TWI816978B - 二氧化矽粉末、樹脂組成物及分散體 - Google Patents
二氧化矽粉末、樹脂組成物及分散體 Download PDFInfo
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- TWI816978B TWI816978B TW109104986A TW109104986A TWI816978B TW I816978 B TWI816978 B TW I816978B TW 109104986 A TW109104986 A TW 109104986A TW 109104986 A TW109104986 A TW 109104986A TW I816978 B TWI816978 B TW I816978B
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- silica powder
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- mass
- particle size
- size distribution
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 231
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 111
- 239000000843 powder Substances 0.000 title claims abstract description 94
- 239000011342 resin composition Substances 0.000 title claims abstract description 22
- 239000006185 dispersion Substances 0.000 title claims description 21
- 239000002245 particle Substances 0.000 claims abstract description 56
- 238000009826 distribution Methods 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000004062 sedimentation Methods 0.000 claims abstract description 18
- 230000001186 cumulative effect Effects 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
- 239000011651 chromium Substances 0.000 claims description 8
- 150000002500 ions Chemical class 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000003809 water extraction Methods 0.000 claims description 5
- 229910001414 potassium ion Inorganic materials 0.000 claims description 4
- 229910001415 sodium ion Inorganic materials 0.000 claims description 4
- 150000003377 silicon compounds Chemical class 0.000 abstract description 17
- 239000004065 semiconductor Substances 0.000 abstract description 14
- 239000000945 filler Substances 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000002485 combustion reaction Methods 0.000 abstract description 11
- 238000001816 cooling Methods 0.000 abstract description 11
- 230000035699 permeability Effects 0.000 abstract description 9
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 8
- 239000003795 chemical substances by application Substances 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 239000001301 oxygen Substances 0.000 description 15
- 229910052760 oxygen Inorganic materials 0.000 description 15
- 239000000523 sample Substances 0.000 description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 14
- 238000012856 packing Methods 0.000 description 13
- 239000002994 raw material Substances 0.000 description 13
- 239000003507 refrigerant Substances 0.000 description 12
- 238000002835 absorbance Methods 0.000 description 9
- 238000011049 filling Methods 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 239000007900 aqueous suspension Substances 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000011362 coarse particle Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- -1 for example Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 229910021642 ultra pure water Inorganic materials 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 239000000567 combustion gas Substances 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000012496 blank sample Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- HNSDLXPSAYFUHK-UHFFFAOYSA-N 1,4-bis(2-ethylhexyl) sulfosuccinate Chemical compound CCCCC(CC)COC(=O)CC(S(O)(=O)=O)C(=O)OCC(CC)CCCC HNSDLXPSAYFUHK-UHFFFAOYSA-N 0.000 description 1
- YVHUUEPYEDOELM-UHFFFAOYSA-N 2-ethylpropanedioic acid;piperidin-1-id-2-ylmethylazanide;platinum(2+) Chemical compound [Pt+2].[NH-]CC1CCCC[N-]1.CCC(C(O)=O)C(O)=O YVHUUEPYEDOELM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L87/00—Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/51—Particles with a specific particle size distribution
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/10—Solid density
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Dental Preparations (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-035109 | 2019-02-28 | ||
| JP2019035109 | 2019-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202035286A TW202035286A (zh) | 2020-10-01 |
| TWI816978B true TWI816978B (zh) | 2023-10-01 |
Family
ID=72238905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109104986A TWI816978B (zh) | 2019-02-28 | 2020-02-17 | 二氧化矽粉末、樹脂組成物及分散體 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12098076B2 (https=) |
| JP (1) | JP7430700B2 (https=) |
