KR102412178B1 - 도전성 페이스트 - Google Patents

도전성 페이스트 Download PDF

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Publication number
KR102412178B1
KR102412178B1 KR1020177016142A KR20177016142A KR102412178B1 KR 102412178 B1 KR102412178 B1 KR 102412178B1 KR 1020177016142 A KR1020177016142 A KR 1020177016142A KR 20177016142 A KR20177016142 A KR 20177016142A KR 102412178 B1 KR102412178 B1 KR 102412178B1
Authority
KR
South Korea
Prior art keywords
conductive paste
electrically conductive
resin
mass
mass parts
Prior art date
Application number
KR1020177016142A
Other languages
English (en)
Korean (ko)
Other versions
KR20170107963A (ko
Inventor
다카유키 오가와
쇼코 도이
히로시 사이토
Original Assignee
하리마 카세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하리마 카세이 가부시키가이샤 filed Critical 하리마 카세이 가부시키가이샤
Publication of KR20170107963A publication Critical patent/KR20170107963A/ko
Application granted granted Critical
Publication of KR102412178B1 publication Critical patent/KR102412178B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020177016142A 2015-01-29 2016-01-25 도전성 페이스트 KR102412178B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-015347 2015-01-29
JP2015015347 2015-01-29
PCT/JP2016/051960 WO2016121668A1 (ja) 2015-01-29 2016-01-25 導電性ペースト

Publications (2)

Publication Number Publication Date
KR20170107963A KR20170107963A (ko) 2017-09-26
KR102412178B1 true KR102412178B1 (ko) 2022-06-22

Family

ID=56543281

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177016142A KR102412178B1 (ko) 2015-01-29 2016-01-25 도전성 페이스트

Country Status (5)

Country Link
JP (1) JP6777548B2 (zh)
KR (1) KR102412178B1 (zh)
CN (1) CN107004460B (zh)
TW (1) TWI676995B (zh)
WO (1) WO2016121668A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110462753A (zh) * 2017-03-30 2019-11-15 哈利玛化成株式会社 导电性糊剂
CN107740145B (zh) * 2017-10-16 2019-09-24 广东天承科技有限公司 一种pcb板用的高导电碳孔液及其制备方法和应用
JPWO2022054775A1 (zh) * 2020-09-10 2022-03-17

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000219811A (ja) * 1999-01-29 2000-08-08 Harima Chem Inc 導電性ペースト及びその製造方法
JP2012017398A (ja) 2010-07-07 2012-01-26 Nagase Chemtex Corp 導電性樹脂組成物、印刷インキ、透明電極基板及び電磁波シールド材

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2756630B2 (ja) 1992-10-05 1998-05-25 四国化成工業株式会社 エポキシ樹脂組成物
JP3232516B2 (ja) 1992-09-29 2001-11-26 タツタ電線株式会社 導電塗料
JPH08273432A (ja) * 1995-03-30 1996-10-18 Mitsui Mining & Smelting Co Ltd 導電性組成物
JPH08302312A (ja) 1995-05-08 1996-11-19 Asahi Chem Ind Co Ltd 導電性接着剤
JP3405914B2 (ja) * 1998-02-06 2003-05-12 日本特殊陶業株式会社 スルーホール充填用ペースト
JP2001316451A (ja) 2000-05-08 2001-11-13 Asahi Chem Res Lab Ltd エポキシ樹脂組成物
JP4460731B2 (ja) 2000-07-18 2010-05-12 ハリマ化成株式会社 導電性ペースト及びその調製方法
JP4726311B2 (ja) * 2001-03-01 2011-07-20 三菱鉛筆株式会社 ゲルインキ組成物の製造方法
KR101420547B1 (ko) * 2009-10-15 2014-07-17 히타치가세이가부시끼가이샤 도전성 접착제, 태양 전지 및 그 제조 방법, 그리고 태양 전지 모듈
JP2012151093A (ja) * 2010-12-28 2012-08-09 Tosoh Corp 銅含有組成物、金属銅膜の製造方法、および金属銅膜
TWI613250B (zh) * 2011-05-02 2018-02-01 蘭科智慧保護有限責任公司 環氧樹脂中之硼酸三甲酯
JP6089175B2 (ja) * 2012-06-29 2017-03-08 荒川化学工業株式会社 導電性ペーストの製造方法
CN102938269B (zh) * 2012-10-17 2015-01-07 西安工程大学 一种具有良好抗氧化性能铜电子浆料的制备方法
JP6340174B2 (ja) * 2013-07-30 2018-06-06 ハリマ化成株式会社 導電性ペースト
CN104178044B (zh) * 2014-07-28 2016-01-20 苏州赛伍应用技术有限公司 一种用于叠层母线排的绝缘胶膜及叠层母线排

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000219811A (ja) * 1999-01-29 2000-08-08 Harima Chem Inc 導電性ペースト及びその製造方法
JP2012017398A (ja) 2010-07-07 2012-01-26 Nagase Chemtex Corp 導電性樹脂組成物、印刷インキ、透明電極基板及び電磁波シールド材

Also Published As

Publication number Publication date
JPWO2016121668A1 (ja) 2017-11-09
TW201638971A (zh) 2016-11-01
TWI676995B (zh) 2019-11-11
JP6777548B2 (ja) 2020-10-28
CN107004460A (zh) 2017-08-01
CN107004460B (zh) 2021-03-23
KR20170107963A (ko) 2017-09-26
WO2016121668A1 (ja) 2016-08-04

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