KR102239644B1 - 가고정용 수지 필름 - Google Patents

가고정용 수지 필름 Download PDF

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Publication number
KR102239644B1
KR102239644B1 KR1020187030733A KR20187030733A KR102239644B1 KR 102239644 B1 KR102239644 B1 KR 102239644B1 KR 1020187030733 A KR1020187030733 A KR 1020187030733A KR 20187030733 A KR20187030733 A KR 20187030733A KR 102239644 B1 KR102239644 B1 KR 102239644B1
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KR
South Korea
Prior art keywords
layer
temporary fixing
electronic component
resin
resin film
Prior art date
Application number
KR1020187030733A
Other languages
English (en)
Korean (ko)
Other versions
KR20180122460A (ko
Inventor
케이코 우에노
타카히로 토쿠야스
야스유키 오오야마
유시 야마구치
타쿠지 이케야
마사히로 마츠나가
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
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Publication of KR20180122460A publication Critical patent/KR20180122460A/ko
Application granted granted Critical
Publication of KR102239644B1 publication Critical patent/KR102239644B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020187030733A 2016-05-02 2017-04-28 가고정용 수지 필름 KR102239644B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-092662 2016-05-02
JP2016092662 2016-05-02
PCT/JP2017/016978 WO2017191815A1 (ja) 2016-05-02 2017-04-28 仮固定用樹脂フィルム

Publications (2)

Publication Number Publication Date
KR20180122460A KR20180122460A (ko) 2018-11-12
KR102239644B1 true KR102239644B1 (ko) 2021-04-12

Family

ID=60202972

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187030733A KR102239644B1 (ko) 2016-05-02 2017-04-28 가고정용 수지 필름

Country Status (4)

Country Link
JP (2) JP6926070B2 (ja)
KR (1) KR102239644B1 (ja)
TW (1) TWI720190B (ja)
WO (1) WO2017191815A1 (ja)

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* Cited by examiner, † Cited by third party
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JP6927866B2 (ja) * 2017-11-30 2021-09-01 日本カーバイド工業株式会社 保護フィルム用粘着剤組成物及び保護フィルム
JP7147163B2 (ja) * 2017-12-21 2022-10-05 昭和電工マテリアルズ株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート、及び半導体装置の製造方法
US20220059388A1 (en) * 2018-12-20 2022-02-24 Showa Denko Materials Co., Ltd. Resin composition for temporary fixing use, resin film for temporary fixing use, sheet for temporary fixing use, and method for manufacturing semiconductor device
JP7221046B2 (ja) * 2018-12-26 2023-02-13 東京応化工業株式会社 接着剤組成物、積層体、積層体の製造方法、及び電子部品の製造方法
US11767453B2 (en) * 2018-12-31 2023-09-26 Samsung Sdi Co., Ltd. Silicone-based adhesive protective film and optical member comprising the same
JP7454922B2 (ja) * 2019-07-11 2024-03-25 信越化学工業株式会社 基板加工用仮接着材料及び積層体の製造方法
JP7392730B2 (ja) * 2019-10-31 2023-12-06 株式会社レゾナック 仮固定用樹脂組成物、基板搬送用サポートテープ及び電子機器装置の製造方法
JP7409029B2 (ja) * 2019-11-15 2024-01-09 株式会社レゾナック 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法
US20230002647A1 (en) * 2019-12-02 2023-01-05 Shin-Etsu Chemical Co., Ltd. Wafer processing temporary adhesive, wafer laminate, thin wafer manufacturing method
JP2021129061A (ja) * 2020-02-17 2021-09-02 力成科技股▲分▼有限公司 半導体製造装置および製造方法
EP4144808A4 (en) 2020-04-30 2024-06-05 Shinetsu Chemical Co TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE AND METHOD FOR PRODUCING THIN WAFER
JP2023101236A (ja) * 2022-01-07 2023-07-20 株式会社レゾナック 仮固定材形成用樹脂組成物、仮固定材、基板搬送用サポートテープ及び電子機器装置の製造方法
WO2023234155A1 (ja) * 2022-06-02 2023-12-07 日産化学株式会社 光照射剥離用の接着剤組成物、積層体、及び加工された半導体基板の製造方法

Citations (1)

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JP2015135898A (ja) * 2014-01-17 2015-07-27 日立化成株式会社 研削された基材の製造方法、並びにこれに用いられるフィルム状粘着剤及び積層体

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JP4565804B2 (ja) 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
JP2005019759A (ja) * 2003-06-27 2005-01-20 Mitsui Chemicals Inc 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法
JP2010238852A (ja) * 2009-03-31 2010-10-21 Mitsui Chemicals Inc 半導体製造用テープおよび半導体装置の製造方法
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Also Published As

Publication number Publication date
TWI720190B (zh) 2021-03-01
JP2020161823A (ja) 2020-10-01
JP6958674B2 (ja) 2021-11-02
JPWO2017191815A1 (ja) 2018-11-08
KR20180122460A (ko) 2018-11-12
JP6926070B2 (ja) 2021-08-25
TW201806768A (zh) 2018-03-01
WO2017191815A1 (ja) 2017-11-09

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