KR102396892B1 - 이간 장치 및 이간 방법 - Google Patents

이간 장치 및 이간 방법 Download PDF

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Publication number
KR102396892B1
KR102396892B1 KR1020180029555A KR20180029555A KR102396892B1 KR 102396892 B1 KR102396892 B1 KR 102396892B1 KR 1020180029555 A KR1020180029555 A KR 1020180029555A KR 20180029555 A KR20180029555 A KR 20180029555A KR 102396892 B1 KR102396892 B1 KR 102396892B1
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KR
South Korea
Prior art keywords
adhesive sheet
separation
holding
holding means
adherends
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KR1020180029555A
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English (en)
Korean (ko)
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KR20180130430A (ko
Inventor
기미히코 가와사키
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20180130430A publication Critical patent/KR20180130430A/ko
Application granted granted Critical
Publication of KR102396892B1 publication Critical patent/KR102396892B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
KR1020180029555A 2017-05-29 2018-03-14 이간 장치 및 이간 방법 KR102396892B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017105801A JP6848151B2 (ja) 2017-05-29 2017-05-29 離間装置および離間方法
JPJP-P-2017-105801 2017-05-29

Publications (2)

Publication Number Publication Date
KR20180130430A KR20180130430A (ko) 2018-12-07
KR102396892B1 true KR102396892B1 (ko) 2022-05-11

Family

ID=64449087

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180029555A KR102396892B1 (ko) 2017-05-29 2018-03-14 이간 장치 및 이간 방법

Country Status (4)

Country Link
JP (1) JP6848151B2 (ja)
KR (1) KR102396892B1 (ja)
CN (1) CN108933094B (ja)
TW (1) TWI739997B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7408455B2 (ja) * 2020-03-25 2024-01-05 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001225986A (ja) 2000-02-16 2001-08-21 Ricoh Co Ltd シート材保持装置
JP2009140947A (ja) 2007-12-03 2009-06-25 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2011210858A (ja) 2010-03-29 2011-10-20 Lintec Corp エキスパンド装置およびエキスパンド方法
JP2016178244A (ja) 2015-03-20 2016-10-06 リンテック株式会社 シート剥離装置および剥離方法、並びに、シート転写装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0720521A4 (en) * 1994-07-20 1996-12-18 Loomis Ind Inc DEVICE AND METHOD FOR CUTTING SEMICONDUCTOR DISC
JP5133660B2 (ja) * 2007-11-27 2013-01-30 株式会社ディスコ ウエーハの裏面に装着された接着フィルムの破断方法
JP5085452B2 (ja) * 2008-07-29 2012-11-28 株式会社ディスコ テープ拡張装置
CN101740350A (zh) * 2009-12-11 2010-06-16 广东工业大学 一种ic封装的扩晶装置
JP5980600B2 (ja) * 2012-07-12 2016-08-31 株式会社ディスコ テープ拡張装置
JP6059921B2 (ja) * 2012-08-31 2017-01-11 日東電工株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP2014067873A (ja) * 2012-09-26 2014-04-17 Nitto Denko Corp 保護テープ剥離方法および保護テープ剥離装置
JP6180120B2 (ja) * 2013-01-24 2017-08-16 株式会社ディスコ 拡張装置および拡張方法
JP6103217B2 (ja) 2013-05-30 2017-03-29 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP6408366B2 (ja) * 2014-12-05 2018-10-17 リンテック株式会社 離間装置および離間方法
JP3196099U (ja) * 2014-12-08 2015-02-19 リンテック株式会社 離間装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001225986A (ja) 2000-02-16 2001-08-21 Ricoh Co Ltd シート材保持装置
JP2009140947A (ja) 2007-12-03 2009-06-25 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2011210858A (ja) 2010-03-29 2011-10-20 Lintec Corp エキスパンド装置およびエキスパンド方法
JP2016178244A (ja) 2015-03-20 2016-10-06 リンテック株式会社 シート剥離装置および剥離方法、並びに、シート転写装置

Also Published As

Publication number Publication date
JP6848151B2 (ja) 2021-03-24
KR20180130430A (ko) 2018-12-07
TWI739997B (zh) 2021-09-21
JP2018200986A (ja) 2018-12-20
TW201901766A (zh) 2019-01-01
CN108933094B (zh) 2023-03-28
CN108933094A (zh) 2018-12-04

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