JP2022517694A - 熱伝導性注封組成物 - Google Patents

熱伝導性注封組成物 Download PDF

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Publication number
JP2022517694A
JP2022517694A JP2021547612A JP2021547612A JP2022517694A JP 2022517694 A JP2022517694 A JP 2022517694A JP 2021547612 A JP2021547612 A JP 2021547612A JP 2021547612 A JP2021547612 A JP 2021547612A JP 2022517694 A JP2022517694 A JP 2022517694A
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JP
Japan
Prior art keywords
thermally conductive
composition
encapsulation composition
particle size
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021547612A
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English (en)
Japanese (ja)
Inventor
レイ・ホアン
ウー・ハオ
チウ・シュエユー
シエ・シュエ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of JP2022517694A publication Critical patent/JP2022517694A/ja
Priority to JP2023136348A priority Critical patent/JP2023159356A/ja
Priority to JP2025081179A priority patent/JP2025122035A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
JP2021547612A 2018-10-29 2018-10-29 熱伝導性注封組成物 Pending JP2022517694A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023136348A JP2023159356A (ja) 2018-10-29 2023-08-24 熱伝導性注封組成物
JP2025081179A JP2025122035A (ja) 2018-10-29 2025-05-14 熱伝導性注封組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/112319 WO2020087196A1 (en) 2018-10-29 2018-10-29 Thermal conductive potting composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023136348A Division JP2023159356A (ja) 2018-10-29 2023-08-24 熱伝導性注封組成物

Publications (1)

Publication Number Publication Date
JP2022517694A true JP2022517694A (ja) 2022-03-09

Family

ID=70464384

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021547612A Pending JP2022517694A (ja) 2018-10-29 2018-10-29 熱伝導性注封組成物
JP2023136348A Pending JP2023159356A (ja) 2018-10-29 2023-08-24 熱伝導性注封組成物
JP2025081179A Pending JP2025122035A (ja) 2018-10-29 2025-05-14 熱伝導性注封組成物

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023136348A Pending JP2023159356A (ja) 2018-10-29 2023-08-24 熱伝導性注封組成物
JP2025081179A Pending JP2025122035A (ja) 2018-10-29 2025-05-14 熱伝導性注封組成物

Country Status (6)

Country Link
EP (1) EP3873986B1 (enExample)
JP (3) JP2022517694A (enExample)
KR (1) KR102644123B1 (enExample)
CN (1) CN113242884B (enExample)
CA (1) CA3117241A1 (enExample)
WO (1) WO2020087196A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023146870A (ja) * 2022-03-29 2023-10-12 株式会社カネカ 硬化性樹脂組成物、その硬化物、接着剤および積層体

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4631988A1 (en) 2024-04-11 2025-10-15 Henkel AG & Co. KGaA Thermally conductive potting composition

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158450A (ja) * 2000-09-06 2002-05-31 Ngk Spark Plug Co Ltd 配線基板
JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
JP2010044998A (ja) * 2008-08-18 2010-02-25 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP2010132838A (ja) * 2008-12-08 2010-06-17 Mitsubishi Electric Corp 高熱伝導性熱硬化性樹脂組成物
CN106753143A (zh) * 2016-12-21 2017-05-31 南京诺邦新材料有限公司 一种具有导热功能的低温固化底部填充胶及其制备方法
JP2018069708A (ja) * 2016-11-04 2018-05-10 Dic株式会社 積層体、電子部材及び熱伝導性部材

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006045343A (ja) * 2004-08-04 2006-02-16 Yaskawa Electric Corp 注形用エポキシ樹脂組成物およびそれを用いた電動機用モールドコイル
US20080039555A1 (en) * 2006-08-10 2008-02-14 Michel Ruyters Thermally conductive material
WO2010103852A1 (ja) * 2009-03-12 2010-09-16 国立大学法人信州大学 熱伝導性材料及びその製造方法並びに大電流用インダクタ
CN103649160B (zh) * 2011-05-13 2016-01-13 陶氏环球技术有限责任公司 绝缘制剂
US8895148B2 (en) * 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof
JP5708666B2 (ja) * 2013-01-08 2015-04-30 日立化成株式会社 液状エポキシ樹脂組成物及び電子部品装置
WO2016130455A1 (en) * 2015-02-11 2016-08-18 Dow Global Technologies Llc Low temperature curable adhesives and use thereof
JP6655359B2 (ja) * 2015-11-09 2020-02-26 京セラ株式会社 電子・電気部品の製造方法及びエポキシ樹脂組成物
KR102716321B1 (ko) * 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
CN106753205B (zh) * 2017-01-11 2020-05-22 湖南博翔新材料有限公司 一种低粘度、高导热的环氧改性有机硅灌封胶及其应用

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158450A (ja) * 2000-09-06 2002-05-31 Ngk Spark Plug Co Ltd 配線基板
JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
JP2010044998A (ja) * 2008-08-18 2010-02-25 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP2010132838A (ja) * 2008-12-08 2010-06-17 Mitsubishi Electric Corp 高熱伝導性熱硬化性樹脂組成物
JP2018069708A (ja) * 2016-11-04 2018-05-10 Dic株式会社 積層体、電子部材及び熱伝導性部材
CN106753143A (zh) * 2016-12-21 2017-05-31 南京诺邦新材料有限公司 一种具有导热功能的低温固化底部填充胶及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023146870A (ja) * 2022-03-29 2023-10-12 株式会社カネカ 硬化性樹脂組成物、その硬化物、接着剤および積層体

Also Published As

Publication number Publication date
WO2020087196A1 (en) 2020-05-07
EP3873986A1 (en) 2021-09-08
CA3117241A1 (en) 2020-05-07
US20210238408A1 (en) 2021-08-05
CN113242884A (zh) 2021-08-10
JP2023159356A (ja) 2023-10-31
KR20210084466A (ko) 2021-07-07
JP2025122035A (ja) 2025-08-20
EP3873986B1 (en) 2025-12-03
CN113242884B (zh) 2023-12-08
EP3873986A4 (en) 2022-06-22
KR102644123B1 (ko) 2024-03-07

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