KR102542154B1 - 테스트 헤드용 접촉 프로브 - Google Patents

테스트 헤드용 접촉 프로브 Download PDF

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Publication number
KR102542154B1
KR102542154B1 KR1020227037896A KR20227037896A KR102542154B1 KR 102542154 B1 KR102542154 B1 KR 102542154B1 KR 1020227037896 A KR1020227037896 A KR 1020227037896A KR 20227037896 A KR20227037896 A KR 20227037896A KR 102542154 B1 KR102542154 B1 KR 102542154B1
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South Korea
Prior art keywords
coating layer
core
inner coating
contact
contact probe
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KR1020227037896A
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English (en)
Korean (ko)
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KR20220153661A (ko
Inventor
줴세페 크리파
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테크노프로브 에스.피.에이.
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020227037896A 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브 Active KR102542154B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
ITMI2014A002286(102014902319648) 2014-12-30
ITMI20142286 2014-12-30
PCT/EP2015/079544 WO2016107729A1 (en) 2014-12-30 2015-12-14 Contact probe for testing head
KR1020177021268A KR102502965B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177021268A Division KR102502965B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브

Publications (2)

Publication Number Publication Date
KR20220153661A KR20220153661A (ko) 2022-11-18
KR102542154B1 true KR102542154B1 (ko) 2023-06-13

Family

ID=52633392

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020227037896A Active KR102542154B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브
KR1020177021268A Active KR102502965B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020177021268A Active KR102502965B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브

Country Status (9)

Country Link
US (1) US11131690B2 (enExample)
EP (1) EP3241028B1 (enExample)
JP (1) JP6759213B2 (enExample)
KR (2) KR102542154B1 (enExample)
CN (1) CN107257928B (enExample)
PH (1) PH12017501220B1 (enExample)
SG (1) SG11201704433TA (enExample)
TW (1) TWI679425B (enExample)
WO (1) WO2016107729A1 (enExample)

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JP7005939B2 (ja) * 2017-05-25 2022-01-24 日本電産リード株式会社 コンタクトプローブ
CN109425762B (zh) * 2017-09-01 2021-05-07 中华精测科技股份有限公司 探针组件及其探针结构
CN109425814B (zh) * 2017-09-01 2021-09-10 中华精测科技股份有限公司 探针组件及其探针结构
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US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
WO2020158575A1 (ja) * 2019-01-29 2020-08-06 株式会社ヨコオ プランジャーおよびコンタクトプローブ
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KR102517778B1 (ko) * 2021-02-26 2023-04-04 (주)포인트엔지니어링 전기 전도성 접촉핀 어셈블리 및 그 제조방법
KR20230160837A (ko) 2021-03-26 2023-11-24 가부시키가이샤 요코오 프로브
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KR102577539B1 (ko) 2021-04-09 2023-09-12 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이의 제조방법
KR102321083B1 (ko) * 2021-07-21 2021-11-03 (주)새한마이크로텍 접촉 프로브
CN113507005A (zh) * 2021-08-10 2021-10-15 烟台艾睿光电科技有限公司 一种巡检机器人充电房及巡检机器人
WO2023188369A1 (ja) * 2022-03-31 2023-10-05 日本電子材料株式会社 プローブピンおよびプローブカード
CN114791517B (zh) * 2022-04-18 2025-06-03 苏州伊欧陆系统集成有限公司 一种低漏电耐高温陶瓷刀片测试探针
KR102763456B1 (ko) * 2022-05-11 2025-02-07 (주)티에스이 프로브 팁의 제조 방법 및 이에 의해 제조된 프로브 팁
TW202424495A (zh) * 2022-08-15 2024-06-16 美商微製造股份有限公司 具有解耦結構及電流乘載梁的多梁探針
EP4325227B1 (de) * 2022-08-16 2025-10-01 Heraeus Precious Metals GmbH & Co. KG Bandförmiger verbundwerkstoff für prüfnadeln
JP2024070404A (ja) * 2022-11-11 2024-05-23 株式会社日本マイクロニクス プローブおよび電気的接続装置
JP2024081055A (ja) * 2022-12-05 2024-06-17 株式会社日本マイクロニクス プローブおよび電気的接続装置
JP2024082419A (ja) * 2022-12-08 2024-06-20 株式会社日本マイクロニクス プローブ
DE102023110670B4 (de) * 2023-04-26 2025-08-21 Pac Tech - Packaging Technologies Gmbh Prüfkontakt, Vorrichtung und Verfahren zur vereinfachten Aufnahme eines Prüfkontakts durch aktive Vorausrichtung mittels elektromagnetischer Manipulation
TWI914870B (zh) * 2023-07-28 2026-02-11 旺矽科技股份有限公司 接觸探針及其接觸件、接觸件的製造方法、使用該接觸件的探針系統、未封裝半導體裝置之測試方法、經測試之半導體裝置及其製造方法
JP2025117043A (ja) * 2024-01-30 2025-08-12 株式会社日本マイクロニクス プローブおよび電気的接続装置
CN120405195B (zh) * 2025-05-09 2026-01-02 芯卓科技(浙江)有限公司 测试探针、探针卡和测试探针制造方法

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Also Published As

Publication number Publication date
PH12017501220A1 (en) 2018-01-08
KR20170107465A (ko) 2017-09-25
CN107257928A (zh) 2017-10-17
KR102502965B1 (ko) 2023-02-23
TWI679425B (zh) 2019-12-11
US20170307657A1 (en) 2017-10-26
KR20220153661A (ko) 2022-11-18
JP2018501490A (ja) 2018-01-18
JP6759213B2 (ja) 2020-09-23
PH12017501220B1 (en) 2020-11-18
WO2016107729A1 (en) 2016-07-07
US11131690B2 (en) 2021-09-28
SG11201704433TA (en) 2017-07-28
CN107257928B (zh) 2020-12-01
EP3241028B1 (en) 2020-02-05
EP3241028A1 (en) 2017-11-08
TW201629493A (zh) 2016-08-16

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