KR102644123B1 - 열 전도성 포팅 조성물 - Google Patents

열 전도성 포팅 조성물 Download PDF

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Publication number
KR102644123B1
KR102644123B1 KR1020217012373A KR20217012373A KR102644123B1 KR 102644123 B1 KR102644123 B1 KR 102644123B1 KR 1020217012373 A KR1020217012373 A KR 1020217012373A KR 20217012373 A KR20217012373 A KR 20217012373A KR 102644123 B1 KR102644123 B1 KR 102644123B1
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South Korea
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thermally conductive
weight
conductive potting
potting composition
epoxy resin
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Korean (ko)
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KR20210084466A (ko
Inventor
황 레이
하오 우
쉐위 추
쉐 셰
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헨켈 아게 운트 코. 카게아아
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
KR1020217012373A 2018-10-29 2018-10-29 열 전도성 포팅 조성물 Active KR102644123B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/112319 WO2020087196A1 (en) 2018-10-29 2018-10-29 Thermal conductive potting composition

Publications (2)

Publication Number Publication Date
KR20210084466A KR20210084466A (ko) 2021-07-07
KR102644123B1 true KR102644123B1 (ko) 2024-03-07

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US (1) US12503586B2 (enExample)
EP (1) EP3873986B1 (enExample)
JP (3) JP2022517694A (enExample)
KR (1) KR102644123B1 (enExample)
CN (1) CN113242884B (enExample)
CA (1) CA3117241A1 (enExample)
WO (1) WO2020087196A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113242884B (zh) 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物
JP2023146870A (ja) * 2022-03-29 2023-10-12 株式会社カネカ 硬化性樹脂組成物、その硬化物、接着剤および積層体
EP4631988A1 (en) 2024-04-11 2025-10-15 Henkel AG & Co. KGaA Thermally conductive potting composition

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EP3873986A4 (en) 2022-06-22
EP3873986B1 (en) 2025-12-03
CN113242884A (zh) 2021-08-10
CN113242884B (zh) 2023-12-08
JP2023159356A (ja) 2023-10-31
CA3117241A1 (en) 2020-05-07
EP3873986A1 (en) 2021-09-08
US12503586B2 (en) 2025-12-23
KR20210084466A (ko) 2021-07-07
JP2025122035A (ja) 2025-08-20
WO2020087196A1 (en) 2020-05-07
US20210238408A1 (en) 2021-08-05
JP2022517694A (ja) 2022-03-09

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