) 2000-06-20 2002-01-09 Nippon Aerosil Co Ltd 非晶質微細シリカ粒子とその製造方法および用途
JP2003171117A (ja) 2001-11-30 2003-06-17 Shin Etsu Chem Co Ltd 疎水性シリカ微粉末及びその製造方法
JP2005015251A (ja) 2003-06-24 2005-01-20 Shin Etsu Chem Co Ltd 疎水性球状シリカ系微粒子、その製造方法、および、それを用いた静電荷像現像用トナー外添剤
JP2008019157A (ja) 2006-06-09 2008-01-31 Tokuyama Corp 乾式シリカ微粒子
JP2017119621A (ja) 2015-12-25 2017-07-06 株式会社トクヤマ 親水性乾式シリカ粉末
WO2021215285A1 (ja) 2020-04-24 2021-10-28 株式会社トクヤマ 表面処理シリカ粉末の製造方法

Also Published As

Publication number Publication date
WO2020175160A1 (ja) 2020-09-03
KR102684845B1 (ko) 2024-07-16
CN113365943A (zh) 2021-09-07
US20220002165A1 (en) 2022-01-06
TWI816978B (zh) 2023-10-01
CN113365943B (zh) 2023-06-09
KR20210130138A (ko) 2021-10-29
JPWO2020175160A1 (https=) 2020-09-03
US12098076B2 (en) 2024-09-24
TW202035286A (zh) 2020-10-01

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