| KR (1) | KR102684845B1 (https=) |
| CN (1) | CN113365943B (https=) |
| TW (1) | TWI816978B (https=) |
| WO (1) | WO2020175160A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240254313A1 (en) * | 2021-05-13 | 2024-08-01 | Denka Company Limited | Silica powder in which aggregation is reduced, resin composition, and semiconductor sealing material |
| CN113604182B (zh) * | 2021-08-16 | 2022-11-29 | 广东生益科技股份有限公司 | 一种树脂组合物及其应用 |
| JP7829300B2 (ja) * | 2021-10-27 | 2026-03-13 | 株式会社トクヤマ | 樹脂組成物及び半導体封止剤 |
| JP2024064289A (ja) * | 2022-10-27 | 2024-05-14 | 株式会社トクヤマ | 樹脂組成物、半導体封止剤、及び予測装置 |
| WO2025022810A1 (ja) * | 2023-07-25 | 2025-01-30 | 株式会社トクヤマ | 光カチオン硬化性接着剤、カメラモジュールまたは車載用光センサー及びその製造方法 |
| US20260008681A1 (en) * | 2023-10-03 | 2026-01-08 | Tokuyama Corporation | Silica powder, resin composition, and dispersion thereof |
| JP2025089862A (ja) * | 2023-12-04 | 2025-06-16 | 株式会社トクヤマ | シリカ粉末、樹脂組成物、及び基板。 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002003213A (ja) * | 2000-06-20 | 2002-01-09 | Nippon Aerosil Co Ltd | 非晶質微細シリカ粒子とその製造方法および用途 |
| TW200938485A (en) * | 2007-11-26 | 2009-09-16 | Evonik Degussa Gmbh | New precipiated silica for thickening and creating thixotropic behavior in liquid systems |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3891740B2 (ja) * | 1999-09-14 | 2007-03-14 | 電気化学工業株式会社 | 微細球状シリカ質粉末の製造方法 |
| US7083770B2 (en) | 2000-06-20 | 2006-08-01 | Nippon Aerosil Co., Ltd. | Amorphous, fine silica particles, and method for their production and their use |
| JP2003171117A (ja) * | 2001-11-30 | 2003-06-17 | Shin Etsu Chem Co Ltd | 疎水性シリカ微粉末及びその製造方法 |
| JP4060241B2 (ja) | 2003-06-24 | 2008-03-12 | 信越化学工業株式会社 | 疎水性球状シリカ系微粒子、その製造方法、および、それを用いた静電荷像現像用トナー外添剤 |
| JP4145855B2 (ja) | 2004-09-29 | 2008-09-03 | 電気化学工業株式会社 | 球状溶融シリカ粉末の製造方法 |
| EP1787957A1 (de) * | 2005-11-16 | 2007-05-23 | Degussa GmbH | Trockene Flüssigkeiten, Verfahren und Vorrichtung zu ihrer Herstellung |
| JP5008460B2 (ja) | 2006-06-09 | 2012-08-22 | 株式会社トクヤマ | 乾式シリカ微粒子 |
| CN104649282B (zh) | 2006-06-09 | 2017-06-13 | 株式会社德山 | 干式二氧化硅微粒 |
| JP6091301B2 (ja) | 2012-06-27 | 2017-03-08 | 株式会社トクヤマ | 乾式シリカ微粒子 |
| JP6112888B2 (ja) | 2013-02-05 | 2017-04-12 | 株式会社トクヤマ | 乾式シリカ微粒子 |
| JP6043992B2 (ja) | 2013-04-02 | 2016-12-14 | 株式会社トクヤマ | 疎水化乾式シリカ微粒子 |
| JP2017041471A (ja) | 2015-08-17 | 2017-02-23 | 信越化学工業株式会社 | 太陽電池セル電極の製造方法及び太陽電池セル電極作成用導電性ペースト組成物の製造方法 |
| JP6901853B2 (ja) * | 2015-12-25 | 2021-07-14 | 株式会社トクヤマ | 親水性乾式シリカ粉末 |
| KR20170119621A (ko) | 2016-04-19 | 2017-10-27 | 김상철 | 계좌인출 관리시스템 및 관리방법 |
| JP6878829B2 (ja) | 2016-10-26 | 2021-06-02 | 東ソー株式会社 | シリカ粉末及び高流動性シリカ造粒粉末並びにその製造方法 |
| GB2559608A (en) * | 2017-02-13 | 2018-08-15 | Sibelco Nederland N V | Grains comprising silica and methods of forming grains comprising silica |
| JP6778662B2 (ja) | 2017-08-01 | 2020-11-04 | 信越化学工業株式会社 | 造粒処理シリカの製造方法 |
| EP3476815B1 (en) * | 2017-10-27 | 2023-11-29 | Heraeus Quarzglas GmbH & Co. KG | Production of a porous product including post-adapting a pore structure |
| KR102695568B1 (ko) * | 2018-01-31 | 2024-08-14 | 스미또모 가가꾸 가부시끼가이샤 | 수지 조성물 |
| WO2021215285A1 (ja) | 2020-04-24 | 2021-10-28 | 株式会社トクヤマ | 表面処理シリカ粉末の製造方法 |
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2020
- 2020-02-13 JP JP2021501921A patent/JP7430700B2/ja active Active
- 2020-02-13 CN CN202080011725.4A patent/CN113365943B/zh active Active
- 2020-02-13 US US17/425,852 patent/US12098076B2/en active Active
- 2020-02-13 WO PCT/JP2020/005618 patent/WO2020175160A1/ja not_active Ceased
- 2020-02-13 KR KR1020217023323A patent/KR102684845B1/ko active Active
- 2020-02-17 TW TW109104986A patent/TWI816978B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002003213A (ja) * | 2000-06-20 | 2002-01-09 | Nippon Aerosil Co Ltd | 非晶質微細シリカ粒子とその製造方法および用途 |
| TW200938485A (en) * | 2007-11-26 | 2009-09-16 | Evonik Degussa Gmbh | New precipiated silica for thickening and creating thixotropic behavior in liquid systems |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020175160A1 (ja) | 2020-09-03 |
| KR102684845B1 (ko) | 2024-07-16 |
| CN113365943A (zh) | 2021-09-07 |
| JP7430700B2 (ja) | 2024-02-13 |
| US20220002165A1 (en) | 2022-01-06 |
| CN113365943B (zh) | 2023-06-09 |
| KR20210130138A (ko) | 2021-10-29 |
| JPWO2020175160A1 (https=) | 2020-09-03 |
| US12098076B2 (en) | 2024-09-24 |
| TW202035286A (zh) | 2020-10-01 |
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