KR102430049B1 - 도전성 점착 테이프 - Google Patents

도전성 점착 테이프 Download PDF

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Publication number
KR102430049B1
KR102430049B1 KR1020197013781A KR20197013781A KR102430049B1 KR 102430049 B1 KR102430049 B1 KR 102430049B1 KR 1020197013781 A KR1020197013781 A KR 1020197013781A KR 20197013781 A KR20197013781 A KR 20197013781A KR 102430049 B1 KR102430049 B1 KR 102430049B1
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KR
South Korea
Prior art keywords
adhesive
adhesive tape
conductive
mass
shape
Prior art date
Application number
KR1020197013781A
Other languages
English (en)
Korean (ko)
Other versions
KR20190093559A (ko
Inventor
가츠아키 이마이
아키라 야마카미
Original Assignee
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20190093559A publication Critical patent/KR20190093559A/ko
Application granted granted Critical
Publication of KR102430049B1 publication Critical patent/KR102430049B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020197013781A 2016-12-12 2017-11-30 도전성 점착 테이프 KR102430049B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-240300 2016-12-12
JP2016240300 2016-12-12
PCT/JP2017/042977 WO2018110285A1 (ja) 2016-12-12 2017-11-30 導電性粘着テープ

Publications (2)

Publication Number Publication Date
KR20190093559A KR20190093559A (ko) 2019-08-09
KR102430049B1 true KR102430049B1 (ko) 2022-08-05

Family

ID=62558408

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197013781A KR102430049B1 (ko) 2016-12-12 2017-11-30 도전성 점착 테이프

Country Status (4)

Country Link
JP (1) JPWO2018110285A1 (zh)
KR (1) KR102430049B1 (zh)
CN (1) CN109996851B (zh)
WO (1) WO2018110285A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000351945A (ja) * 1999-06-09 2000-12-19 Seiwa Electric Mfg Co Ltd 導電性粘着テープ
JP2013175603A (ja) 2012-02-24 2013-09-05 Furukawa Electric Co Ltd:The 接着フィルムおよびウェハ加工用テープ
WO2015076174A1 (ja) 2013-11-20 2015-05-28 Dic株式会社 導電性粘着シート及び電子機器

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07138542A (ja) * 1993-11-17 1995-05-30 Sekisui Chem Co Ltd 建築内装材固定用両面粘着テープ
JP2004211053A (ja) * 2002-06-26 2004-07-29 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及び半導体装置
JP2005272763A (ja) * 2004-03-26 2005-10-06 J-Film Corp 貼着用粘着シート
WO2005100498A1 (ja) * 2004-04-16 2005-10-27 Riken Technos Corporation 粘着シートおよび剥離材
JP2007154144A (ja) * 2005-12-05 2007-06-21 Yoshihiro Suzuki 粘着加工シート及び粘着剤付剥離紙
JP4875357B2 (ja) 2005-12-19 2012-02-15 リンテック株式会社 両面粘着テープ
DE102006062247A1 (de) * 2006-12-22 2008-06-26 Tesa Ag Klebschicht für eine blasenfreie Verklebung
WO2010064358A1 (ja) * 2008-12-04 2010-06-10 日東電工株式会社 太陽電池モジュール用両面粘着テープ
JP5110113B2 (ja) * 2009-03-31 2012-12-26 Ｄｉｃ株式会社 放熱シート用粘着テープ及び放熱シート
DE102009046256A1 (de) * 2009-10-30 2011-05-12 Tesa Se Verfahren zum Verkleben von hitzeaktiviert verklebbaren Flächenelementen
JP5619466B2 (ja) * 2010-04-13 2014-11-05 デクセリアルズ株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム
JP2013542455A (ja) * 2010-08-18 2013-11-21 スリーエム イノベイティブ プロパティズ カンパニー 応力緩和光学接着剤を含む光学アセンブリ及びそれを作製する方法
JP5981173B2 (ja) * 2012-03-14 2016-08-31 デクセリアルズ株式会社 接続体の製造方法、接着フィルムの貼り合わせ方法、接着フィルムの引き出し方法及び接着フィルム
TWI468485B (zh) * 2012-05-21 2015-01-11 Dainippon Ink & Chemicals 黏膠帶
JP2014005319A (ja) * 2012-06-21 2014-01-16 Nitto Denko Corp 熱伝導性粘着組成物
WO2015029834A1 (ja) * 2013-08-30 2015-03-05 Dic株式会社 粘着シート、物品及び電子機器
JP6367599B2 (ja) * 2013-11-22 2018-08-01 日東電工株式会社 両面粘着シート
JP6421019B2 (ja) * 2014-04-24 2018-11-07 日東電工株式会社 積層シート
JP6330513B2 (ja) * 2014-06-26 2018-05-30 Dic株式会社 延伸剥離用両面粘着テープ及び電子機器
KR20160035704A (ko) * 2014-09-23 2016-04-01 (주)엘지하우시스 아크릴 폼 점착 테이프
WO2016093110A1 (ja) * 2014-12-08 2016-06-16 Dic株式会社 粘着シート及び電子機器
CN107001868B (zh) * 2015-01-08 2018-07-13 株式会社寺冈制作所 粘着胶带
JP2016151006A (ja) * 2015-02-19 2016-08-22 Dic株式会社 粘着シート、その製造方法及び電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000351945A (ja) * 1999-06-09 2000-12-19 Seiwa Electric Mfg Co Ltd 導電性粘着テープ
JP2013175603A (ja) 2012-02-24 2013-09-05 Furukawa Electric Co Ltd:The 接着フィルムおよびウェハ加工用テープ
WO2015076174A1 (ja) 2013-11-20 2015-05-28 Dic株式会社 導電性粘着シート及び電子機器

Also Published As

Publication number Publication date
KR20190093559A (ko) 2019-08-09
WO2018110285A1 (ja) 2018-06-21
JPWO2018110285A1 (ja) 2019-04-18
CN109996851B (zh) 2022-05-06
CN109996851A (zh) 2019-07-09

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